EN 60679-1:2007

SLOVENSKI STANDARD
01-februar-2008
1DGRPHãþD
SIST EN 60679-1:2002
SIST EN 60679-1:2002/A1:2003
SIST EN 60679-1:2002/A2:2004
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Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification
(IEC 60679-1:2007)
Quarzoszillatoren mit bewerteter Qualität - Teil 1: Fachgrundspezifikation (IEC 60679-
1:2007)
Oscillateurs pilotés par quartz sous assurance de la qualité - Partie 1: Spécification
générique (IEC 60679-1:2007)
Ta slovenski standard je istoveten z: EN 60679-1:2007
ICS:
31.140
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60679-1
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 31.140 Supersedes EN 60679-1:1998 + A1:2002 + A2:2003

English version
Quartz crystal controlled oscillators of assessed quality -
Part 1: Generic specification
(IEC 60679-1:2007)
Oscillateurs pilotés par quartz  Quarzoszillatoren
sous assurance de la qualité - mit bewerteter Qualität -
Partie 1: Spécification générique Teil 1: Fachgrundspezifikation
(CEI 60679-1:2007) (IEC 60679-1:2007)

This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in two official versions (English and German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60679-1:2007 E
Foreword
The text of document 49/769/FDIS, future edition 3 of IEC 60679-1, prepared by IEC TC 49, Piezoelectric
and dielectric devices for frequency control and selection, was submitted to the IEC-CENELEC parallel
vote and was approved by CENELEC as EN 60679-1 on 2007-05-01.
This European Standard supersedes EN 60679-1:1998 + A1:2002 + A2:2003.
It represents a step in a revision of all parts of the EN 60679 series to include the test requirements of the
IECQ system. EN 60679-1:2007 is based on the relevant standards of that system.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60679-1:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60122-1 NOTE  Harmonized as EN 60122-1:2002 (not modified).
IEC 60679-3 NOTE  Harmonized as EN 60679-3:2001 (not modified).
IEC 60679-4 NOTE  Harmonized as EN 60679-4:1998 (not modified).
IEC 61000-4-3 NOTE  Harmonized as EN 61000-4-3:2006 (not modified).
__________
- 3 - EN 60679-1:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60027 Series Letter symbols to be used in electrical EN 60027 Series
technology
1)
IEC 60050-561 - International Electrotechnical Vocabulary - -
(IEV) -
Part 561: Piezoelectric devices for frequency
control and selection
IEC 60068-1 1988 Environmental testing -
+ corr. October 1988 Part 1: General and guidance
+ A1 1992 EN 60068-1 1994
1) 2)
IEC 60068-2-1 - Environmental testing - EN 60068-2-1 2007
Part 2: Tests - Test A: Cold
1) 2)
IEC 60068-2-2 - Environmental testing - EN 60068-2-2 1993
Part 2: Tests - Tests B: Dry heat

1) 2)
IEC 60068-2-6 - Environmental testing - EN 60068-2-6 1995
Part 2: Tests - Test Fc: Vibration (sinusoidal)

1) 2)
IEC 60068-2-7 - Environmental testing - EN 60068-2-7 1993
Part 2: Tests - Test Ga: Acceleration, steady
state
1) 2)
IEC 60068-2-10 - Environmental testing - EN 60068-2-10 2005
Part 2-10: Tests - Test J and guidance: Mould
growth
1) 2)
IEC 60068-2-13 - Environmental testing - EN 60068-2-13 1999
Part 2: Tests - Test M: Low air pressure

1) 2)
IEC 60068-2-14 - Environmental testing - EN 60068-2-14 1999
Part 2: Tests - Test N: Change of temperature

1) 2)
IEC 60068-2-17 - Environmental testing - EN 60068-2-17 1994
Part 2: Tests - Test Q: Sealing

1) 2)
IEC 60068-2-20 - Environmental testing - HD 323.2.20 S3 1988
Part 2: Tests - Test T: Soldering

1) 2)
IEC 60068-2-21 - Environmental testing - EN 60068-2-21 2006
Part 2-21: Tests - Test U: Robustness of
terminations and integral mounting devices

1)
Undated reference.
2)
Valid edition at date of issue.

