IEC 60352-5:2020

IEC 60352-5 ®
Edition 5.0 2020-07
INTERNATIONAL
STANDARD
Solderless connections –
Part 5: Press-in connections – General requirements, test methods and practical
guidance
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IEC 60352-5 ®
Edition 5.0 2020-07
INTERNATIONAL
STANDARD
Solderless connections –
Part 5: Press-in connections – General requirements, test methods and practical

guidance
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.220.10 ISBN 978-2-8322-8476-6

– 2 – IEC 60352-5:2020 © IEC 2020
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Requirements . 10
4.1 General . 10
4.2 Tools . 10
4.2.1 General . 10
4.2.2 Tools evaluation . 10
4.3 Press-in terminations . 10
4.3.1 Materials . 10
4.3.2 Dimensions of the press-in zone . 10
4.3.3 Surface finishes . 10
4.4 Test boards . 11
4.4.1 General . 11
4.4.2 Materials . 11
4.4.3 Thickness of test boards . 11
4.4.4 Hole. 11
4.4.5 Plated-through hole . 12
4.5 Press-in connections . 13
4.6 Manufacturer´s specification . 14
5 Tests . 15
5.1 General remarks . 15
5.1.1 General . 15
5.1.2 Standard conditions for testing . 15
5.1.3 Mounting of specimens . 15
5.2 Test and measuring methods . 16
5.2.1 General examination . 16
5.2.2 Mechanical tests . 16
5.2.3 Contact resistance measurements . 19
5.2.4 Climatic tests . 20
5.3 Test schedules . 21
5.3.1 General . 21
5.3.2 Qualification test schedule . 21
5.3.3 Flow chart . 23
5.3.4 Application test schedule . 24
5.4 Test report . 25
5.4.1 Qualification test report . 25
5.4.2 Application test report . 26
Annex A (informative) Practical guidance . 27
A.1 General . 27
A.2 Current-carrying capacity . 27
A.3 Tool information . 27
A.3.1 Termination insertion tool . 27
A.3.2 Support block . 27

A.3.3 Termination removal tool . 28
A.4 Information to press-in termination and press-in connections . 28
A.4.1 General . 28
A.4.2 Design features . 28
A.4.3 Materials and surface finishes . 29
A.4.4 Press-in terminations with connector contact elements . 29
A.5 Printed board information . 29
A.5.1 General . 29
A.5.2 Plated-through hole . 30
A.5.3 Dimensioning of the hole . 30
A.5.4 Manufacturing of the hole, example with drilling for FR4 . 31
A.5.5 Manufacturing of the hole with materials other than FR4 . 31
A.6 Press-in connection information . 31
A.6.1 General . 31
A.6.2 Press-in connection . 31
A.6.3 Repair of press-in connections . 32
A.6.4 Combination of press-in connections and soldered connections . 33
A.6.5 Bimetallic electrolytic corrosion effects . 33
Bibliography . 34

Figure 1 – Guide for hole ranges in a test board . 12
Figure 2 – Plated-through hole . 13
Figure 3 – Location and example of the transversal microsection for measuring the
copper thickness . 13
Figure 4 – Test arrangement – push-out force. 17
Figure 5 – Transverse section of a press-in connection . 18
Figure 6 – Longitudinal section of a press-in connection . 19
Figure 7 – Test arrangement for contact resistance . 20
Figure 8 – Qualification test schedule . 24
Figure A.1 – Conceptual composition of a four-layer printed circuit board . 30
Figure A.2 – Example of a termination removal tool . 33

Table 1 – Plated-through hole requirements for test printed boards . 12
Table 2 – Vibration, preferred test severities . 18
Table 3 – Qualification test schedule – Test group AP . 22
Table 4 – Qualification test schedule – Test group BP . 22
Table 5 – Qualification test schedule – Test group CP . 23
Table 6 – Application test schedule – Test group DP . 25
Table A.1 – Example for dimensioning the printed circuit board hole . 31

– 4 – IEC 60352-5:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections – General requirements,
test methods and practical guidance

