FprEN IEC 60115-8:2025

SLOVENSKI STANDARD
oSIST prEN IEC 60115-8:2024
01-december-2024
Stalni upori za elektronsko opremo - 8. del: Področna specifikacija - Fiksni upori
za površinsko montažo
Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed
surface mount resistors
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 8:
Rahmenspezifikation - Oberflächenmontierbare (SMD) Festwiderstände
Résistances fixes utilisées dans les équipements électroniques - Partie 8: Spécification
intermédiaire - Résistances fixes pour montage en surface
Ta slovenski standard je istoveten z: prEN IEC 60115-8:2024
ICS:
31.040.10 Fiksni upor Fixed resistors
oSIST prEN IEC 60115-8:2024 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 60115-8:2024
oSIST prEN IEC 60115-8:2024
EUROPEAN STANDARD DRAFT
prEN IEC 60115-8
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2024
ICS 31.040.10 Will supersede EN 60115-8:2012
English Version
Fixed resistors for use in electronic equipment - Part 8: Sectional
specification - Fixed surface mount resistors
(IEC 60115-8:2023)
Résistances fixes utilisées dans les équipements Festwiderstände zur Verwendung in Geräten der Elektronik
électroniques - Partie 8: Spécification intermédiaire - - Teil 8: Rahmenspezifikation - Oberflächenmontierbare
Résistances fixes pour montage en surface (SMD) Festwiderstände
(IEC 60115-8:2023) (IEC 60115-8:2023)
This draft European Standard is submitted to CENELEC members for enquiry.
Deadline for CENELEC: 2025-01-03.

The text of this draft consists of the text of IEC 60115-8:2023 (40/2973/CDV).

If this draft becomes a European Standard, CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

This draft European Standard was established by CENELEC in three official versions (English, French, German).
A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.

Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Project: 79287 Ref. No. prEN IEC 60115-8:2024 E

oSIST prEN IEC 60115-8:2024
prEN IEC 60115-8:2024 (E)
European foreword
This document (prEN IEC 60115-8:2024) consists of the text of document IEC 60115-8:2023, prepared
by IEC/TC 40 "Capacitors and resistors for electronic equipment".
This document is currently submitted to the Enquiry.
The following dates are proposed:
• latest date by which the existence of this document (doa) dor + 6 months
has to be announced at national level
• latest date by which this document has to be (dop) dor + 12 months
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) dor + 36 months
conflicting with this document have to be withdrawn (to be confirmed or
modified when voting)
This document will supersede EN 60115-8:2012 and all its amendments and corrigenda (if any).
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure of the generic specification EN 60115-1:2023, where
the tests of prior Clause 4 are given in Clauses 6 to 12 now;
b) the definitions of product technologies and product classification levels of the generic specification,
EN 60115-1:2023, have been adopted;
c) the preferred styles and their respective dimensions given in Tables 1a and 1b have been reviewed
and amended for the presentation of styles and dimensions for rectangular (RR), transverse (RT),
and cylindrical (RC) shapes, plus special styles and dimensions for SMD wirewound (RW) resistors
in Tables 1 through 4;
d) the specifications of recommended test boards have been reviewed and amended to support the
preferred styles RR, RT and RC in 5.2.2.2, with supporting information on the measurement of
temperature rise given in Annex F and Annex G;
e) the ‘periodic-pulse high-voltage overload test’ of EN 60115-1:2023, 8.3 has been adopted as default
test method in 5.3.8, thereby replacing the legacy test ‘periodic-pulse overload test’ of EN 60115-
1:2023, 8.4;
f) the revised solderability test of EN 60115-1:2023, 11.1 has been adopted in 5.3.21 and 5.3.22;
g) the combined solvent resistance test of EN 60115-1:2023, 11.3 has been adopted in in 5.3.24;
h) the ‘single-pulse high-voltage overload test’ of EN 60115-1:2023, 8.2, applied with the pulse shape
10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse shape 1,2/50
in 5.4.1;
i) climatic tests for ‘operation at low temperature’ of EN 60115-1:2023, 10.2, and for ‘damp heat,
steady state, accelerated’ of EN 60115-1:2023, 10.5, have been adopted as optional tests in 5.4.3.
and 5.4.4, respectively;
oSIST prEN IEC 60115-8:2024
prEN IEC 60115-2:2024 (E)
j) new guidance is provided in 6.2 on the presentation of stability requirements with their permissible
absolute and relative deviations;
k) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
l) visual examination for the primary and proximity packaging has been added in 6.5.3 and in 7.2
m) the periodical evaluation of termination platings has been added as a new topic of quality
assessment in 9.8;
n) a new Annex C has been added to summarize workmanship requirements for the assembly of
leaded film resistors, e.g. as given in the prior IEC 61192 series of standards;
Preceding documents on the subject covered by this specification have been:
— EN 140400:2003, EN 140400:1996 + EN 140400:1996/A1:2001 + EN 140400:1996/COR:1997-07
— CECC 40 400:1989-00.
oSIST prEN IEC 60115-8:2024
oSIST prEN IEC 60115-8:2024
IEC 60115-8 ®
Edition 3.0 2023-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Fixed resistors for use in electronic equipment –

