IEC TR 62899-304-2:2026

IEC TR 62899-304-2 ®
Edition 1.0 2026-09
TECHNICAL
REPORT
Printed electronics -
Part 304-2: Equipment - Sintering - Temperature measurement method for
thermal treatment system
ICS 19.080; 37.100.10 ISBN 978-2-8327-1508-6

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CONTENTS
CONTENTS . 1
FOREWORD . 2
INTRODUCTION . 4
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Issues of temperature measurement for thermal treatment . 5
4.1 General . 5
4.2 Equipment for thermal treatment . 5
4.3 Inks . 6
5 Examples of measurement . 7
5.1 General . 7
5.2 Thermocouples . 7
5.3 Resistance temperature detectors . 8
5.4 Temperature label . 9
5.5 Laser . 9
5.6 IR camera . 10
5.7 Summary of the measurement methods . 10
6 Items that are important for reproduction of the conductive layer . 10
Bibliography . 11

Figure 1 – Example of temperature distribution in the convection oven set at 100 °C
(according to JIS C 60068-3-5 [5]) . 6
Figure 2 – Example of temperature distribution in the cross-section of the tube furnace
(1 in diameter) set at 900 °C [6] . 6
Figure 3 – Relationship between sintering temperature and resistivity of each ink. 7
Figure 4 – Example of ink printed directly on a thermocouple . 8
Figure 5 – Example of fixing a temperature sensor with polyimide tape . 8
Figure 6 – Example of fixing a temperature sensor with eyelet and bolt . 8
Figure 7 – T-SMILS L15570 series manufactured by Hamamatsu Photonics K.K. . 9

Table 1 – Measurement methods and their sources of error . 10

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Printed electronics -
Part 304-2: Equipment - Sintering -
Temperature measurement method for thermal treatment system

FOREWORD
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IEC TR 62899-304-2 has been prepared by IEC technical committee 119: Printed Electronics.
It is a Technical Report.
The text of this Technical Report is based on the following documents:
Draft Report on voting
119/578/DTR 119/595/RVDTR
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Technical Report is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
– reconfirmed,
– withdrawn, or
– revised.
INTRODUCTION
Printed electronics (PE) has made significant progress, and its market has expanded
considerably. It has numerous applications, including electrical and electronic products, textiles,
and healthcare. In particular, conductive ink has the widest range of applications.
The functionality of conductive ink depends on the quality of the conductive layer that is formed
by thermal treatment after printing the desired pattern. The thermal treatment process greatly
influences the properties of the conductive layer. For example, uneven heating can lead to
problems such as uneven conductivity, substrate distortion, and peeling of the conductive layer
from the substra
...