Publication Year Title EN/HD Year
1) 2)
IEC 60068-2-27 - Environmental testing - EN 60068-2-27 1993
Part 2: Tests - Test Ea and guidance: Shock

1) 2)
IEC 60068-2-29 - Environmental testing - EN 60068-2-29 1993
Part 2: Tests - Test Eb and guidance: Bump

1) 2)
IEC 60068-2-30 - Environmental testing - EN 60068-2-30 2005
Part 2-30: Tests - Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
1) 2)
IEC 60068-2-32 - Environmental testing - EN 60068-2-32 1993
Part 2: Tests - Test Ed: Free fall

1) 2)
IEC 60068-2-45 - Environmental testing - EN 60068-2-45 1992
Part 2: Tests - Test Xa and guidance:
Immersion in cleaning solvents

1) 2)
IEC 60068-2-52 - Environmental testing - EN 60068-2-52 1996
Part 2: Tests - Test Kb: Salt mist, cyclic
(sodium chloride solution)
1) 2)
IEC 60068-2-58 - Environmental testing - EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for + corr. December 2004
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
1) 2)
IEC 60068-2-64 - Environmental testing - EN 60068-2-64 1994
Part 2: Test methods - Test Fh: Vibration,
broad-band random (digital control) and
guidance
IEC 60068-2-78 2001 Environmental testing - EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
IEC 60469-1 1987 Pulse techniques and apparatus - - -
Part 1: Pulse terms and definitions

IEC 60617 Data- Graphical symbols for diagrams - -
base
1) 2)
IEC 60679-5 - Quartz crystal controlled oscillators of EN 60679-5 1998
assessed quality -
Part 5: Sectional specification - Qualification
approval
1) 2)
IEC 61000-4-2 - Electromagnetic compatibility (EMC) - EN 61000-4-2 1995
Part 4-2: Testing and measurement
techniques - Electrostatic discharge immunity
test
1)
IECQ 01 - IEC Quality Assessment System for - -
Electronic Components (IECQ) - Basic Rules

IEC QC 001002-2 1998 IEC Quality Assessment System for - -
Electronic Components (IECQ) - Rules of
Procedure -
Part 2: Documentation
- 5 - EN 60679-1:2007
Publication Year Title EN/HD Year
IEC QC 001002-3 1998 IEC Quality Assessment System for - -
Electronic Components (IECQ) - Rules of
Procedure -
Part 3: Approval procedures
1)
ISO 1000 - SI units and recommendations for the use of - -
their multiples and of certain other units

1)
ITU-T G.810 - Definitions and terminology for - -
synchronization networks
1)
ITU-T G.811 - Timing characteristics of primary reference - -
clocks
1)
ITU-T G.812 - Timing requirements of slave clocks suitable - -
for use as node clocks in synchronization
networks
1)
ITU-T G.813 - Timing characteristics of SDH equipment - -
slave clocks (SEC)
1)
ITU-T G.825 - The control of jitter and wander within digital - -
networks which are based on the
synchronous digital hierarchy (SDH)

1)
ANSI T1.101 - Synchronization Interface Standard - -

1)
ANSI T1.105.03 - Synchronous Optical Network (SONET) - - -
Jitter at network Interfaces
ETSI EN 300 462 Series Transmission and Multiplexing (TM); Generic - -
requirements for synchronization networks

1)
Telcordia GR-253 - Synchronous Optical Network (SONET) - -
Transport Systems: Common Generic Criteria

INTERNATIONAL IEC
STANDARD 60679-1
Third edition
2007-04
Quartz crystal controlled oscillators
of assessed quality –
Part 1:
Generic specification
PRICE CODE
Commission Electrotechnique Internationale
XC
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60679-1 © IEC:2007(E)
CONTENTS
FOREWORD.5