Part 8: Sectional specification: Fixed surface mount resistors

Résistances fixes utilisées dans les équipements électroniques –

Partie 8: Spécification intermédiaire: Résistances fixes pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.040.10  ISBN 978-2-8322-7437-8

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CONTENTS
FOREWORD . 8
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, product technologies and product classification . 12
3.1 Terms and definitions . 12
3.2 Product technologies . 12
3.3 Product classification . 13
4 Preferred characteristics . 13
4.1 General . 13
4.2 Style and dimensions . 13
4.2.1 Preferred styles and outline dimensions for rectangular (RR) resistors . 13
4.2.2 Preferred styles and outline dimensions for transverse (RT) resistors . 14
4.2.3 Preferred styles and outline dimensions for cylindrical (RC) resistors . 15
4.2.4 Preferred styles and outline dimensions for wire-wound (RW) resistors . 16
4.3 Preferred climatic categories . 17
4.4 Resistance . 17
4.5 Tolerances on resistance . 17
4.6 Rated dissipation P . 17
4.7 Limiting element voltage U . 18
max
4.8 Insulation voltage U . 18
ins
4.9 Insulation resistance R . 18
ins
5 Tests and test severities . 18
5.1 General provisions for tests invoked by this document . 18
5.2 Preparation of specimens . 19
5.2.1 Drying . 19
5.2.2 Mounting of components on test boards . 19
5.3 Tests . 25
5.3.1 Resistance . 25
5.3.2 Temperature coefficient of resistance . 25
5.3.3 Temperature rise . 26
5.3.4 Endurance at the rated temperature 70 °C . 26
5.3.5 Endurance at a maximum temperature: UCT . 26
5.3.6 Short-term overload . 27
5.3.7 Single-pulse high-voltage overload test . 27
5.3.8 Periodic-pulse high-voltage overload test . 28
5.3.9 Electrostatic discharge (ESD) test . 29
5.3.10 Visual examination . 29
5.3.11 Gauging of dimensions . 29
5.3.12 Detail dimensions . 30
5.3.13 Shear (adhesion) test . 30
5.3.14 Substrate bending test . 30
5.3.15 Shock . 31
5.3.16 Vibration . 31
5.3.17 Rapid change of temperature . 31
5.3.18 Rapid change of temperature, ≥ 100 cycles . 31
5.3.19 Climatic sequence . 31

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5.3.20 Damp heat, steady state . 32
5.3.21 Solderability, with lead-free solder . 33
5.3.22 Solderability, with SnPb solder . 33
5.3.23 Resistance to soldering heat . 34
5.3.24 Solvent resistance . 34
5.3.25 Insulation resistance . 34
5.3.26 Voltage proof . 34
5.3.27 Flammability test . 35
5.4 Optional and/or additional tests . 35
5.4.1 Single-pulse high-voltage overload test . 35
5.4.2 Periodic-pulse overload test . 35
5.4.3 Operation at low temperature. 36
5.4.4 Damp heat, steady state, accelerated . 36
6 Performance requirements. 37
6.1 General . 37
6.2 Limits for change of resistance at tests . 37
6.3 Temperature coefficient of resistance . 40
6.4 Temperature rise . 40
6.5 Visual examination . 41
6.5.1 General visual criteria . 41
6.5.2 Visual criteria after tests . 41
6.5.3 Visual criteria for the packaging . 41
6.6 Solderability . 41
6.7 Insulation resistance . 42
6.8 Flammability . 42
7 Marking, packaging and ordering information . 42
7.1 Marking of the component . 42
7.2 Packaging . 42
7.3 Marking of the packaging . 42
7.4 Ordering information . 42
8 Detail specifications . 43
8.1 General . 43
8.2 Information to be specified in a detail specification . 43
8.2.1 Outline drawing or illustration . 43
8.2.2 Style and dimensions . 43
8.2.3 Climatic category . 43
8.2.4 Resistance range . 44
8.2.5 Tolerances on resistance . 44
8.2.6 Rated dissipation P . 44
8.2.7 Limiting element voltage U . 44
max
8.2.8 Insulation voltage U . 44
ins
8.2.9 Insulation resistance R . 44
ins
8.2.10 Test severities . 44
8.2.11 Limits of resistance change after testing . 44
8.2.12 Temperature coefficient of resistance . 44
8.2.13 Marking . 45
8.2.14 Ordering information . 45
8.2.15 Mounting . 45

