EN 61189-3:1997/A1:1999
(Amendment)Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN following parallel vote
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
General Information
- Status
- Withdrawn
- Publication Date
- 06-Sep-1999
- Withdrawal Date
- 31-Jul-2002
- Technical Committee
- CLC/SR 91 - Electronics assembly technology
- Drafting Committee
- IEC/TC 91 - IEC_TC_91
- Parallel Committee
- IEC/TC 91 - IEC_TC_91
- Current Stage
- 9960 - Withdrawal effective - Withdrawal
- Start Date
- 01-Dec-2010
- Completion Date
- 01-Dec-2010
Relations
- Effective Date
- 28-Jan-2023
- Effective Date
- 28-Jan-2023
Frequently Asked Questions
EN 61189-3:1997/A1:1999 is a amendment published by CLC. Its full title is "Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)". This standard covers: EN following parallel vote
EN following parallel vote
EN 61189-3:1997/A1:1999 is classified under the following ICS (International Classification for Standards) categories: 31.180 - Printed circuits and boards. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 61189-3:1997/A1:1999 has the following relationships with other standards: It is inter standard links to EN 61189-3:2008, EN 61189-3:1997. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 61189-3:1997/A1:1999 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI STANDARD
01-marec-2001
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies - Part 3: Test methods for interconnection structures
(printed boards)
Test methods for electrical materials, printed boards and other interconnection structures
and assemblies -- Part 3: Test methods for interconnection structures (printed boards)
Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen
und Baugruppen -- Teil 3: Prüfverfahren für Verbindungsstrukturen (Leiterplatten)
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles -- Partie 3: Méthodes d'essai des structures
d'interconnexion (cartes imprimées)
Ta slovenski standard je istoveten z: EN 61189-3:1997/A1:1999
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
...
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