EN 60191-4:2014

SLOVENSKI STANDARD
01-maj-2014
1DGRPHãþD
SIST EN 60191-4:2002
SIST EN 60191-4:2002/A1:2005
SIST EN 60191-4:2002/A2:2005
Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni
sistem in klasifikacija oblik okrovov polprevodniških elementov (IEC 60191-4:2013)
Mechanical standardization of semiconductor devices - Part 4: Coding system and
classification into forms of package outlines for semiconductor device packages
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für
Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für
Halbleiterbauelemente
Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de
codification et classification en formes des boîtiers pour dispositifs à semiconducteurs
Ta slovenski standard je istoveten z: EN 60191-4:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60191-4
NORME EUROPÉENNE
March 2014
EUROPÄISCHE NORM
ICS 31.080 Supersedes EN 60191-4:1999 + A1:2002 + A2:2002

English version
Mechanical standardization of semiconductor devices -
Part 4: Coding system and classification into forms of package outlines
for semiconductor device packages
(IEC 60191-4:2013)
Normalisation mécanique des dispositifs à Mechanische Normung von
semiconducteurs - Halbleiterbauelementen -
Partie 4: Système de codification et Teil 4: Codierungssystem für Gehäuse
classification en formes des boîtiers pour und Eingruppierung der Gehäuse nach
dispositifs à semiconducteurs der Gehäuseform für
(CEI 60191-4:2013) Halbleiterbauelemente
(IEC 60191-4:2013)
This European Standard was approved by CENELEC on 2013-11-14. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2014 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-4:2014 E
Foreword
The text of document 47D/837/FDIS, future edition 3 of IEC 60191-4, prepared by SC 47D,
Semiconductor devices packaging, of IEC TC 47, Semiconductor devices, was submitted to the IEC-
CENELEC parallel vote and was approved by CENELEC as EN 60191-4:2014.
The following dates were fixed:
– latest date by which the EN has to be implemented (dop) 2014-09-21
at national level by publication of an identical
national standard or by endorsement
– latest date by which the national standards conflicting (dow) 2016-11-14
with the EN have to be withdrawn
This European Standard supersedes EN 60191-4:1999 and its Amendments A1:2002 and A2:2002.
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 60191-4:2013 was approved by CENELEC as a European
Standard without any modification.

IEC 60191-4 ®
Edition 3.0 2013-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –

Part 4: Coding system and classification into forms of package outlines for

semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –

Partie 4: Système de codification et classification en formes des structures des

boîtiers pour dispositifs à semiconducteurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX T
ICS 31.080 ISBN 978-2-8322-1155-7

– 2 – 60191-4  IEC:2013
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Coding system of package outlines for semiconductor devices . 5
3 Classification into forms of package outlines for semiconductor devices . 5
4 Coding system for semiconductor-device packages . 6
4.1 General . 6
4.2 New descriptive codes . 6
4.3 Descriptive designators . 6
4.3.1 General remarks . 6
4.3.2 Minimum descriptive designator . 6
4.3.3 Terminal-position prefix. 8
4.3.4 Package-body-material prefix . 8
4.3.5 Package-specific feature prefix . 9
4.3.6 Lead-form and terminal-count suffixes . 9
4.3.7 Detailed information field . 11
5 Coding system of package-outline styles . 12
Annex A (informative) Examples of descriptive coding system application . 15
Annex B (informative) Derivation and application of the descriptive coding system –
Common package names . 22

Figure 1 – Descriptive coding for semiconductor device packages . 7
Figure 2 – Relationship of codes to profile . 10
Figure A.1 – Typical package styles and descriptive coding system (1 of 4) . 17
Figure A.2 – Examples of lead forms (or terminal shapes) . 21
Figure B.1 – Descriptive coding system for common name of semiconductor-device
package . 22

Table 1 – Package-outline-style codes. 8
Table 2 – Terminal-position prefixes . 9
Table 3 – Prefixes for predominant package-body material . 10
Table 4 – Prefixes for package-specific features . 10
Table 5 – Suffixes for lead form (or terminal shape) . 12
Table A.1 – Descriptive coding system application . 16
Table B.1 – Basic package code and names . 23
Table B.2 – Common package name and descriptive code examples . 24

60191-4  IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 4: Coding system and classification into forms of package
outlines for semiconductor device packages

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-4 has been prepared by subcommittee 47D: Semiconductor
devices packaging, of IEC technical committee 47: Semiconductor devices.
This third edition cancels and replaces the second edition published in 1999,
Amendment 1:2001 and Amendment 2:2002.This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.

– 4 – 60191-4  IEC:2013
The text of this standard is based on the following documents:
FDIS Report on voting
47D/837/FDIS 47D/848/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, published under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "h
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