Field Device Integration (FDI)® - Part 101-2: Profiles - Foundation Fieldbus HSE

IEC 62769-101-2:2023 is available as IEC 62769-101-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-101-2:2023 specifies the IEC 62769 profile for IEC 61784‑1, CP 1/2 (Foundation™ Fieldbus HSE)[1].
[1] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Intégration des appareils de terrain (FDI)® - Partie 101-2: Profils - Foundation Fieldbus HSE

IEC 62769-101-2:2023 est disponible sous forme de IEC 62769-101-2:2023 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.L'IEC 62769-101-2:2023 spécifie le profil de l'IEC 62769 pour le profil de communication CP 1/2 (Foundation™ Fieldbus HSE)[1] défini dans l'IEC 61784‑1.
[1] Foundation™ Fieldbus est l'appellation commerciale du consortium Fieldbus Foundation, une organisation à but non lucratif. Cette information est donnée à l'intention des utilisateurs du présent rapport technique et ne signifie nullement que l'IEC approuve le détenteur des appellations commerciales ou l'emploi de ses produits. La conformité n'exige pas l'utilisation de l'appellation commerciale. L'utilisation de l'appellation commerciale exige l'autorisation du détenteur de l'appellation commerciale.

General Information

Status
Published
Publication Date
13-Apr-2023
Current Stage
PPUB - Publication issued
Start Date
15-May-2023
Completion Date
14-Apr-2023
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IEC 62769-101-2:2023 RLV - Field Device Integration (FDI)® - Part 101-2: Profiles - Foundation Fieldbus HSE Released:4/14/2023 Isbn:9782832268483
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IEC 62769-101-2:2023 - Field Device Integration (FDI)® - Part 101-2: Profiles - Foundation Fieldbus HSE Released:4/14/2023
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IEC 62769-101-2 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside ®
Field Device Integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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IEC 62769-101-2 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside ®
Field Device Integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6848-3
– 2 – IEC 62769-101-2:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and conventions acronyms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms and acronyms . 7
4 Conventions . 7
4.1 EDDL syntax . 7
4.2 XML syntax . 7
5 Profile for CP 1/2 (FOUNDATION™ HSE) . 8
5.1 General . 8
5.2 Catalog profile . 8
5.2.1 Protocol support file (Capability File) . 8
5.2.2 CommunicationProfile definition . 8
5.2.3 Profile device . 8
5.2.4 Protocol version information . 8
5.3 Associating a Package with a CP 1/2 device . 9
5.3.1 Device type identification mapping . 9
5.3.2 Device type revision mapping . 9
5.4 Information Model mapping . 9
5.4.1 ProtocolType definition . 9
5.4.2 DeviceType mapping . 9
5.4.3 FunctionalGroup Identification definition . 10
5.4.4 BlockType property mapping . 10
5.4.5 Mapping to Block ParameterSet . 11
5.5 Topology elements . 11
5.5.1 ConnectionPoint definition . 11
5.5.2 Communication Device definition . 12
5.5.3 Communication service provider definition . 14
5.5.4 Network definition . 14
5.6 Methods . 15 ®
5.6.1 Methods for FDI Communication Servers . 15
5.6.2 Methods for Gateways . 21
Annex A (normative) Topology scan schema . 22
A.1 General . 22
A.2 Target Namespace . 22
A.3 Network . 22
A.4 FoundationHSEAddressT . 22
A.5 FoundationHSEConnectionPointT . 22
A.6 FoundationHSENetworkT . 23
A.7 FoundationBlockIdentificationT . 24
A.8 FoundationIdentificationT . 24
Annex B (normative) Transfer service parameters . 26
Annex C (informative) Communication service arguments for Transfer Method . 27
Bibliography . 28

Table 1 – Capability File part . 8
Table 2 – CommunicationProfile definition . 8
Table 3 – Device type catalog mapping . 9
Table 4 – ProtocolType Foundation_HSE definition . 9
Table 5 – Inherited DeviceType property mapping . 10
Table 6 – Identification parameters . 10
Table 7 – Inherited BlockType property mapping. 11
Table 8 – ConnectionPointType ConnectionPoint_Foundation_HSE definition. 11
Table 9 – Communication device ParameterSet definition . 14
Table 10 – Method Connect arguments . 16
Table 11 – Method Disconect arguments . 16
Table 12 – Method Transfer arguments . 17
Table 13 – Method GetPublishedData arguments. 19
Table 14 – Method SetAddress arguments . 20
Table A.1 – Attributes of FoundationHSEConnectionPointT . 23
Table A.2 – Elements of FoundationHSEConnectionPointT . 23
Table A.3 – Elements of FoundationHSENetworkT . 24
Table A.4 – Attributes of FoundationBlockIdentificationT. 24
Table A.5 – Attributes of FoundationIdentificationT . 25

