Medical electrical equipment - Part 4-6: Guidance and interpretation - Voluntary guidance to help achieve basic safety and essential performance with regard to the possible effects of electromagnetic disturbances

IEC TS 60601-4-6:2024 provides practical methods to help achieve basic safety and essential performance with regard to the possible effects of em disturbances throughout the expected service life of me equipment or an me system.
These practical methods attempt to address all of the different types of errors, malfunctions or failures that can be caused by em disturbances in me equipment or me systems.
The purpose of this document is to provide recommendations for the techniques and measures used in the design, verification, and validation of systems, hardware, software, and firmware used in me equipment or me systems to help achieve basic safety and essential performance with regard to the em disturbances that could occur throughout the expected service life.

General Information

Status
Published
Publication Date
22-Apr-2024
Current Stage
PPUB - Publication issued
Start Date
17-May-2024
Completion Date
23-Apr-2024
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Technical specification
IEC TS 60601-4-6:2024 - Medical electrical equipment - Part 4-6: Guidance and interpretation - Voluntary guidance to help achieve basic safety and essential performance with regard to the possible effects of electromagnetic disturbances Released:4/23/2024 Isbn:9782832288092
English language
126 pages
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IEC TS 60601-4-6 ®
Edition 1.0 2024-04
TECHNICAL
SPECIFICATION
Medical electrical equipment –
Part 4-6: Guidance and interpretation – Voluntary guidance to help achieve basic
safety and essential performance with regard to the possible effects of
electromagnetic disturbances
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IEC TS 60601-4-6 ®
Edition 1.0 2024-04
TECHNICAL
SPECIFICATION
Medical electrical equipment –

Part 4-6: Guidance and interpretation – Voluntary guidance to help achieve

basic safety and essential performance with regard to the possible effects of

electromagnetic disturbances
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 11.040.01; 33.100.20 ISBN 978-2-8322-8809-2

– 2 – IEC TS 60601-4-6:2024 © IEC 2024
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviated terms . 8
3.1 Terms and definitions. 8
3.2 Abbreviated terms . 9
4 How to use this document . 9
5 General . 10
5.1 Mitigation of effects caused by EM DISTURBANCES . 10
5.2 Implementing well-proven techniques and measures for mitigating the
effects that can be caused by EM DISTURBANCES . 10
5.2.1 General principles . 10
5.2.2 Choosing design techniques and measures from Annex A . 10
5.3 Documenting the well-proven techniques and measures used for mitigating
the effects that can be caused by EM DISTURBANCES . 13
5.3.1 ME EQUIPMENT or ME SYSTEM . 13
5.3.2 Non-ME EQUIPMENT . 14
Annex A (informative) Detailed guidance on the techniques and measures for
mitigating the effects that can be caused by EM DISTURBANCES . 15
A.1 Techniques and measures that might be helpful in project management,
planning and specification . 15
A.1.1 Techniques and measures for project management and planning . 15
A.1.2 Techniques and measures for use when creating a design specification . 15
A.1.3 Specifying EMC test standards to help ensure availability . 16
A.1.4 Protecting against high impact, unusual and malicious EM DISTURBANCES . 19
A.2 Techniques and measures that might be helpful in system design . 20
A.2.1 General . 20
A.2.2 Separating system parts necessary for achieving BASIC SAFETY or
ESSENTIAL PERFORMANCE from system parts that are not important for
BASIC SAFETY or ESSENTIAL PERFORMANCE . 20
A.2.3 Recording how the design specifications are achieved through design
choices . 21
A.2.4 Co-design electromagnetically diverse hardware/software in redundant
channels . 21
A.2.5 System integration, installation, and commissioning . 24
A.2.6 Fault detection and event data recording for later diagnosis . 25
A.2.7 Improving mitigation of the effects that can be caused by EM
DISTURBANCES in communication links . 26
A.2.8 Synchronization and resynchronization techniques . 28
A.2.9 Protection from persistent interference by monitoring retry counts . 28
A.2.10 Independent detection of EM DISTURBANCES and/or EMI . 29
A.2.11 Protection of systems from tampering via communication links to
external systems . 30
A.2.12 Robust, high-specification electromagnetic mitigation . 31
A.2.13 Techniques and measures to prevent RISKS being increased by
virtualization of memory and PROCESS resources (e.g. a "digital twin") . 31
A.2.14 Usability Engineering (Human Factors) . 32
A.3 Techniques and measures that might be helpful in operational design . 32