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
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Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60352-5 has been prepared by subcommittee 48B: Electrical
connectors, of IEC technical committee 48: Electrical connectors and mechanical structures
for electrical and electronic equipment.
This fifth edition cancels and replaces the fourth edition published in 2012. This edition
constitutes a technical revision.
This edition includes the following significant changes with respect to the previous edition:
a) revising the scope by removing the wording "… telecommunication equipment and in
electronic devices employing similar techniques" and replacing it by "… electrical and
electronic equipment and components" in the first paragraph;
b) adding terms and definitions for 'board', 'hole' and 'metal board' to recognize that press-in
terminations are being used in many non-printed board materials;

c) editorial changes to clarify the difference between the two test schedules for qualification
and application;
d) modification of upper limit of copper thickness of the plated-through-hole to reflect actual
market trends and manufacturing practices;
e) removal of bending test, as this test is very specific for applications of press-in technology
no longer common;
f) adding graphs to document the press-in and push-out force, since this is common testing
practice and provides further insight into mechanical performance of the contact zone;
g) reducing the number of test specimens required, since in previous testing scheme a lot of
test samples were discarded;
h) new wording in 4.5 for cracked and bent terminations;
i) added Figure 7b to show V and A connection locations when the press-in termination does
not protrude through the bottom side of the board.
The text of this International Standard is based on the following documents:
FDIS Report on voting
48B/2810/FDIS 48B/2822/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60352 series, published under the general title Solderless
connections, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 60352-5:2020 © IEC 2020
INTRODUCTION
This part of IEC 60352 includes requirements and relevant tests (normative) as well as a
practical guidance in Annex A (informative) for press-in connections.
Two test schedules are provided.
a) The qualification test schedule applies to individual press-in connections to demonstrate
the suitability of the press-in zone.
These press-in connections are tested to the specification provided by the manufacturer of
the press-in termination (see 4.6) taking into account the requirements of Clause 4.
The qualification is independent of the application of the press-in zone in a component.
b) The application test schedule applies to press-in connections which are part of a
component and are already qualified to the qualification test schedule.
Test sequences focus on the performance of the press-in connection which is affected by
the implementation in a component.
The requirements and tests apply to all elements involved in the manufacturing of a press-in
connection:
• the press-in termination, which may be part of a component (e.g. a multi-pole connector);
• the board, printed board or MID (moulded interconnect device) - (plated-through holes
dimensions) for which the termination is suitable;
• the tool(s) required to produce the press-in connection.
As the manufacturer of the press-in termination has to provide the main part of the information
needed for qualification, the word "manufacturer" is used throughout this document for
simplicity to indicate the manufacturer of the press-in termination. The manufacturers of the
other items playing a role in the qualification of press-in connections are specified, if needed,
as the board manufacturer or the tool(s) manufacturer.
The practical guidance in Annex A (informative) serves as a guide for the workmanship
required in 4.1. Attention is drawn to the fact that some industries (e.g. automotive, aircraft
and aerospace, nuclear, military) may have specific workmanship standards and/or quality
requirements, which are outside the scope of this document.
IEC Guide 109 advocates the need to minimize the impact of a product on the natural
environment throughout the product life cycle.

SOLDERLESS CONNECTIONS –
Part 5: Press-in connections – General requirements,
test methods and practical guidance

1 Scope
This part of IEC 60352 is applicable to solderless press-in connections for use in electrical
and electronic equipment and components.
The press-in connection consists of a termination having a suitable press-in zone which is
inserted into a hole of a board.
Information on materials and data from industrial experience is included in addition to the test
procedures to provide electrically stable connections under specified environmental conditions.
The object of this document is to determine the suitability of press-in connections under
mechanical, electrical and atmospheric conditions as specified by the manufacturer of the
press-in termination and to provide a means of comparing test results when the tools used to
make the connections are of different designs or manufacture.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60512-1, Connectors for electrical and electronic equipment – Tests and measurements –
Part 1: Generic specification
IEC 60512-1-1, Connectors for electronic equipment – Tests and measurements – Part 1-1:
General examination – Test 1a: Visual examination
IEC 60512-1-2, Connectors for electronic equipment – Tests and measurements – Part 1-2:
General examination – Test 1b: Examination of dimension and mass
IEC 60512-2-1, Connectors for electronic equipment – Tests and measurements – Part 2-1:
Electrical continuity and contact resistance tests – Test 2a: Contact resistance – Millivolt level
method
IEC 60512-2-5, Connectors for electronic equipment – Tests and measurements – Part 2-5:
Electrical continuity and contact resistance tests – Test 2e: Contact disturbance
IEC 60512-6-4, Connectors for electronic equipment – Tests and measurements – Part 6-4:
Dynamic stress tests – Test 6d: Vibration (sinusoidal)
IEC 60512-11-1, Connectors for electrical and electronic equipment – Tests and
measurements – Part 11-1: Climatic tests – Test 11a – Climatic sequence

