Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting

Defines a standard test method to assess the ability of the terminations of a connector to remain covered with solder when being brought into contact with molten solder under specified conditions.

Steckverbinder für elektronische Einrichtungen - Mess- und Prüfverfahren - Teil 12-3: Prüfungen der Lötbarkeit - Prüfung 12c: Lötbarkeit, Entnetzung

Connecteurs pour équipements électroniques - Essais et mesures - Partie 12-3: Tests de soudure - Essai 12c: Soudabilité, démouillage

Définit une méthode d'essai normalisée pour évaluer la capacité des terminaisons d'un connecteur à demeurer recouvertes de brasure lorsqu'on les met en contact avec une brasure fondue dans des conditions spécifiées.

Konektorji za elektronsko opremo – Preskusi in meritve – 12-3. del: Spajkalni preskusi – Preskus 12c: Spajkljivost, sušenje (IEC 60512-12-3:2006)

General Information

Status
Published
Publication Date
22-Mar-2006
Withdrawal Date
28-Feb-2009
Technical Committee
CLC/SR 48B - Connectors
Drafting Committee
IEC/SC 48B - IEC_SC_48B
Parallel Committee
IEC/SC 48B - IEC_SC_48B
Current Stage
6060 - Document made available - Publishing
Start Date
23-Mar-2006
Completion Date
23-Mar-2006

Overview

EN 60512-12-3:2006 (CENELEC / IEC) defines Test 12c: Solderability, de-wetting for connectors used in electronic equipment. The standard establishes a repeatable test method to assess the ability of connector terminations to remain covered with molten solder under specified conditions. Test 12c is normally applied following a prior wetting (solderability) test and is intended for use in design validation, quality assurance and production control when required by a detail specification.

Key Topics

  • Objective: Verify that terminations do not de-wet when contacted with molten solder and remain sufficiently covered.
  • Applicability: Used for connectors and similar devices when specified by a detail specification; follows IEC 60512-12-1 or IEC 60512-12-2 wetting tests if required.
  • Referenced procedures: The de-wetting procedure is carried out in accordance with IEC 60068-2-58 (Test Td) for immersion and handling.
  • Test sequence: The de-wetting test consists of two immersions of 5 s each, performed as specified in IEC 60068-2-58.
  • Inspection and acceptance: Visual examination is performed per IEC 60512-1-1. Final soldered surfaces are examined at 10× magnification. A surface is considered not to have de-wetted if 95% of the solder area is covered with a smooth, bright, uniform, adherent coating of solder; up to 5% may show pinholes, voids or isolated grainy areas provided they are not concentrated.

Applications

This standard provides practical value across several stages of connector lifecycle:

  • Production quality control: Confirm solderability performance for batch acceptance and process monitoring.
  • Design validation: Evaluate termination finishes and plating choices against de-wetting risk before production ramp-up.
  • Supplier qualification: Use the test as part of incoming inspection criteria for connector components.
  • Process troubleshooting: Diagnose issues related to flux, immersion technique or termination contamination when solder coverage is inconsistent.

Benefits include improved solder joint reliability, clearer acceptance criteria for inspections, and harmonized testing procedures across manufacturers and test labs.

Related Standards

  • IEC 60068-2-58 - Environmental testing, Test Td: test methods for solderability and resistance to dissolution (procedural reference for immersion and timings).
  • IEC 60512-12-1 - Solderability, wetting (solder bath method) - often precedes Test 12c.
  • IEC 60512-12-2 - Solderability, wetting (soldering iron method) - alternative wetting test.
  • IEC 60512-1-1 - General visual examination for connectors used to assess pre- and post-test condition.

When this test is required by a detail specification, any deviations from the method and relevant prior wetting test details should be stated explicitly. Following EN 60512-12-3:2006 enables consistent, comparable solderability (de-wetting) assessment for connector terminations and supports robust manufacturing and QA practices.

Frequently Asked Questions

EN 60512-12-3:2006 is a standard published by CLC. Its full title is "Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting". This standard covers: Defines a standard test method to assess the ability of the terminations of a connector to remain covered with solder when being brought into contact with molten solder under specified conditions.

Defines a standard test method to assess the ability of the terminations of a connector to remain covered with solder when being brought into contact with molten solder under specified conditions.

EN 60512-12-3:2006 is classified under the following ICS (International Classification for Standards) categories: 31.220.10 - Plug-and-socket devices. Connectors. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 60512-12-3:2006 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


STANDARDKonektorji za elektronsko opremo – Preskusi in meritve – 12-3. del: Spajkalni preskusi – Preskus 12c: Spajkljivost, sušenje (IEC 60512-12-3:2006)Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006)©
Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljenoReferenčna številkaSIST EN 60512-12-3:2006(en)ICS31.220.10

EUROPEAN STANDARD EN 60512-12-3 NORME EUROPÉENNE
EUROPÄISCHE NORM March 2006
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60512-12-3:2006 E
ICS 31.220.10
English version
Connectors for electronic equipment -
Tests and measurements Part 12-3: Soldering tests -
Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006)
Connecteurs pour équipements électroniques -
Essais et mesures Partie 12-3: Tests de soudure -
Essai 12c: Soudabilité, démouillage (CEI 60512-12-3:2006)
Steckverbinder für elektronische Einrichtungen -
Mess- und Prüfverfahren Teil 12-3: Prüfungen der Lötbarkeit - Prüfung 12c: Lötbarkeit, Entnetzung (IEC 60512-12-3:2006)
This European Standard was approved by CENELEC on 2006-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

- 2 - Foreword The text of document 48B/1578/FDIS, future edition 1 of IEC 60512-12-3, prepared by SC 48B, Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60512-12-3 on 2006-03-01. This standard is to be read in conjunction with EN 60512-1 and EN 60512-1-100 which explains the structure of the EN 60512 series.
The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop) 2006-12-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow) 2009-03-01 This European Standard makes reference to International Standards. Where the International Standard referred to has been endorsed as a European Standard or a home-grown European Standard exists, this European Standard shall be applied instead. Pertinent information can be found on the CENELEC web site. __________ Endorsement notice The text of the International Standard IEC 60512-12-3:2006 was approved by CENELEC as a European Standard without any modification. __________

NORME INTERNATIONALECEIIEC INTERNATIONAL STANDARD 60512-12-3Première éditionFirst edition2006-02 Connecteurs pour équipements électroniques – Essais et mesures – Partie 12-3: Essais de soudure – Essai 12c: Soudabilité, démouillage
Connectors for electronic equipment – Tests and measurements – Part 12-3: Soldering tests – Test 12c: Solderability, de-wetting
Pour prix, voir catalogue en vigueur For price, see current catalogue IEC 2006
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3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch
Web: www.iec.ch CODE PRIX PRICE CODE E Commission Electrotechnique InternationaleInternational Electrotechnical Commission

60512-12-3  IEC:2006 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
CONNECTORS FOR ELECTRONIC EQUIPMENT – TESTS AND MEASUREMENTS –
Part 12-3: Soldering tests –
Test 12c: Solderability, de-wetting
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any e
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