1 Scope.7
2 Normative references .7
3 Terms, definitions and general information .9
3.1 General .9
3.2 Definitions .9
3.3 Preferred values for ratings and characteristics .19
3.4 Marking .21
4 Quality assessment procedures.21
4.1 Primary stage of manufacture.21
4.2 Structurally similar components.21
4.3 Subcontracting .22
4.4 Incorporated components .22
4.5 Manufacturer’s approval .22
4.6 Approval procedures .22
4.7 Procedures for capability approval .23
4.8 Procedures for qualification approval.23
4.9 Test procedures .24
4.10 Screening requirements .24
4.11 Rework and repair work.24
4.12 Certified test records .24
4.13 Validity of release.24
4.14 Release for delivery .24
4.15 Unchecked parameters.25
5 Test and measurement procedures.25
5.1 General .25
5.2 Test and measurement conditions .25
5.3 Visual inspection .26
5.4 Dimensions and gauging procedures .27
5.5 Electrical test procedures .27
5.6 Mechanical and environmental test procedures .70
5.7 Endurance test procedure .76

Annex A (normative) Load circuit for logic drive .
Annex B (normative) Latch-up test.81
Annex C (normative) Electrostatic discharge sensitivity classification .82

Bibliography.

Figure 1 – Example of the use of frequency offset .11
Figure 2 – Typical frequency fluctuation characteristics .14
Figure 3 – Characteristics of an output waveform.16
Figure 4 – Clock signal with phase jitter.17
Figure 5 – Phase jitter measures .17

60679-1 © IEC:2007(E) – 3 –
Figure 6 – Gaussian distribution of jitter.18
Figure 7 – Jitter amplitude and period of jitter frequency.18
Figure 8 – Jitter tolerance according to ITU-T G.825, ANSI T1.105.03, Telcordia
GR-253 and ETSI EN 300462 .19
Figure 9 – Test circuits for insulation resistance measurements.27
Figure 10 – Test circuit for voltage proof test .28
Figure 11 – Test circuit for oscillator input power measurement .28
Figure 12 – Test circuit for oven and oscillator input power measurement.29
Figure 13 – Test circuit for measurement of output frequency, method1.30
Figure 14 – Test circuit for measurement of output frequency, method 2.30
Figure 15 – Test circuit for measurement of frequency/temperature characteristics.31
Figure 16 – Thermal transient behaviour of typical oscillator .33
Figure 17 – Generalized oscillator circuit .34
Figure 18 – Test circuit for start-up behaviour and start-up time measurement .35
Figure 19 – Typical start-up behaviour with slow supply voltage ramp.35
Figure 20 – Definition of start-up time .37
Figure 21 – Supply voltage waveform for periodical t measurement .37
SU
Figure 22 – Typical oscillator stabilization characteristic .38
Figure 23 – Example of retrace characteristic .39
Figure 24 – Test circuit for the measurement of output voltage .39
Figure 25 – Test circuit for the measurement of pulse outputs .40
Figure 26 – Test circuit for harmonic distortion measurement .40
Figure 27a – Symmetrical .40
Figure 27b – Large odd harmonic content .40
Figure 27c – Large even harmonic content .41
Figure 27 – Quasi-sinusoidal output waveforms .41
Figure 28a – Ideal spectrum .41
Figure 28b – Spectrum showing severe harmonic distortion .41
Figure 28 – Frequency spectrum for harmonic distortion .41
Figure 29 – Test circuit for the determination of isolation between output ports.44
Figure 30 – Test circuit for measuring suppression of gated oscillators.44
Figure 31 – Test circuit for tri-state disable mode output current.45
Figure 32 – Test circuit for output gating time – tri-state .46
Figure 33 – Test circuit for modulation index measurement.46
Figure 34 – Modulation waveform for index calculation .47
Figure 35 – Logarithmic signal amplitude scale.47
Figure 36 – Test circuit to determine amplitude modulation sensitivity .49
Figure 37 – Frequency spectrum of amplitude modulation distortion .49
Figure 38 – Test circuit to determine pulse amplitude modulation .50
Figure 39 – Pulse modulation characteristic.50
Figure 40 – Test circuit for the determination of modulation input impedance.51
Figure 41 – Test circuit for the measurement of f.m. deviation .52
Figure 42 – Test circuit for the measurement of f.m. sensitivity.54