– 8 – IEC 60352-5:2020 © IEC 2020
IEC 60512-11-4, Connectors for electronic equipment – Tests and measurements – Part 11-4:
Climatic tests – Test 11d: Rapid change of temperature
IEC 60512-11-9, Connectors for electronic equipment – Tests and measurements – Part 11-9:
Climatic tests – Test 11i: Dry heat
IEC 61188-5-1, Printed boards and printed board assemblies – Design and use – Part 5-1:
Attachment (land/joint) considerations – Generic requirements
IEC 62326-4, Printed boards – Part 4: Rigid multilayer printed boards with interlayer
connections – Sectional specification
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp.
3.1
board
printed board or MID (moulded interconnect device) with plated-through holes or metal board
with holes
3.2
hole
finished plated-through hole in a printed board or MID
Note 1 to entry: Finished hole in a metal board may be plated or unplated.
3.3
metal board
board consisting of solid, electrically conductive base material, which may have an electrically
insulative coating applied
3.4
moulded interconnect device
MID
injection moulded thermoplastic substrate which incorporates a conductive circuit pattern and
integrates mechanical and electrical functions
3.5
press-in connection
solderless connection made by inserting a press-in termination into a hole of a board
[SOURCE: IEC 60050-581:2008, 581-23-38, modified – deleted the words "plated-through"
and "printed".]
3.6
press-in termination
press-in post
termination having a specially shaped zone suitable to provide for a solderless press-in
connection
[SOURCE: IEC 60050-581:2008, 581-23-31, modified – the word "section" is replaced by
"zone" and the word "solderless" is added.]
3.7
solid press-in termination
press-in termination having a solid press-in zone which behaves primarily rigidly and induces
a deflection of the through hole
[SOURCE: IEC 60050-581:2008, 581-23-32, modified – added wording "which behaves
primarily rigidly and induces a deflection of the through hole".]
3.8
compliant press-in termination
press-in termination having a compliant press-in zone which causes a limited deflection of the
through hole and a deformation of the press-in zone
[SOURCE: IEC 60050-581:2008, 581-23-33, modified – added wording "which causes a
limited deflection of the through hole and a deformation of the press-in zone".]
3.9
press-in zone
specially shaped section of a press-in termination which is suitable to provide for the press-in
connection
[SOURCE: IEC 60050-581:2008, 581-23-43]
3.10
termination insertion tool
device used to insert press-in terminations or components equipped with press-in terminations
into a board
[SOURCE: IEC 60050-581:2008, 581-24-29, modified – deleted the word "printed".]
3.11
termination removal tool
device for removing a press-in termination from a board
[SOURCE: IEC 60050-581:2008, 581-24-30, modified – deleted the word "printed".]
3.12
set of parts
one press-in termination and a test board with one or more holes
Note 1 to entry: The press-in termination is not mounted in the board.
3.13
specimen
board, or a part of a board, with a mounted press-in termination, with or without component
parts
3.14
manufacturer
manufacturer of the press-in termination, who performs the tests according to this document
using a test board
– 10 – IEC 60352-5:2020 © IEC 2020
4 Requirements
4.1 General
The connections shall be processed in a careful and workmanlike manner in accordance with
good current practice.
Annex A (informative) provides practical guidance and may constitute a benchmark for the
assessment of workmanship.
NOTE Some industry sectors (e.g. automotive, aerospace, marine, nuclear, military) use workmanship standards
which may be considered upon agreement between manufacturer and user.
The manufacturer shall provide instructions for the assembly of the connections.
4.2 Tools
4.2.1 General
Tools shall be used and inspected according to the instructions and dimensions provided by
the manufacturer.
The tools shall be capable of making uniformly reliable connections, i.e. press-in connections
complying with the requirements of this document.
The tools shall be so designed that they do not damage the press-in termination or the board
when correctly operated.
4.2.2 Tools evaluation
Tools are evaluated for performance by testing the connections made by them and carrying
out tests according to 4.5 and 5.1.2. They shall meet the requirements of 4.6d) and 5.2.1.3.
4.3 Press-in terminations
4.3.1 Materials
Material used in the press-in zone shall be specified by the manufacturer.
For information on materials, see A.4.3.
4.3.2 Dimensions of the press-in zone
The performance of a press-in connection depends on the dimensions of the specially shaped
press-in zone and the materials used for the press-in termination together with the dimensions
and materials of the plated-through hole in the printed board or MID or dimensions of the hole
in the metal board.
4.3.3 Surface finishes
The press-in zone of the press-in termination shall be either unplated or plated. The surface
finish shall be specified by the manufacturer.
The surface shall be free of detrimental contamination or corrosion.

