EN 60749-19:2003
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 19: Prüfung der Chip-Bondfestigkeit
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 19: Résistance de la pastille au cisaillement
Détermine la cohérence des matériaux et des méthodes d'essai utilisées pour fixer les pastilles à semiconducteurs aux embases de boîtiers ou autres substrats généralement applicable aux seuls boîtiers à cavité ou comme moniteur de processus.
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003)
Ta del IEC 60749 ugotavlja (glej opombo) celovitost materialov in postopkov, uporabljenih za priklop polprevodniških čipov na glave paketov ali druge substrate (za namen te preskusne metode, izraz »polprevodniški čipi« vključuje tudi pasivne elemente). Preskusna metoda na splošno velja samo za votle pakete ali kot nadzornik procesov. Ne velja za območja za čipe večja od 10 mm2. Prav tako ne velja za tehnologije Flip Chip ali za fleksibilne substrate. OPOMBA Ta ugotovitev je osnovana na izmeri moči, uporabljene na elementu, in če se zgodi napaka, na vrsti napake, ki se zgodi zaradi uporabe moči ter vizualnem zgledu preostalega medija za priklop čipa in metalizaciji glave/substrata.
General Information
- Status
- Published
- Publication Date
- 16-Apr-2003
- Withdrawal Date
- 31-Mar-2006
- Technical Committee
- CLC/TC 47X - Semiconductor devices and trusted chips
- Drafting Committee
- IEC/TC 47 - IEC_TC_47
- Parallel Committee
- IEC/TC 47 - IEC_TC_47
- Current Stage
- 6060 - Document made available - Publishing
- Start Date
- 17-Apr-2003
- Completion Date
- 17-Apr-2003
Relations
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 29-Jan-2023
Overview
EN 60749-19:2003 (identical to IEC 60749-19:2003) defines a mechanical test method to determine die shear strength for semiconductor devices. The standard measures the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. It is generally applicable to cavity packages or as a process monitor, and is not intended for die areas greater than 10 mm², flip‑chip technology, or flexible substrates.
Key topics and requirements
- Scope: Test applies to semiconductor die (including passive elements) bonded to headers/substrates to evaluate die‑attach integrity.
- Test apparatus:
- Linear motion force‑applying instrument or circular dynamometer with lever arm.
- Contact tool applies a uniform load to the die edge, perpendicular to the die mounting plane; a compliant interface on the tool is permitted.
- Measurement accuracy: ±5% of full scale or ±0.5 N, whichever is greater.
- Visual observation facility (e.g., 10× magnification) and a rotational fixture to ensure line contact along the die edge.
- Test procedure:
- Apply force parallel to the header/substrate plane and perpendicular to the die edge.
- Load until die shears or until an upper limit equal to twice the specified minimum shear strength (whichever is smaller).
- Failure criteria: A device fails if any of the following occur:
- Die separation at or below specified thresholds:
- For die area 4.1 mm² ≤ area ≤ 10 mm²: 25 N.
- For die area < 4.1 mm²: 6.1 N per mm² of die area.
- Die separation at <1.25× threshold with <50% adhesion of die‑attach medium to die (visual).
- Die separation at <2× threshold with <10% adhesion of die‑attach medium to die (visual).
- Die separation at or below specified thresholds:
- Categories of separation:
- Sheared die with residual die material remaining.
- Die separates from die‑attach medium.
- Die and die‑attach medium separate from package.
Applications and users
Who uses EN 60749-19:2003:
- Semiconductor packaging and assembly engineers performing die shear tests.
- Reliability and quality engineers qualifying die‑attach materials and bonding processes.
- Test laboratories and incoming inspection teams using die shear as a process monitor.
- Failure analysis teams assessing modes of die detach or bond failures.
Practical uses:
- Qualifying adhesive/epoxy and solder die‑attach processes.
- Validating assembly process changes and supplier materials.
- Routine process control to detect weak bonds before final assembly.
Related standards
- Part of the IEC/EN 60749 series: this part is a rewrite of the die shear test previously in Clause 7, Chapter 2 of EN 60749:1999. Refer to other parts of IEC 60749 for complementary mechanical and climatic test methods.
Keywords: EN 60749-19:2003, IEC 60749-19, die shear strength, die shear test, semiconductor packaging, die attach strength, mechanical test, cavity packages.
Frequently Asked Questions
EN 60749-19:2003 is a standard published by CLC. Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength". This standard covers: Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.
EN 60749-19:2003 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 60749-19:2003 has the following relationships with other standards: It is inter standard links to EN 62047-9:2011, EN 62047-4:2010, EN 60749-19:2003/A1:2010. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 60749-19:2003 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI SIST EN 60749-19:2004
STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear
strength (IEC 60749-19:2003)
ICS 31.080.01 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD EN 60749-19
NORME EUROPÉENNE
EUROPÄISCHE NORM April 2003
ICS 31.080.01
English version
Semiconductor devices –
Mechanical and climatic test methods
Part 19: Die shear strength
(IEC 60749-19:2002)
Dispositifs à semiconducteurs – Halbleiterbauelemente –
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 19: Résistance de la pastille Teil 19: Prüfung der Chip-Bondfestigkeit
au cisaillement (IEC 60749-19:2002)
(CEI 60749-19:2002)
This European Standard was approved by CENELEC on 2003-04-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-19:2003 E
Foreword
The text of document 47/1664/FDIS, future edition 1 of IEC 60749-19, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-19 on 2003-04-01.
This mechanical and climatic test method, as it relates to die shear strength, is a complete rewrite of
the test contained in Clause 7, Chapter 2 of EN 60749:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-04-01
__________
Endorsement notice
The text of the International Standard IEC 60749-19:2003 was approved by CENELEC as a European
Standard without any modification.
__________
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Pour prix, voir catalogue en vigueur
For price, see current catalogue
60749-19 © IEC:2003 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 19: Die shear strength
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
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Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
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international consensus of opinion on the relevant subjects since each technical committee has representation
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equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights.
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