A.3.1 General . 32
A.3.2 Developing appropriate operation and maintenance instructions . 33
A.3.3 Designing appropriate maintenance techniques . 33
A.3.4 Limiting the possibilities for operation and hence mis-operation . 34
A.3.5 Protecting against operation errors . 34
A.3.6 Protecting against hardware or software modifications or manipulations . 35
A.3.7 Defensive programming techniques . 35
A.3.8 Limited use of interrupts . 38
A.3.9 Limited use of memory address pointer variables . 39
A.3.10 Avoiding recursion . 39
A.3.11 Error detection and correction for invariable memory . 40
A.3.12 Error detection and correction techniques in redundant designs . 41
A.3.13 Time-based error detection/correction in buses and interfaces . 42
A.3.14 Error detection and correction for variable memory . 43
A.3.15 Error detecting/correcting coding for ROM, RAM, buses, and interfaces . 45
A.3.16 Error detection and correction for logic and data processing . 45
A.3.17 Error detection and correction for electrical and electromechanical

components . 47
A.3.18 Caution when using hardware or software libraries . 48
A.3.19 Error detection and correction for electronic components . 48
A.3.20 Error detection/correction by monitoring program sequence (i.e.
watchdogs) . 51
A.3.21 Error detection and correction using multi-channel input/output

interfaces . 53
A.3.22 Using test patterns: static and dynamic. 53
A.3.23 Using fiber-optic cables for signals and data communications . 54
A.3.24 Techniques and measures for AC and DC power supplies/power
converters . 54
A.3.25 Monitoring of ventilation, cooling, and heating . 56
A.3.26 Careful use of wireless (radio) data communications . 57
A.3.27 Good electromagnetic engineering at every level of design . 58
A.3.28 Design to comply with EMC test specifications as set out in A.1.3 and
A.1.4 . 58
A.3.29 De-rating of hardware components, where appropriate . 59
A.3.30 Improve robustness of interrupts. 59
A.4 Techniques and measures that might be helpful in implementation,
integration, installation, and commissioning . 60
A.4.1 Providing information on constraints and additional measures . 60
A.4.2 Procuring materials, components, and products . 61
A.4.3 Assemble/integrate according to the design for adequate mitigation of
the effects that can be caused by EM DISTURBANCES . 62
A.4.4 Install/commission according to the design for achieving adequate
mitigation of the effects that can be caused by EM DISTURBANCES . 62
A.5 Techniques and measures that might be helpful in VERIFICATION and
validation (including testing) . 62
A.5.1 Applying VERIFICATION and/or validation techniques and measures . 62
A.5.2 VERIFICATION testing to the EMC test plan from A.1.3 and A.1.4 . 64
A.5.3 Using non-standardized ad hoc checks or tests . 65
A.5.4 Verifying correct installation and commissioning . 66
A.5.5 EMC tests before and after accelerated life tests . 67

– 4 – IEC TS 60601-4-6:2024 © IEC 2024
A.6 Techniques and measures that might be helpful in operation, maintenance,
repair, overhaul, refurbishment, and upgrade . 67
A.6.1 Assessment of changes in the ELECTROMAGNETIC ENVIRONMENT . 67
A.6.2 Assessment of continuing correct installation . 68
A.6.3 Maintaining adequate mitigation of the effects that can be caused by EM
, despite modifications or changes . 69
DISTURBANCES
A.6.4 Batch (lot) traceability . 70
A.6.5 Component changes, new supplier, dual / alternate source . 70
A.7 Techniques and measures that might be helpful in decommissioning . 71
A.8 Integrating third-party items into ME EQUIPMENT or ME SYSTEMS . 71
A.8.1 The general iterative approach . 71
A.8.2 Suppliers' certifications and electromagnetic assessments . 73
A.8.3 Custom-manufactured component parts . 73
...

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