IEC 62769-101-2:2020
(Main)Field Device Integration (FDI) - Part 101-2: Profiles - Foundation Fieldbus HSE
Field Device Integration (FDI) - Part 101-2: Profiles - Foundation Fieldbus HSE
IEC 62769-101-2:2020 specifies the IEC 62769 profile for IEC 61784 1, CP 1/2 (FOUNDATION™ Fieldbus HSE).
Intégration des appareils de terrain (FDI) - Partie 101-2: Profils - Foundation Fieldbus HSE
L'IEC 62769-101-2:2020 spécifie le profil de l'IEC 62769 pour le profil de communication CP 1/2 (FOUNDATION™ Fieldbus HSE) défini dans l'IEC 61784-1.
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IEC 62769-101-2 ®
Edition 2.0 2020-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
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The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
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IEC 62769-101-2 ®
Edition 2.0 2020-11
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9105-4
– 2 – IEC 62769-101-2:2020 RLV © IEC 2020
CONTENTS
FOREWORD . 4
INTRODUCTION .
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, abbreviated terms and conventions . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 8
3.3 Conventions . 8
3.3.1 EDDL syntax. 8
3.3.2 XML syntax . 8
4 Profile for CP 1/2 (FOUNDATION™ HSE) . 8
4.1 General . 8
4.2 Catalog profile . 9
4.2.1 Protocol support file . 9
4.2.2 CommunicationProfile definition . 9
4.2.3 Profile device . 9
4.2.4 Protocol version information . 9
4.3 Associating a Package with a CP 1/2 device . 9
4.3.1 Device type identification mapping . 9
4.3.2 Device type revision mapping . 10
4.4 Information Model mapping . 10
4.4.1 ProtocolType definition . 10
4.4.2 DeviceType mapping . 10
4.4.3 FunctionalGroup Identification definition . 11
4.4.4 BlockType property mapping . 11
4.4.5 Mapping to Block ParameterSet . 12
4.5 Topology elements . 12
4.5.1 ConnectionPoint definition . 12
4.5.2 Communication Device definition . 13
4.5.3 Communication service provider definition . 14
4.5.4 Network definition . 15
4.6 Methods . 16
4.6.1 Methods for FDI Communication Servers . 16
4.6.2 Methods for Gateways . 23
Annex A (normative) Topology scan schema . 24
A.1 General . 24
A.2 Network . 24
A.3 FoundationHSEAddressT . 24
A.4 FoundationHSEConnectionPointT . 24
A.5 FoundationHSENetworkT . 25
A.6 FoundationBlockIdentificationT . 25
A.7 FoundationIdentificationT . 26
Annex B (normative) Transfer service parameters . 28
Annex C (informative) Communication service arguments for Transfer Method . 29
Bibliography . 30
Table 1 – Capability File part . 9
Table 2 – CommunicationProfile definition . 9
Table 3 – Device type catalog mapping . 10
Table 4 – ProtocolType Foundation_HSE definition . 10
Table 5 – Inherited DeviceType property mapping . 10
Table 6 – Identification parameters . 11
Table 7 – Inherited BlockType property mapping. 11
Table 8 – ConnectionPointType ConnectionPoint_Foundation_HSE definition. 12
Table 9 – Communication device ParameterSet definition . 14
Table 10 – Method Connect arguments . 16
Table 11 – Method Disconect arguments . 17
Table 12 – Method Transfer arguments . 19
Table 13 – Method GetPublishedData arguments. 21
Table 14 – Method SetAddress arguments . 22
Table A.1 – Attributes of FoundationHSEConnectionPointT . 25
Table A.2 – Elements of FoundationHSEConnectionPointT . 25
Table A.3 – Elements of FoundationHSENetworkT . 25
Table A.4 – Attributes of FoundationBlockIdentificationT. 26
Table A.5 – Attributes of FoundationIdentificationT . 26
– 4 – IEC 62769-101-2:2020 RLV © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
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IEC 62769-101-2 ®
Edition 2.0 2020-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Field device integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
Intégration des appareils de terrain (FDI) –
Partie 101-2: Profils – Foundation Fieldbus HSE
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
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IEC 62769-101-2 ®
Edition 2.0 2020-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Field device integration (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
Intégration des appareils de terrain (FDI) –
Partie 101-2: Profils – Foundation Fieldbus HSE
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9064-4
– 2 – IEC 62769-101-2:2020 © IEC 2020
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and conventions . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
3.3 Conventions . 7
3.3.1 EDDL syntax. 7
3.3.2 XML syntax . 7
4 Profile for CP 1/2 (FOUNDATION™ HSE) . 7
4.1 General . 7
4.2 Catalog profile . 7
4.2.1 Protocol support file . 7
4.2.2 CommunicationProfile definition . 8
4.2.3 Profile device . 8
4.2.4 Protocol version information . 8
4.3 Associating a Package with a CP 1/2 device . 8
4.3.1 Device type identification mapping . 8
4.3.2 Device type revision mapping . 9
4.4 Information Model mapping . 9
4.4.1 ProtocolType definition . 9
4.4.2 DeviceType mapping . 9
4.4.3 FunctionalGroup Identification definition . 10
4.4.4 BlockType property mapping . 10
4.4.5 Mapping to Block ParameterSet . 11
4.5 Topology elements . 11
4.5.1 ConnectionPoint definition . 11
4.5.2 Communication Device definition . 12
4.5.3 Communication service provider definition . 13
4.5.4 Network definition . 14
4.6 Methods . 15
4.6.1 Methods for FDI Communication Servers . 15
4.6.2 Methods for Gateways . 21
Annex A (normative) Topology scan schema . 22
A.1 General . 22
A.2 Network . 22
A.3 FoundationHSEAddressT . 22
A.4 FoundationHSEConnectionPointT . 22
A.5 FoundationHSENetworkT . 23
A.6 FoundationBlockIdentificationT . 23
A.7 FoundationIdentificationT . 24
Annex B (normative) Transfer service parameters . 26
Annex C (informative) Communication service arguments for Transfer Method . 27
Bibliography . 28
Table 1 – Capability File part . 8
Table 2 – CommunicationProfile definition . 8
Table 3 – Device type catalog mapping . 9
Table 4 – ProtocolType Foundation_HSE definition . 9
Table 5 – Inherited DeviceType property mapping . 9
Table 6 – Identification parameters . 10
Table 7 – Inherited BlockType property mapping. 10
Table 8 – ConnectionPointType ConnectionPoint_Foundation_HSE definition. 11
Table 9 – Communication device ParameterSet definition . 13
Table 10 – Method Connect arguments . 15
Table 11 – Method Disconect arguments . 16
Table 12 – Method Transfer arguments . 17
Table 13 – Method GetPublishedData arguments. 19
Table 14 – Method SetAddress arguments . 20
Table A.1 – Attributes of FoundationHSEConnectionPointT . 23
Table A.2 – Elements of FoundationHSEConnectionPointT . 23
Table A.3 – Elements of FoundationHSENetworkT . 23
Table A.4 – Attributes of FoundationBlockIdentificationT. 24
Table A.5 – Attributes of FoundationIdentificationT . 24
– 4 – IEC 62769-101-2:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –
Part 101-2: Profiles – Foundation Fieldbus HSE
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with
...
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