EN 60512-12-1:2006
(Main)Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
Details a standard test method to assess the solderability of the terminations of a connector designed for use with printed boards or for other applications using similar soldering techniques.
Steckverbinder für elektronische Einrichtungen - Mess- und Prüfverfahren - Teil 12-1: Prüfungen der Lötbarkeit - Prüfung 12a: Lötbarkeit, Lötbadverfahren
Connecteurs pour équipements électroniques - Essais et mesures - Partie 12-1: Essais de soudure - Essai 12a: Soudabilité, mouillage, méthode du bain d'alliage
Décrit de manière détaillée une méthode d'essai normalisée d'évaluation de la soudabilité des sorties d'un connecteur pour utilisation avec des cartes imprimées ou d'autres applications utilisant des techniques de soudage similaires.
Konektorji za elektronsko opremo – Preskusi in meritve – 12-1. del: Spajkalni preskusi – Preskus 12a: Spajkljivost, ovlaženje, metoda s spajkalno banjico (IEC 60512-12-1:2006)
General Information
- Status
- Published
- Publication Date
- 17-May-2006
- Withdrawal Date
- 31-Mar-2009
- Technical Committee
- CLC/SR 48B - Connectors
- Drafting Committee
- IEC/SC 48B - IEC_SC_48B
- Parallel Committee
- IEC/SC 48B - IEC_SC_48B
- Current Stage
- 6060 - Document made available - Publishing
- Start Date
- 18-May-2006
- Completion Date
- 18-May-2006
Relations
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Refers
HD 323.2.20 S3:1988 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering - Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
- Effective Date
- 03-Feb-2026
Overview
EN 60512-12-1:2006, titled Connectors for electronic equipment – Tests and measurements – Part 12-1: Soldering tests – Test 12a: Solderability, wetting, solder bath method, is a European standard developed by the CLC (CENELEC). This standard specifies a consistent test method for assessing the solderability and wetting characteristics of connector terminations intended for use with printed circuit boards (PCBs) or in applications utilizing similar soldering techniques. The procedure-commonly referred to as the solder bath method-provides manufacturers, test laboratories, and quality assurance teams with a way to verify the ability of connector surfaces to accept solder during assembly processes.
Adhering to EN 60512-12-1:2006 ensures connectors meet performance criteria necessary for reliable electrical connections, supporting robust electronic device manufacturing and assembly.
Key Topics
EN 60512-12-1:2006 covers the following essential areas:
- Solderability Assessment: Establishes procedures to evaluate the capacity of connector terminations to be wetted by molten solder using immersion in a controlled solder bath.
- Wetting Performance: Details examination methods, including coverage and uniformity parameters for solder-coated surfaces, judged by optical inspection.
- Test Conditions: Specifies solder bath temperature, immersion time, flux requirements, and other critical test variables.
- Specimen Preparation and Conditioning: Describes requirements for preparing connectors, including considerations surrounding cleaning, pre-ageing, and insulating screens.
- Acceptance Criteria: Outlines minimum standards for solder coverage, defect tolerances (such as pinholes or de-wetting), and documentation of results.
- Customization for Detail Specifications: Advises on the details that should be specified when integrating this test into specific product standards, such as areas to be tested and any deviations from the preferred method.
Applications
EN 60512-12-1:2006 has broad practical value in the electronics and electrical engineering industries, especially where connectors are a critical component:
- Connector Manufacturing: Ensures that products leaving the factory floor are capable of reliable soldering during assembly, reducing rework and field failures.
- Quality Assurance and Compliance: Supports systematic inspection and qualification procedures for both individual batches and ongoing production.
- Research and Development: Assists design engineers in selecting proper terminations or surface finishes for new connector products aiming for optimal soldering outcomes.
- Supplier and Contract Manufacturer Evaluation: Serves as a reference for procurement teams to specify solderability requirements in purchasing agreements and supplier audits.
- Component Certification and Standardization: Facilitates alignment with European and international expectations for connector components used in various types of electronic equipment, including automotive, industrial, consumer electronics, and telecommunications.
Related Standards
To implement EN 60512-12-1:2006 effectively, familiarity with related standards is beneficial:
- EN 60512-1-1 / IEC 60512-1-1: General examination and visual inspection requirements for connectors.
- EN 60512-1-100: Provides details on the structure and application of the EN 60512 series.
- EN 60068-2-20 / IEC 60068-2-20: Standard for basic environmental soldering tests, referenced for test bath preparation and flux specifics.
