IEC 60286-4:2013

IEC 60286-4 ®
Edition 3.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –
Part 4: Stick magazines for electronic components encapsulated in packages of
different forms
Emballage des composants pour opérations automatisées –
Partie 4: Magasins chargeurs pour composants électroniques encapsulés dans
des boîtiers de différentes formes

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IEC 60286-4 ®
Edition 3.0 2013-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Packaging of components for automatic handling –

Part 4: Stick magazines for electronic components encapsulated in packages of

different forms
Emballage des composants pour opérations automatisées –

Partie 4: Magasins chargeurs pour composants électroniques encapsulés dans

des boîtiers de différentes formes

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX P
ICS 31.020; 31.240 ISBN 978-2-8322-0947-9

– 2 – 60286-4  IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions and conventions . 5
3.1 Terms and definitions . 5
3.2 Conventions . 5
4 Shape and cross-section of stick magazine . 6
5 Dimensions of stick magazines . 7
5.1 General . 7
5.2 Materials . 8
5.3 Recycling . 8
6 Mechanical stability . 8
7 End stoppers and spacers . 9
8 Orientation of the components in the stick magazine . 9
9 Marking . 9
Annex A (informative) DIL packages for through-hole mount . 10
Annex B (informative) SO packages for surface mounting . 12
Annex C (informative) Leaded chip carrier packages (PLCC) for surface mounting . 13
Annex D (normative) Rule for the orientation of integrated circuit packages in handling and
shipping carriers such as stick magazines and rails (from IEC 60191-3:1999, Annex G) . 14
Bibliography . 16

Figure 1 – Shape and cross-sections of stick magazines . 6
Figure 2 – Schematic of stick magazine design and schematic of package profile . 7
Figure A.1 – DIL packages for through-hole mounting . 10
Figure B.1 – SO packages for surface mounting . 12
Figure C.1 – Leaded chip carrier packages (PLCC) for surface mounting . 13
Figure D.1 – Five examples of the terminal No. 1 marking locations . 15

Table 1 – Tolerances to the package profile dimensions . 7
Table 2 – Principle of stick magazine requirements . 8
Table 3 – Material reference for magazines and stoppers . 8
Table A.1 – e = 3 modules e . 10
Table A.2 – e = 4 modules e . 11
Table A.3 – e = 6 modules e . 11
Table B.1 – Stick magazine dimensions for SO packages . 12
Table C.1 – Stick magazine dimensions for PLCC packages . 13

60286-4  IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –

Part 4: Stick magazines for electronic components encapsulated
in packages of different forms

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
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indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60286-4 has been prepared by IEC technical committee 40:
Capacitors and resistors for electronic equipment.
This third edition cancels and replaces the second edition published in 1997 and constitutes a
technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
– Clause 4 describes the guidelines for customer specific stick magazine design. It replaces
the magazine design rules for IEC outlined components and rules for orientation of
components in stick magazines which have been moved to Annexes A to D.

– 4 – 60286-4  IEC:2013
The text of this standard is based on the following documents:
FDIS Report on voting
40/2230/FDIS 40/2241/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60286 series, published under the general title Packaging of
components for automatic handling, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web si
...