4.4 Test boards
4.4.1 General
For test purposes, test boards according to IEC 61188-5-1 and IEC 62326-4 or to a
specification given by the manufacturer shall be used.
Press-in terminations intended to be suitable for use in printed boards shall use four layer
printed boards for testing unless otherwise specified in the detail product specification or in
the manufacturer's specification.
For press-in zones for soldered printed boards, the test boards shall be prepared according to
manufacturer's instructions.
Press-in terminations intended to be suitable for use in metal boards or MID shall use metal
boards or MIDs with hole dimensions in accordance with the manufacturer's specifications.
4.4.2 Materials
The manufacturer shall specify the board material for which the press-in zone is designed.
Examples of printed board base materials may be found in the IEC 61249 series.
4.4.3 Thickness of test boards
The thickness of the test board shall be that for which the press-in connection is designed.
When a press-in termination is designed to be used with different board thicknesses, the test
board selected shall be of the thinnest nominal thickness for which the press-in termination is
intended to be used.
NOTE If a press-in termination is designed for board sizes of 1,6 mm to 2,4 mm, a test board with a nominal
thickness of 1,6 mm (within tolerance range) is used.
4.4.4 Hole
The minimum and the maximum finished hole diameter the press-in termination is intended for
shall be defined by the manufacturer. The difference between the minimum and the maximum
diameter of the finished hole is the tolerance range.
For testing of the quality of the press-in termination itself, it is necessary to perform tests of
the press-in zone close to the minimum finished hole and close to the maximum finished hole
as well. Measure the holes in the test board and identify which hole diameters are within
range a and also the hole diameters within range b of Figure 1.
At a tolerance range less than 0,06 mm (60 μm), the hole diameter shall be within the
tolerance range. Then it is not necessary to identify maximal and minimal holes.

– 12 – IEC 60352-5:2020 © IEC 2020

NOTE Not to scale.
Figure 1 – Guide for hole ranges in a test board
4.4.5 Plated-through hole
For boards that include plated-through holes, the minimum and the maximum finished plated-
through hole diameter that the press-in termination is intended for shall be defined by the
manufacturer.
The plated-through holes shall fulfil the requirements in Table 1, where the item definition
follows Figure 2.
Table 1 – Plated-through hole requirements for test printed boards
Item according Description Requirement
to Figure 2
range a: lower 30 % of the tolerance range
e Range of test holes (Figure 1)
range b: upper 30 % of the tolerance range
a
f copper thickness of the tube 25 µm min., 50 µm max.
g final plating for information see A.4.3
h pad width 0,15 mm min.
a
Unless otherwise specified by the manufacturer.

It is important that all plated-through holes in a printed test board meet the requirements of
Table 1. The difference of finished hole diameters range a and range b has therefore to be
made via different diameters of the drill tools respective holes in MID. It is recommended to
manufacture test boards having both range a and range b holes. This is in line with practical
conditions and ensures that all holes meet the requirements of Table 1.

