EN 60749-19:2003/A1:2010

Overview

EN 60749-19:2003/A1:2010 is a European standard published by CLC that specifies mechanical test methods for semiconductor devices, focusing on die shear strength. This standard is an amendment (A1) to EN 60749-19:2003 and aligns with the international IEC 60749-19:2003/A1:2010 standard, ensuring consistency in testing practices across Europe and globally.

Die shear strength testing is a critical mechanical reliability test used to evaluate the robustness of the die attachment in semiconductor packages. It helps verify that the die is firmly bonded to the substrate or lead frame, ensuring device durability during manufacturing and in operational environments.

This standard applies to various semiconductor devices and is relevant for industries relying on the mechanical stability and long-term performance of microelectronic components.

Key Topics

• Die Shear Testing Procedures: Defines the mechanical method to measure die shear strength by applying a lateral force to shear the die off the substrate.
• Package Types: Differentiates testing relevance between cavity packages, where die shear strength verifies attachment integrity, and non-cavity packages (e.g., plastic encapsulated packages), where die bonding mainly limits die movement until curing.
• Test Conditions: Emphasizes testing under standardized mechanical and climatic conditions to simulate real usage and exposure scenarios.
• Importance of Adhesion: Highlights circumstances requiring specification of die shear strength in non-cavity packages - particularly when electrical connections or heat dissipation depend on bond quality.
• Compliance and Implementation: Details the amendment’s approval by CENELEC, its mandatory adoption by member countries, and its status as a national standard.

Applications

• Semiconductor Manufacturing Quality Control: Ensures that die bonding processes meet reliability standards, reducing failure rates during device assembly or later operation.
• Product Qualification Testing: Assesses mechanical robustness for new semiconductor devices, especially those intended for harsh environmental conditions or high-reliability applications.
• Failure Analysis: Helps identify die attachment weaknesses contributing to device failures.
• Thermal Management Design: Supports evaluation of die bonding effectiveness where thermal conduction through the die bond layer is critical.
• Standardization Compliance: Assists manufacturers, testing laboratories, and certifying bodies in aligning with international mechanical testing practices, facilitating market acceptance.

Related Standards

• IEC 60749 Series: EN 60749-19 is part of a broader set of standards covering mechanical and climatic test methods for semiconductor devices, including tests for moisture sensitivity, temperature cycling, and mechanical shock.
• EN 60749-1 to EN 60749-18: These documents complement die shear strength testing by addressing other physical and environmental reliability assessments.
• JEDEC Standards for Semiconductor Reliability: Industry-relevant reliability testing protocols that often reference or align with EN/IEC 60749 mechanical tests.
• ISO 9001 and Automotive Standards (IATF 16949): Quality management systems that incorporate mechanical testing standards such as EN 60749-19 for supplier qualification and process controls.

By adhering to EN 60749-19:2003/A1:2010, semiconductor manufacturers and test labs can ensure a consistent and reliable approach to measuring die shear strength, which is essential to guaranteeing device integrity throughout production and application life cycles. This supports enhanced product quality, reduced defect rates, and compliance with international regulations in the microelectronics industry.