– 4 – 60679-1 © IEC:2007(E)
Figure 43a – Static test.54
Figure 43b – Dynamic test .55
Figure 43 – Test circuit for the measurement of frequency modulation distortion.55
Figure 44 – Test circuit for the measurement of single-sideband phase noise .56
Figure 45 – Typical noise pedestal spectrum .57
Figure 46 – Test circuit for the measurement of incidental frequency modulation .59
Figure 47 – Test circuit for method 1.60
Figure 48 – Test circuit for method 2.61
Figure 49 – Circuit modifications for methods 1 and 2.62
Figure 50 – Time-domain short-term frequency stability of a typical 5 MHz precision
oscillator .63
Figure 51a – Typical arrangement for radiated interference tests, 30 MHz and above.64
Figure 51b – Typical arrangement for radiated interference tests, below 30 MHz .64
Figure 51 – Radiated interference tests .64
Figure 52 – Characteristics of line impedance of stabilizing network .65
Figure 53 – Circuit diagram of line impedance of stabilizing network.66
Figure 54 – Phase jitter measurement with sampling oscilloscope .67
Figure 55 – Block diagram of a jitter and wander analyzer according to ITU-T O.172 .69
Figure A.1 – Circuit for TTL.78
Figure A.2 – Circuit for schottky logic.78

Table 1 – Measuring sets bandwidth .66
Table 2 – Fourier frequency range for phase noise test.68
Table 3 – Standard bit rates for various applications.70
Table 4 – Tensile force .70
Table 5 – Thrust force.71
Table 6 – Bending force.71
Table 7 – Torque force.72
Table A.1 – Value to be using when calculating R and R .79
1 2
60679-1 © IEC:2007(E) – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
QUARTZ CRYSTAL CONTROLLED OSCILLATORS
OF ASSESSED QUALITY –
Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and
non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates
closely with the International Organization for Standardization (ISO) in accordance with conditions determined
by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60679-1 has been prepared by IEC technical committee 49:
Piezoelectric and dielectric devices for frequency control and selection.
This third edition cancels and replaces the second edition published in 1997 and its
Amendments 1 (2002) and 2 (2003) and constitutes a technical revision. It represents a step
in a revision of all parts of the IEC 60679 series to include the test requirements of the IECQ
system. This edition is based on the relevant standards of that system.
The text of this standard is based on the following documents:
FDIS Report on voting
49/769/FDIS 49/776/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

– 6 – 60679-1 © IEC:2007(E)
A list of all parts of the IEC 60679 series, published under the general title Quartz crystal
controlled oscillators of assessed quality, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

60679-1 © IEC:2007(E) – 7 –
QUARTZ CRYSTAL CONTROLLED OSCILLATORS
OF ASSESSED QUALITY –
Part 1: Generic specification
1 Scope
This part of IEC 60679 specifies the methods of test and general requirements for quartz
crystal controlled oscillators of assessed quality using either capability approval or
qualification approval procedures.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050-561, International Electrotechnical Vocabulary (IEV) – Part 561: Piezoelectric
devices for frequency control and selection
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1 (1992)
IEC 60068-2-1, Environmental testing – Part 2: Tests – Tests A: Cold
IEC 60068-2-2, Environmental testing – Part 2: Tests – Tests B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-7, Environmental testing – Part 2: Tests – Test Ga and guidance: Acceleration,
steady state
IEC 60068-2-10, Environmental testing – Part 2-10: Tests – Test J and guidance: Mould
growth
IEC 60068-2-13, Environmental testing – Part 2: Tests – Test M: Low air pressure
IEC 60068-2-14, Environmental testing – Part 2: Tests – Test N: Change of temperature
IEC 60068-2-17, Environmental testing – Part 2: Tests – Test Q: Sealing
IEC 60068-2-20, Environmental testing – Part 2: Tests – Test T: Soldering
IEC 60068-2-21, Environmental testing – Part 2-21: Tests – Test U: Robustness of
terminations and integral mounting devices
IEC 60068-2-27, Environmental testing – Part 2: Tests – Test Ea and guidance: Shock
IEC 60068-2-29, Environmental testing – Part 2: Tests – Test Eb and guidance: Bump