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8.2.16 Storage. 45
8.2.17 Transportation . 45
8.2.18 Additional information . 45
8.2.19 Quality assessment procedures . 45
8.2.20 0 Ω Resistors . 45
9 Quality assessment procedures . 45
9.1 General . 45
9.2 Definitions. 46
9.2.1 Primary stage of manufacture . 46
9.2.2 Structurally similar components . 46
9.2.3 Assessment level EZ . 46
9.3 Formation of inspection lots . 46
9.4 Approved component (IECQ AC) procedures . 47
9.5 Qualification approval (QA) procedures . 47
9.5.1 General . 47
9.5.2 Qualification approval . 47
9.5.3 Quality conformance inspection . 48
9.6 Capability certification (IECQ AC-C) procedures . 48
9.7 Technology certification (IECQ-AC-TC) procedures . 48
9.8 Periodical evaluation of termination plating . 48
9.9 Delayed delivery . 48
9.10 Certified test records. 48
9.11 Certificate of conformity (CoC) . 48
Annex A (normative) Symbols and abbreviated terms . 60
A.1 Symbols . 60
A.2 Abbreviated terms . 62
Annex B (normative) Visual examination criteria . 63
B.1 General . 63
B.2 Criteria for general visual examination of body of specimens . 63
B.3 Criteria for general visual examination of electrode of specimen . 64
B.4 Criteria for general visual examination of marking of specimen . 64
B.5 Criteria for packaging . 65
Annex C (informative) Workmanship requirements for the assembly of SMD resistors . 66
C.1 General . 66
C.2 Out of alignment from solder pad . 66
C.3 Formation of fillet . 67
C.3.1 Function of the fillet . 67
C.3.2 Rectangular (RR) and transverse (RT) resistors . 67
C.3.3 Cylindrical (RC) resistors . 68
C.4 Thickness of solder paste between the pad and electrode . 69
C.5 Solder ball . 70
Annex D (normative) 0 Ω resistors (jumpers). 71
D.1 General . 71
D.2 Preferred characteristics . 71
D.3 Tests and test severities . 71
D.4 Performance requirements . 72
D.5 Marking, packaging and ordering information . 73
D.6 Detail specification . 73

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D.7 Quality assessment procedures . 73
Annex E (informative) Guidance on the application of optional and/or additional tests . 74
E.1 General . 74
E.2 Single-pulse high-voltage overload test . 74
E.3 Periodic-pulse overload test . 75
E.4 Operation at low temperature . 75
E.5 Damp heat, steady state, accelerated . 76
Annex F (informative) Temperature rise of recommended test boards in the endurance
test at the rated temperature 70 °C . 78
F.1 General . 78
F.2 Position of the indicated resistor temperature in the endurance test at the
rated temperature 70 °C. 78
F.2.1 Simulation model . 78
F.2.2 Simulation result . 81
F.2.3 Position suitable for determining the resistor temperature at endurance
at the rated temperature 70 °C . 82
F.3 Applied power of each recommended test board and temperature rise at
endurance test at the rated temperature 70 °C . 82
F.3.1 Precautions . 82
F.3.2 Data of temperature rise for RR resistors (simulation) . 83
F.3.3 Data of temperature rise for RT resistors (simulation) . 87
F.3.4 Data of temperature rise for RC resistors (Simulation) . 90
F.4 Ideal number of specimens to mount on each test board . 91
F.4.1 General . 91
F.4.2 Variation of temperature within the test board . 91
Annex G (informative) Reason for selecting test boards with extremely wide patterns
for high rated dissipation resistors . 94
G.1 General . 94
G.2 Simulation example of recommended test board for RT3263M made to be

equivalent to the usage condition . 94
G.3 Temperature rise when there is no efficient cooling system . 96
G.4 Dimensions of recommended test board when further raise of rated
dissipation is required . 97
Annex X (informative) Cross-references to the prior edition of this document . 100
Bibliography . 103

Figure 1 – Shape and dimension of rectangular (RR) resistors . 13
Figure 2 – Shape and dimension of transverse (RT) resistors . 14
Figure 3 – Shape and dimension of cylindrical (RC) resistors . 15
Figure 4 – Shape and dimension of wire-wound (RW) resistors . 16
Figure 5 – Derating curve based on ambient temperature . 18
Figure 6 – Basic appearance of recommended test board . 20
Figure 7 – Basic layout for mechanical, environmental and electrical tests, Kelvin (4
point) connections. 21
Figure 8 – Attachment of the sense line for Kelvin (4-point) connections for specimens

with nominal resistance lower than 100 mΩ . 21
Figure 9 – Basic layout for mechanical, environmental and electrical tests . 25
Figure F.1 – Simulation model . 80
Figure F.2 – Simulation result . 82

