IEC 62610-2:2018

IEC 62610-2 ®
Edition 1.0 2018-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical structures for electrical and electronic equipment – Thermal
management for cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 2: Method for the determination of forced air cooling

Structures mécaniques pour équipements électriques et électroniques – Gestion
thermique pour les armoires conformes aux séries IEC 60297 ET IEC 60917 –
Partie 2: Méthode pour la détermination du refroidissement par ventilation forcée

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IEC 62610-2 ®
Edition 1.0 2018-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical structures for electrical and electronic equipment – Thermal

management for cabinets in accordance with IEC 60297 and IEC 60917 series –

Part 2: Method for the determination of forced air cooling

Structures mécaniques pour équipements électriques et électroniques – Gestion

thermique pour les armoires conformes aux séries IEC 60297 ET IEC 60917 –

Partie 2: Méthode pour la détermination du refroidissement par ventilation forcée

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-5692-3

– 2 – IEC 62610-2:2018 © IEC 2018
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Thermal conditions . 7
4.1 Baseline thermal conditions . 7
4.2 Reference temperature . 7
4.3 Syntax of surfaces of a generic subrack, chassis or cabinet . 8
4.4 Preferred airflow conditions . 9
4.5 Cabinet airflow volume and temperature rise management . 10
5 Forced air thermal flow chart for cabinet equipment . 11
5.1 General . 11
5.2 Evaluation of the actual thermal performance of subrack or chassis . 12
5.3 Cabinet airflow considerations . 12
5.4 Arrangement of subracks and/or chassis-based equipment within the cabinet . 12
5.5 Selection of cabinet mounted forced air cooling device(s) . 13
5.6 Thermal operating environment . 13
5.7 Arrangement of cabinets in a server room and preferred airflow . 15
Annex A (informative) General method of thermal design for electronic equipment . 16
A.1 Thermal resistance and thermal network model . 16
A.1.1 Thermal resistance . 16
A.1.2 Thermal network model . 16
Bibliography . 19

Figure 1 – Syntax of surfaces of a forced air cooled generic subrack or chassis to be
mounted into a cabinet . 8
Figure 2 – Syntax of surfaces of a forced air cooled generic cabinet . 9
Figure 3 – Preferred cabinet airflow patterns. 10
Figure 4 – Airflow volume management . 11
Figure 5 – Forced air thermal flow chart for cabinet equipment . 12
Figure 6 – Thermal operating environment (cabinet sectional side view) . 14
Figure 7 – Cabinet operating temperature range . 15
Figure 8 – Example of cabinet airflows in an aisle containment server room . 15
Figure A.1 – Thermal network model for a plug-in unit in subrack or chassis . 18

Table 1 – Preferred airflow pattern . 9

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STRUCTURES FOR ELECTRICAL
AND ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN
ACCORDANCE WITH IEC 60297 AND IEC 60917 SERIES –

Part 2: Method for the determination of forced air cooling

FOREWORD
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International Standard IEC 6
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