– 8 – 60679-1 © IEC:2007(E)
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic (12h +
12 h cycle)
IEC 60068-2-32, Environmental testing – Part 2: Tests – Test Ed: Free fall
IEC 60068-2-45, Environmental testing – Part 2: Tests – Test XA and guidance: Immersion in
cleaning solvents
IEC 60068-2-52, Environmental testing – Part 2: Tests – Test Kb: Salt mist, cyclic (sodium
chloride solution)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-64, Environmental testing – Part 2: Test methods – Test Fh: Vibration,
broad-band random (digital control) and guidance
IEC 60068-2-78:2001, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat,
steady state
IEC 60469-1:1987, Pulse techniques and apparatus – Part 1: Pulse terms and definitions
IEC 60617-DB: 2001 , Graphical symbols for diagrams
IEC 60679-5, Quartz crystal controlled oscillators of assessed quality – Part 5: Sectional
specification – Qualification approval
IEC 61000-4-2, Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement
techniques - Electrostatic discharge immunity test
IECQ 01, IEC Quality Assessment System for Electronic Components (IECQ) – Basic Rules
IEC QC 001002-2:1998, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 2: Documentation
IEC QC 001002-3:1998, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 3: Approval procedures
ISO 1000, SI units and recommendations for the use of their multiples and of certain other
units
ITU-T G.810, Definitions and terminology for synchronization networks
ITU-T G.811: Timing characteristics of primary reference clocks
ITU-T G.812, Timing requirements of slave clocks suitable for use as node clocks in
synchronization networks
ITU-T G.813, Timing characteristics of SDH equipment slave clocks (SEC)
ITU-T G.825, The control of jitter and wander within digital networks which are based on the
synchronous digital hierarchy (SDH)
___________
“DB” refers to the IEC on-line database.

60679-1 © IEC:2007(E) – 9 –
ANSI T1.101, Synchronization Interface Standard
ANSI T1.105.03, Synchronous Optical Network (SONET) – Jitter and Wander at Network
Equipment Interfaces
ETSI EN 300 462 (all parts), Transmission and Multiplexing (TM); Generic requirements for
synchronization networks
Telcordia GR-253, Synchronous Optical Network (SONET) Transport Systems: Common
Generic Criteria
• Order of precedence
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
– detail specification;
– sectional specification;
– generic specification;
– any other international documents (for example of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
3 Terms, definitions and general information
3.1 General
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following standards:
IEC 60027
IEC 60050-561
IEC 60469-1
IEC 60617
ISO 1000
3.2 Definitions
For the purposes of this document, the following definitions apply.
3.2.1
simple packaged crystal oscillator
SPXO
crystal controlled oscillator having no means of temperature control or compensation,
exhibiting a frequency/temperature characteristic determined substantially by the piezoelectric
resonator employed
[IEV 561-04-01]
3.2.2
overtone crystal controlled oscillator
oscillator designed to operate with the controlling piezoelectric resonator functioning in a
specified mechanical overtone order of vibration
[IEV 561-04-02]
– 10 – 60679-1 © IEC:2007(E)
3.2.3
crystal cut
orientation of the crystal element with respect to the crystallographic axes of the crystal
NOTE This definition is included as it may be desirable to specify the cut (and hence the general form of the
frequency/temperature performance) of a crystal unit used in an oscillator application. The choice of the crystal cut
will imply certain attributes of the oscillator which may not otherwise appear in the detail specification.
3.2.4
voltage controlled crystal oscillator
VCXO
crystal controlled oscillator, the frequency of which can be deviated or modulated according to
a specified relation, by application of a control voltage
[IEV 561-04-03]
3.2.5
temperature compensated crystal oscillator
TCXO
crystal controlled oscillator whose frequency deviation due to temperature is reduced by
means of a compensation system, incorporated in the device
[IEV 561-04-04]
3.2.6
oven controlled crystal oscillator
OCXO
crystal controlled oscillator in which at least the piezoelectric resonator is temperature
controlled
[IEV 561-04-05]
NOTE This mode of operation ensures that the oscillator frequency will remain sensibly constant over the
operating temperature range of the OCXO, therefore independent of the frequency/temperature characteristic of
the crystal unit.
3.2.7
nominal frequency
frequency used to identify the crystal controlled oscillator
[IEV 561-04-06]
3.2.8
frequency tolerance
maximum permissible deviation of the oscillator frequency from a specified nominal value
when operating under specified conditions
[IEV 561-04-07]
NOTE Frequency tolerances are often assigned separately to specified ambient effects, namely electrical,
mechanical and environmental. When this approach is used, it is necessary to define the values of other operating
parameters as well as the range of the specified variable, that is to say:
– deviation from the frequency at the specified reference temperature due to operation over the specified
temperature range, other conditions remaining constant;
– deviation from the frequency at the specified supply voltage due to supply voltage changes over the specified
range, other conditions remaining constant;
– deviation from the initial frequency due to ageing, other conditions remaining constant;
– deviation from the frequency with specified load conditions due to changes in load impedance over the
specified range, other conditions remaining constant.
In some cases, an overall frequency tolerance may be specified, due to any/all combinations of operating
parameters, during a specified lifetime.