- EN 60068-2-58 / IEC 60068-2-58: Focuses on test methods for solderability and resistance to soldering heat, particularly for surface mounting devices (SMD).
Adopting EN 60512-12-1:2006 as part of an organization’s quality and compliance framework for electronic connectors strengthens product reliability and conformity with international solderability standards.
Frequently Asked Questions
EN 60512-12-1:2006 is a standard published by CLC. Its full title is "Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method". This standard covers: Details a standard test method to assess the solderability of the terminations of a connector designed for use with printed boards or for other applications using similar soldering techniques.
Details a standard test method to assess the solderability of the terminations of a connector designed for use with printed boards or for other applications using similar soldering techniques.
EN 60512-12-1:2006 is classified under the following ICS (International Classification for Standards) categories: 31.220.10 - Plug-and-socket devices. Connectors. The ICS classification helps identify the subject area and facilitates finding related standards.
EN 60512-12-1:2006 has the following relationships with other standards: It is inter standard links to EN 60512-1-1:2002, EN 60068-2-58:2004, HD 323.2.20 S3:1988, EN IEC 61076-2-111:2026, EN 60512-12-3:2006, EN 62790:2015. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
EN 60512-12-1:2006 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
SLOVENSKI SIST EN 60512-12-1:2006
STANDARD
oct 2006
Konektorji za elektronsko opremo – Preskusi in meritve – 12-1. del: Spajkalni
preskusi – Preskus 12a: Spajkljivost, ovlaženje, metoda s spajkalno banjico
(IEC 60512-12-1:2006)
Connectors for electronic equipment – Tests and measurements – Part 12-1:
Soldering tests – Test 12a: Solderability, wetting, solder bath method (IEC 60512-
12- 1:2006)
ICS 31.220.10 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD
EN 60512-12-1
NORME EUROPÉENNE
May 2006
EUROPÄISCHE NORM
ICS 31.220.10
English version
Connectors for electronic equipment -
Tests and measurements
Part 12-1: Soldering tests -
Test 12a: Solderability, wetting, solder bath method
(IEC 60512-12-1:2006)
Connecteurs pour équipements Steckverbinder für elektronische
électroniques - Essais et mesures Einrichtungen -
Partie 12-1: Essais de soudure - Mess- und Prüfverfahren
Essai 12a: Soudabilité, mouillage, Teil 12-1: Prüfungen der Lötbarkeit -
méthode du bain d'alliage Prüfung 12a: Lötbarkeit, Lötbadverfahren
(CEI 60512-12-1:2006) (IEC 60512-12-1:2006)
This European Standard was approved by CENELEC on 2006-04-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60512-12-1:2006 E
Foreword
The text of document 48B/1604/FDIS, future edition 1 of IEC 60512-12-1, prepared by SC 48B,
Connectors, of IEC TC 48, Electromechanical components and mechanical structures for electronic
equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
EN 60512-12-1 on 2006-04-01.
This standard is to be read in conjunction with EN 60512-1 and EN 60512-1-100 which explains the
structure of the EN 60512 series.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-01-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-04-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60512-12-1:2006 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60512-12-1:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60512-1-1 – Connectors for electronic equipment - Tests EN 60512-1-1 2002
and measurements
Part 1-1: General examination - Test 1a:
Visual examination
3)
IEC 60068-2-20 1979 Basic environmental testing procedures HD 323.2.20 S3 1988
Part 2: Tests - Test T: Soldering
1) 2)
IEC 60068-2-58 – Environmental testing EN 60068-2-58 2004
Part 2-58: Tests - Test Td: Test methods for + corr. December 2004
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
1)
Undated reference.
2)
Valid edition at date of issue.
3)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20.
NORME CEI
INTERNATIONALE
IEC
60512-12-1
INTERNATIONAL
Première édition
STANDARD
First edition
2006-03
Connecteurs pour équipements électroniques –
Essais et mesures –
Partie 12-1:
Essais de soudure –
Essai 12a: Soudabilité, mouillage,
méthode du bain d'alliage
Connectors for electronic equipment –
Tests and measurements –
Part 12-1:
Soldering tests –
Test 12a: Solderability, wetting,
solder bath method
IEC 2006 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
F
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue
60512-12-1 IEC:2006 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
CONNECTORS FOR ELECTRONIC EQUIPMENT
TESTS AND MEASUREMENTS –
Part 12-1: Soldering tests –
Test 12a: Solderability, wetting, solder bath method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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