IEC TR 62899-304-1:2023

IEC TR 62899-304-1 ®
Edition 1.0 2023-12
TECHNICAL
REPORT
colour
inside
Printed electronics –
Part 304-1: Equipment – Sintering – Temperature measurement method for
photonic sintering system
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IEC TR 62899-304-1 ®
Edition 1.0 2023-12
TECHNICAL
REPORT
colour
inside
Printed electronics –
Part 304-1: Equipment – Sintering – Temperature measurement method for

photonic sintering system
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 19.080; 37.100.10 ISBN 978-2-8322-7885-7

– 2 – IEC TR 62899-304-1:2023 © IEC 2023
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Temperature measurement methods . 7
4.1 Infrared camera test . 7
4.1.1 General . 7
4.1.2 Test apparatus . 9
4.2 Thermocouple test . 9
4.2.1 General . 9
4.2.2 Test apparatus . 10
4.3 Pyrometer test . 11
4.3.1 General . 11
4.3.2 Test apparatus . 11
Bibliography . 15

Figure 1 – Schematic diagrams of IR camera . 8
Figure 2 – Schematic diagrams of IR camera spatial resolution . 8
Figure 3 – Schematic diagrams of an apparatus for surface temperature measurement
using (a) an IR camera and (b) temperature change for nanoparticle size during
photonic sintering . 9
Figure 4 – Schematic of thermocouple measurement configuration with K-type
thermocouple (chromel-alumel) . 10
Figure 5 – Schematic diagram of an apparatus for surface temperature measurement
using a K-type thermocouple . 10
Figure 6 – Optical resolution of the pyrometer . 11
Figure 7 – Radiation pyrometer using one window and one aperture . 12
Figure 8 – Radiation pyrometer using one window and two apertures . 13
Figure 9 – Radiation pyrometer using one lens and two apertures . 13
Figure 10 – Schematic diagrams of setup for surface temperature measurement using
(a) a pyrometer and (b) combined temperature and resistance measurement results . 14

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 304-1: Equipment – Sintering – Temperature measurement method
for photonic sintering system
FOREWORD
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IEC TR 62899-304-1 has been prepared by IEC technical committee 119: Printed Electronics.
It is a Technical Report.
The text of this Technical Report is based on the following documents:
Draft Report on voting
119/451/DTR 119/463/RVDTR
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this Technical Report is English.

– 4 – IEC TR 62899-304-1:2023 © IEC 2023
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 62899 series, published under the general title Printed electronics,
can be found on the IEC website.
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stability date indicated on the IEC website under webstore.iec.ch in the data related to the
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• reconfirmed,
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• revised.
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INTRODUCTION
The purpose of this document is to describe temperature measurement methods for the
photonic sintering system. In the printed electronics industry, metallic nano particles (NPs) such
as gold (Au), platinum (Pt), silver (Ag) and copper (Cu) are used as the type of ink or paste to
print the desired patterns on paper or polymeric film for a wide range of applications, including
printed sensors, organic solar cells, printed batteries, signage, lighting and wearable devices.
Additionally, various organic and inorganic inks are used, including etch resist ink, photo solder
resist ink, conductive polymer ink, and quantum dot ink. The photonic sintering system is used
to heat the printed inks to show a better electrical performance such as electric conductivity,
hole mobility in semiconductors, etc. whose standard test methods are shown in IEC 62899-
202 and IEC 62899-203.
Among the sintering techniques, the photonic sintering technique is attracting much attention
as the most promising alternative sintering technique to replace conventional thermal sintering,
in terms of short processing times for low temperature. The advantage of a low temperature in
the printed electronics application is that there is less structural degradation of the substrate
because the printing process and post sintering process are performed at the low temperature
on flexible substrates like paper or polymer.
The photonic sintering system is heating equipment with one or more flash lamps, and the
surface temperature of the substrate with the printed patterns and films inside the photonic
sintering system is one of the major performance data. The flash lamp emits radiation with the
wavelengths between UV and IR with highest intensity in the visible range. An intense pulse of
radiation with a duration shorter than the thermal equilibration time of the printed inks and
substrate heats the printed inks quickly enough to sinter before they transfer much energy to
the substrate. The process parameter for the photonic sintering is electrical pulse energies, the
pulse duration, a flash frequency and the distance between the flash lamp and the substrate.
Due to its radiative heating mechanism, the process temperature measurement method inside
the photonic sintering system is ambiguous because the sintering temperature is induced
...