– 4 – IEC 62769-101-2:2023 RLV © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –

Part 101-2: Profiles – Foundation Fieldbus HSE

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 62769-101-2:2020. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
IEC 62769-101-2 has been prepared by subcommittee 65E: Devices and integration in
enterprise systems, of IEC technical committee 65: Industrial-process measurement, control
and automa
...


IEC 62769-101-2 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE ®
Field Device Integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
®
Intégration des appareils de terrain (FDI) –
Partie 101-2: Profils – Foundation Fieldbus HSE

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
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committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
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IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
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IEC 62769-101-2 ®
Edition 3.0 2023-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE ®
Field Device Integration (FDI) –

Part 101-2: Profiles – Foundation Fieldbus HSE
®
Intégration des appareils de terrain (FDI) –

Partie 101-2: Profils – Foundation Fieldbus HSE

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6831-5

– 2 – IEC 62769-101-2:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and acronyms . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms and acronyms . 7
4 Conventions . 7
4.1 EDDL syntax . 7
4.2 XML syntax . 7
5 Profile for CP 1/2 (FOUNDATION™ HSE) . 8
5.1 General . 8
5.2 Catalog profile . 8
5.2.1 Protocol support file (Capability File) . 8
5.2.2 CommunicationProfile definition . 8
5.2.3 Profile device . 8
5.2.4 Protocol version information . 8
5.3 Associating a Package with a CP 1/2 device . 9
5.3.1 Device type identification mapping . 9
5.3.2 Device type revision mapping . 9
5.4 Information Model mapping . 9
5.4.1 ProtocolType definition . 9
5.4.2 DeviceType mapping . 9
5.4.3 FunctionalGroup Identification definition . 10
5.4.4 BlockType property mapping . 10
5.4.5 Mapping to Block ParameterSet . 11
5.5 Topology elements . 11
5.5.1 ConnectionPoint definition . 11
5.5.2 Communication Device definition . 12
5.5.3 Communication service provider definition . 14
5.5.4 Network definition . 14
5.6 Methods . 15 ®
5.6.1 Methods for FDI Communication Servers . 15
5.6.2 Methods for Gateways . 21
Annex A (normative) Topology scan schema . 22
A.1 General . 22
A.2 Target Namespace . 22
A.3 Network . 22
A.4 FoundationHSEAddressT . 22
A.5 FoundationHSEConnectionPointT . 22
A.6 FoundationHSENetworkT . 23
A.7 FoundationBlockIdentificationT . 24
A.8 FoundationIdentificationT . 24
Annex B (normative) Transfer service parameters . 26
Annex C (informative) Communication service arguments for Transfer Method . 27
Bibliography . 28

Table 1 – Capability File part . 8
Table 2 – CommunicationProfile definition . 8
Table 3 – Device type catalog mapping . 9
Table 4 – ProtocolType Foundation_HSE definition . 9
Table 5 – Inherited DeviceType property mapping . 10
Table 6 – Identification parameters . 10
Table 7 – Inherited BlockType property mapping. 11
Table 8 – ConnectionPointType ConnectionPoint_Foundation_HSE definition. 11
Table 9 – Communication device ParameterSet definition . 14
Table 10 – Method Connect arguments . 16
Table 11 – Method Disconect arguments . 16
Table 12 – Method Transfer arguments . 17
Table 13 – Method GetPublishedData arguments. 19
Table 14 – Method SetAddress arguments . 20
Table A.1 – Attributes of FoundationHSEConnectionPointT . 23
Table A.2 – Elements of FoundationHSEConnectionPointT . 23
Table A.3 – Elements of FoundationHSENetworkT . 24
Table A.4 – Attributes of FoundationBlockIdentificationT. 24
Table A.5 – Attributes of FoundationIdentificationT . 25

– 4 – IEC 62769-101-2:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –

Part 101-2: Profiles – Foundation Fieldbus HSE

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization
...

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