60679-1 © IEC:2007(E) – 11 –
3.2.9
frequency offset
frequency difference, positive or negative, which should be added to the specified nominal
frequency of the oscillator, when adjusting the oscillator frequency under a particular set of
operating conditions in order to minimize its deviation from nominal frequency over the
specified range of operating conditions
[IEV 561-04-08]
EXAMPLE In order to minimize the frequency deviation from nominal over the entire temperature range, a
frequency offset may be specified for adjustment at the reference temperature (see Figure 1).

F(T) with offset =ΔF at 25 °C
ΔF
Nominal frequency
F(T) with zero offset
Adjustment temperature
Operating temperature
–20 °C  70 °C
25 °C
ΔF
–ΔF
Operating temperature
–20 °C 25 °C
70 °C
during adjustment
IEC  445/07
Figure 1 – Example of the use of frequency offset
3.2.10
adjustment frequency
frequency to which an oscillator must be adjusted, under a particular combination of operating
conditions, in order to meet the frequency tolerance specification over the specified range of
operating conditions, i.e. adjustment frequency = nominal frequency + frequency offset
[IEV 561-04-09]
3.2.11
frequency adjustment range
range over which the oscillator frequency may be varied by means of some variable element,
for the purpose of:
Frequency offset Frequency
– 12 – 60679-1 © IEC:2007(E)
a) setting the frequency to a particular value, or
b) to correct the oscillator frequency to a prescribed value after deviation due to ageing, or
other changed conditions.
[IEV 561-04-10]
3.2.12
storage temperature range
minimum and maximum temperatures as measured on the enclosure at which the crystal
controlled oscillator may be stored without deterioration or damage to its performance
3.2.13
operating temperature range
range of temperature over which the oscillator will function, maintaining frequency and other
output signal characteristics within specified tolerances
[IEV 561-04-11]
3.2.14
operable temperature range
range of temperature over which the oscillator will continue to provide an output signal,
though not necessarily within the specified tolerances of frequency, level, waveform, etc.
[IEV 561-04-12]
3.2.15
reference temperature
temperature at which certain oscillator performance parameters are measured, normally 25 °C
± 2 °C
3.2.16
reference point temperature
temperature measured at a specific reference point relative to the oscillator
3.2.17
thermal transient frequency stability
oscillator frequency time response when ambient temperature is changed from one specific
temperature to another with a specific rate
3.2.18
stabilization time
time, measured from the initial application of power, required for a crystal controlled oscillator
to stabilize its operation within specified limits
[IEV 561-04-13]
3.2.19
frequency/voltage coefficient
fractional change in output frequency resulting from an incremental change in supply voltage,
other parameters remaining unchanged
[IEV 561-04-14]
NOTE In the case of OCXOs, a considerable time may elapse before the full effect of a supply voltage change is
observed, as the temperature of the oven may drift gradually to a new value following the voltage perturbation.
3.2.20
frequency/load coefficient
fractional change in output frequency resulting from an incremental change in electrical load
impedance, other parameters remaining unchanged