See Table 1 for symbol definitions.
Figure 2 – Plated-through hole
Further plating requirements shall be specified by the manufacturer. See A.5.2.
The thickness of the copper tube shall be measured by a transversal microsection through the
hole according to Figure 3. The values of f and f shall be in the required range of f
1 2
according to Table 1.
Key
f maximal measured value of the copper thickness
f minimal measured value of the copper thickness
Figure 3 – Location and example of the transversal microsection
for measuring the copper thickness
4.5 Press-in connections
a) The combination of press-in termination, board and termination insertion tool shall be
compatible and specified by the manufacturer.
b) The press-in termination shall be correctly mounted in the hole of the board as specified in
the manufacturer's specification.
c) After the press-in operation, no detrimental plating particle chips shall be visible.
d) At the opposite side of the press-in direction, no plating of the plated-through hole shall be
loosened.
– 14 – IEC 60352-5:2020 © IEC 2020
e) No unintentional cracks or fractures shall be visible on the press-in termination after the
press-in operation. Predesigned breaking locations described in the manufacturer's
specification are permitted.
f) The press-in operation may result in deformation of the plated-through hole plating
layer(s). The limits of deformation shall be according to 5.2.2.4.
g) There shall be no deformation of the printed conductor and/or the plating of the
plated-through hole caused by the termination insertion tool or device.
h) There shall be no lands fractured or lifted.
i) There shall be no delamination, blistering or cracking of layers.
Examination of the press-in terminations and boards in terms of the above criteria shall be
between 5× and 200× magnification.
4.6 Manufacturer´s specification
The following information shall be supplied by the manufacturer of the press-in zone and/or
the component.
a) Printed board and hole information:
– printed board material;
– maximum number of conductive layers;
– printed board minimum and maximum thickness;
– printed board plating materials;
– finished plated-through hole dimensions, including tolerances;
– fitness for soldered or unsoldered printed boards.
b) Metal board and hole information:
– board material;
– board minimum and maximum thickness;
– board plating materials (if appropriate);
– finished hole dimensions, including tolerances.
c) Press-in termination information:
– material of the press-in termination;
– plating.
d) Information on the application:
– straight or right angle termination;
– rear plug up;
– wrapped connection;
– individual press-in termination;
– connector or application with pre-assembled press-in terminations.
e) Instructions and tools for the press-in operation:
– tools to be used;
– number of replacements with a new press-in termination;
– offset location and tolerance.
f) Forces:
– maximum press-in force per termination;
– minimum push-out force per termination after tests.
g) Any other significant information.

5 Tests
5.1 General remarks
5.1.1 General
As explained in the introduction, there are two test schedules which shall be applied
according to the following conditions.
a) Press-in connections, according to the requirements in Clause 4 and the requirements in
the manufacturer's specification, shall be tested in accordance with the qualification test
schedule in 5.3.2.
This test schedule is intended to be applied on individual press-in terminations without
other parts.
b) Press-in connections which are part of a component or application and already qualified to
the qualification test schedule shall be tested in accordance with the application test
schedule in 5.3.4.
This test schedule is intended for components with a number of press-in terminations. The
application test schedule may be implemented in the detail product specification in such a
way that the duplication of tests is avoided.
5.1.2 Standard conditions for testing
5.1.2.1 General
Unless otherwise specified, all tests shall be carried out under standard conditions for testing
as specified in IEC 60512-1.
The ambient temperature and the relative humidity at which the measurements are made shall
be stated in the test report.
In case of dispute about test results, the test shall be repeated at one of the referee
conditions of IEC 60068-1.
5.1.2.2 Preconditioning
Unless otherwise specified, the connections shall be preconditioned under standard
conditions for testing in accordance with the requirements of IEC 60512-1 for a minimum
period of 24 h.
5.1.2.3 Recovery
Unless otherwise specified, the specimens shall be allowed to recover under standard
conditions for testing for a period of a minimum of 2 h after conditioning.
5.1.3 Mounting of specimens
For the qualification test schedule, the set of parts consists of press-in terminations and a test
board with holes. Metal boards may or may not have plated holes according to the
manufacturer's specifications. When mounting is required in a test, the parts shall be mounted
using the mounting method described in the manufacturer's specification.
For the application test schedule, complete components shall be pressed on a printed board,
metal board or MID as appropriate, using the normal mounting method, unless otherwise
specified in the detail product specification or in the manufacturer's specification.
NOTE For the definitions of "set of parts" and "specimen", see 3.12 and 3.13, respectively.

