IEC 61188-5-8:2007

IEC 61188-5-8
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-8: Attachment (land/joint) considerations – Area array components (BGA,
FBGA, CGA, LGA)
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IEC 61188-5-8
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-8: Attachment (land/joint) considerations – Area array components (BGA,
FBGA, CGA, LGA)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.180 ISBN 2-8318-9343-7
– 2 – 61188-5-8 © IEC:2007(E)
CONTENTS
FOREWORD.04
INTRODUCTION.1H1H6

1 Scope.2H2H7
2 Normative references .3H3H7
3 General information.4H4H8
3.1 General component description .5H5H8
3.2 Marking .6H6H8
3.3 Carrier packaging format .7H7H9
3.4 Process considerations .8H8H9
4 BGA (square) .9H9H9
4.1 Field of application .10H10H9
4.2 Component descriptions .11H11H9
4.2.1 Basic construction .12H12H9
4.2.2 Termination materials .13H13H10
4.2.3 Marking .14H14H11
4.2.4 Carrier package format .15H15H11
4.2.5 Process considerations.16H16H11
4.3 Component dimensions (square) .17H17H11
4.3.1 PBGA 1,5 mm pitch component dimensions (square).18H18H12
4.3.2 PBGA 1,27 mm pitch component dimensions (square).19H19H14
4.3.3 PBGA 1,00 mm pitch component dimensions (square).20H20H15
4.4 Solder joint fillet design .21H21H17
4.4.1 Solder joint fillet design – Non-collapsing, collapsing (level 3) .22H22H17
4.5 Land pattern dimensions .23H23H18
4.5.1 PBGA 1,5 mm pitch land pattern dimensions (square) .24H24H19
4.5.2 PBGA 1,27 mm pitch land pattern dimensions (square) .25H25H21
4.5.3 PBGA 1,00 mm pitch land pattern dimensions (square) .26H26H23
5 FBGA (square) .27H27H25
6 BGA (rectangular) .28H28H25
6.1 Field of application .29H29H25
6.2 Component descriptions .30H30H25
6.2.1 Basic construction .31H31H25
6.2.2 Termination materials .32H32H25
6.2.3 Marking .33H33H26
6.2.4 Carrier package format .34H34H26
6.2.5 Process considerations.35H35H26
6.3 Component dimensions (rectangular) .36H36H26
6.4 Solder joint fillet design .37H37H27
6.4.1 Solder joint fillet design – Collapsing (level 3) .38H38H27
6.4.2 Land approximation .39H39H28
6.4.3 Total variation .40H40H28
6.5 Land pattern dimensions .41H41H28
7 FBGA (rectangular) .42H42H29
8 CGA .43H43H29
9 LGA.44H44H29

61188-5-8 © IEC:2007(E) – 3 –
Bibliography.45H45H30

Figure 1 – Area array land pattern configuration .46H46H7
Figure 2 – BGA physical configuration examples .47H47H10
Figure 3 – High land and eutectic solder ball and joint comparison .48H48H10
Figure 4 – BGA (square) .49H49H11
Figure 5 – General BGA dimensional characteristics.50H50H12
Figure 6 – Solder joint fillet design.51H51H18
Figure 7 – BGA (square) land pattern dimensions .52H52H19

Table 1 – Ball diameter sizes .53H53H8
Table 2 – BGA products with pitch of 1,5 mm.54H54H13
Table 3 – BGA products with pitch of 1,27 mm.55H55H14
Table 4 – BGA products with pitch of 1,0 mm.56H56H16
Table 5 – BGA product land patterns with pitch of 1,50 mm .57H57H20
Table 6 – BGA product land patterns with pitch of 1,27 mm .58H58H22
Table 7 – BGA product land patterns with pitch of 1,00 mm .59H59H24
Table 8 – Rectangular BGA products with pitch of 1,27 mm .60H60H27
Table 9 – Rectangular BGA product land patterns with pitch of 1,27 mm.61H61H29

– 4 – 61188-5-8 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-8: Attachment (land/joint) considerations –
Area array components (BGA, FBGA, CGA, LGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-8 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/705/FDIS 91/737/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61188-5-8 is to be read in conjunction with IEC 61188-5-1.

61188-5-8 © IEC:2007(E) – 5 –
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance resu
...