60679-1 © IEC:2007(E) – 13 –
[IEV 561-04-15]
3.2.21
long-term frequency stability (frequency ageing)
relationship between oscillator frequency and time. This long-term frequency drift is caused
by secular changes in the crystal unit and/or other elements of the oscillator circuit, and
should be expressed as fractional change in mean frequency per specified time interval.
3.2.22
short-term frequency stability
random fluctuations of the frequency of an oscillator over short periods of time
[IEV 561-04-16]
3.2.23
Allan variance of fractional frequency fluctuation
unbiased estimate of the preferred definition in the time domain of the short-term stability
characteristic of the oscillator output frequency:
M −1
(Y − Y )
2 1
k + k
σ (τ ) ≅
y ∑
M − 1 2
k =1
where
Y are the average fractional frequency fluctuations obtained sequentially, with no systematic
k
dead time between measurements;
τ is the sample time over which measurements is averaged;
M is the number of measurements.
The confidence of the estimate improves as M increases.
3.2.24
r.m.s. fractional frequency fluctuation
measure in the time domain of the short-term frequency stability of an oscillator, based on the
statistical properties of a number of frequency measurements, each representing an average
of the frequency over the specified sampling interval τ. The preferred measure of fractional
frequency fluctuation is:
M −1 2
⎡ ⎤
ΔF 1
2 2
()τσ= ()YY− = (τ)
rms ⎢ ∑ k +1 k ⎥ []y
FM21()−
⎣ k =1 ⎦
3.2.25
phase noise
frequency-domain measure of the short-term frequency stability of an oscillator, normally
expressed as the power spectral density of the phase fluctuations, Sφ(f), where the phase
fluctuation function is φ(t)=2π Ft-2πF t. The spectral density of phase fluctuation can be
directly related to the spectral density of frequency fluctuation by
⎛ ⎞
F
２
Sf() = Sf()
⎜ ⎟ rad /Hz
ϕ y
⎝ f⎠
where
F is the oscillator frequency;
F is the average oscillator frequency;
f is the Fourier frequency.
– 14 – 60679-1 © IEC:2007(E)
3.2.26
spectral purity
measure of frequency stability in the frequency domain usually represented as the signal side
noise power spectrum expressed in decibels relative to total signal power, per hertz
bandwidth. It includes non-deterministic noise power, harmonic distortion components and
spurious single frequency interferences
3.2.27
incidental frequency modulation
optional measure of frequency stability in the frequency domain, best described in terms of
the spectrum of the resultant base-band signal obtained by applying the oscillator signal to an
ideal discriminator circuit of specified characteristics. lf the detection bandwidth is adequately
specified, the incidental frequency modulation may be expressed as a fractional proportion of
–8
the output frequency (for example 2×10 r.m.s. in a 10 kHz band)
3.2.28
amplitude modulation distortion
non-linear distortion in which the relative magnitudes of the spectral components of the
modulating signal waveform are modified. It is also commonly known as frequency distortion,
amplitude distortion and amplitude/ frequency distortion
3.2.29
linearity of frequency modulation deviation
measure of the transfer characteristic of a modulation system as compared to an ideal
(straight line) function, usually expressed as an allowable non-linearity in per cent of the
specified full range deviation. Modulation linearity can also be expressed in terms of the
permissible distortion of base-band signals produced by the modulation device (for example,
intermediation and harmonic distortion products not to exceed –40 dB relative to the total
modulating signal power)
EXAMPLE: Figure 2 is a plot of the output frequen
...