– 16 – IEC 60352-5:2020 © IEC 2020
5.2 Test and measuring methods
5.2.1 General examination
5.2.1.1 Visual examination of parts and specimens
The test shall be carried out in accordance with IEC 60512-1-1 Test 1a. Magnification shall be
between 5 times and 200 times, and all parts and specimens shall be examined to ensure that
the applicable requirements of 4.5 have been met.
5.2.1.2 Examination of dimensions
The test shall be carried out in accordance with IEC 60512-1-2 Test 1b. All parts shall be
examined to ensure that the applicable requirements of 4.3 to 4.6 have been met.
5.2.1.3 Inspection of tools
The tools shall be inspected and controlled according to the manufacturer's instructions and
specifications to be sure that the applicable requirements of 4.2 and 4.6 have been met.
5.2.2 Mechanical tests
5.2.2.1 Press-in force
The upper limit of the press-in force shall be specified by the manufacturer.
The maximum force F shall be measured and the force-deflection graph documented.
The recommended speed for application of the press-in force during measurement shall be
25 mm/min to 50 mm/min unless otherwise specified by the manufacturer.
5.2.2.2 Push-out force
This test is only applicable in the qualification test schedule.
The object of this test is to ensure a minimum holding force of a press-in connection against
the press-in direction.
If a push-out operation is not applicable, a pull-out operation may be performed.
The lower limit of the push-out force shall be specified by the manufacturer.
The specimen shall consist of a test board with a press-in termination inserted as shown in
Figure 4.
After the press-in operation and before carrying out the push-out test, the specimens shall be
allowed to recover for a period of at least 24 h.

Figure 4 – Test arrangement – push-out force
A force F shall be applied to the press-in termination against the press-in direction. The
maximum force F shall be recorded and the force-deflection graph documented.
max
The specimen shall be tested until the press-in termination moves in the hole of the board as
far as possible.
A suitable device shall be used, for example a tensile testing machine. The cross-head of the
tensile testing machine shall be moved steadily at a maximum speed of 12 mm/min.
If the manufacturer defines the geometry of the push-out device, it shall be used for this test.
If not then the test laboratory may create a suitable geometry. The push-out device shall be
documented.
For information on additional mechanical stresses acting on the press-in termination due to
the application of the press-in connection, see A.6.1.
5.2.2.3 Vibration
This test is only applicable in the application test schedule.
The test shall be carried out in accordance with IEC 60512-6-4 Test 6d.
The specimens shall be firmly held on a vibration table.
A suitable test arrangement for testing press-in connections shall be defined by the
manufacturer or shall be included in the detail product specification.
When direct measurement of press-in connection is not possible, an overall measurement of
contact resistance shall be specified. The total resistance specified for the application shall
not be exceeded.
Preferred severities are given in Table 2.

– 18 – IEC 60352-5:2020 © IEC 2020
Table 2 – Vibration, preferred test severities
Range of frequency 10 Hz to 55 Hz 10 Hz to 500 Hz 10 Hz to 2 000 Hz
Full duration +5 +5 +5
120 min 360 min 360 min
0 0 0
Displacement amplitude below the cross-over
0,35 mm 0,35 mm 1,5 mm
frequency
Acceleration amplitude above the cross-over
2 2
– 50 m/s 200 m/s
frequency
Directions Three axes Three axes Three axes
Number of sweep cycles per direction 8 10 8

Unless otherwise specified by the manufacturer or in the relevant detail product specification,
the 10 Hz to 500 Hz range shall be carried out.
5.2.2.4 Microsectioning for plated-through holes
5.2.2.4.1 General
The test shall be carried out in accordance with IEC 61188-5-1.
For metal boards, microsectioning is not required.
5.2.2.4.2 Transverse sectioning
A first cross-section shall be made approximately 0,3 mm below the top of the board. The
deformation "a" of the drilled hole contour in the plated-through hole shall be smaller than
70 µm. The minimum remaining thickness "b" of the plating shall be more than 8 µm. There
shall be no cracks in the plating of the plated-through hole. See Figure 5. Compliance is
checked by inspection and measurement.
Dimensions in millimetres
Figure 5 – Transverse section of a press-in connection
A second cross-section shall be made approximately in the middle of the press-in contact
zone and the hole. This area is determined from the longitudinal section and documented.
Together with the longitudinal section, the gas-tight contact area may be estimated.
5.2.2.4.3 Longitudinal sectioning
The sectioning needs to go accurately through the biggest deformation of the hole. The exact
location shall be determined from the first cross-s
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