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Figure F.3 – Load reduction curve with terminal part temperature as x-axis . 83
Figure F.4 – RR0402M relationship between power and temperature at 70 °C . 84
Figure F.5 – RR0603M relationship between power and temperature at 70 °C . 84
Figure F.6 – RR1005M relationship between power and temperature at 70 °C . 84
Figure F.7 – RR1608M relationship between power and temperature at 70 °C . 85
Figure F.8 – RR2012M relationship between power and temperature at 70 °C . 85
Figure F.9 – RR3216M relationship between power and temperature at 70 °C . 85
Figure F.10 – RR3225M relationship between power and temperature at 70 °C . 86
Figure F.11 – RR4532M relationship between power and temperature at 70 °C . 86
Figure F.12 – RR5025M relationship between power and temperature at 70 °C . 86
Figure F.13 – RR6332M relationship between power and temperature at 70 °C . 87
Figure F.14 – RT0510M relationship between power and temperature at 70 °C . 87
Figure F.15 – RT0816M relationship between power and temperature at 70 °C . 88
Figure F.16 – RT1220M relationship between power and temperature at 70 °C . 88
Figure F.17 – RT1632M relationship between power and temperature at 70 °C . 88
Figure F.18 – RT3245M relationship between power and temperature at 70 °C . 89
Figure F.19 – RT2550M relationship between power and temperature at 70 °C . 89
Figure F.20 – RT3263M relationship between power and temperature at 70 °C . 89
Figure F.21 – RC1610M relationship between power and temperature at 70 °C . 90
Figure F.22 – RC2012M, RC2211M relationship between power and temperature at
70 °C . 90
Figure F.23 – RC3514M, RC3715M relationship between power and temperature at
70 °C . 91
Figure F.24 – RC5922M, RC6123M relationship between power and temperature at
70 °C . 91
Figure F.25 – Recommended test board for RR3216M mounted with 19 specimens . 92
Figure F.26 – Temperature variation depending on the number of specimens mounted . 92
Figure G.1 – Simulation model of recommended test board . 95
Figure G.2 – Simulation model of circuit board with high heat dissipation capability . 96
Figure G.3 – Simulation model of circuit board with low heat dissipation capability . 97
Figure G.4 – Dimensions of recommended test board in Table G.1 . 98

Table 1 – Preferred styles of rectangular (RR) resistors . 14
Table 2 – Preferred styles of transverse (RT) resistors . 15
Table 3 – Preferred styles of cylindrical (RC) resistors . 16
Table 4 – Preferred styles of wire-wound (RW) resistors . 16
Table 5 – Test board dimensions for RR resistors . 22
Table 6 – Test board dimensions for RT resistors . 23
Table 7 – Test board dimensions for RC resistors . 24
Table 8 – Preferred aggravated overload conditions . 29
Table 9 – Shear test force . 30
Table 10 – Limits for the change of resistance at tests . 39
Table 11 – Permitted change of resistance due to the variation of temperature . 40
Table 12 – Test schedule for the qualification approval . 49

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Table 13 – Test schedule for the quality conformance inspections . 55
Table B.1 – Visual examination criteria of body of specimen . 63
Table B.2 – Visual examination criteria of electrode of specimen . 64
Table B.3 – Visual examination criteria of marking of specimen . 65
Table C.1 – Acceptable and non-acceptable mounting alignment . 66
Table C.2 – Fillet of RR and RT resistors . 68
Table C.3 – Fillet of RC resistors . 69
Table C.4 – Thickness of solder paste between the pad and electrode. 70
Table C.5 – Solder ball . 70
Table E.1 – Implementation of the single-pulse high-voltage overload test . 74
Table E.2 – Implementation of the periodic-pulse overload test . 75
Table E.3 – Implementation of the operation at low temperature test . 76
Table E.4 – Implementation of the test damp heat, steady state, accelerated . 77
Table F.1 – Simulation model dimensions . 80
Table F.2 – Physical property values used in simulation . 81
Table G.1 – Dimensions of recommended test boards for raising the rated dissipation . 99
Table X.1 – Cross references to clauses . 100
Table X.2 – Cross references to figures . 102
Table X.3 – Cross references to tables . 102

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 8: Sectional specification: Fixed surface mount resistors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 60115-8 has been prepared by IEC technical committee 40: Capacitors and resistors for
electronic equipment. It is an International Standard.
This third edition cancels and replaces the second edition published in 2009. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) definitions of product technologies and product classification levels of the generic
specification, IEC 60115 1:2020, have been adopted;
b) new style of transverse (RT) resistors has been added in 3.1.5 and 4.2.2 to cover resistors
with wide terminals, which have become common in market;
c) recommended test boards in 5.2.2 have been revised to fit the demands from the market for
higher rated dissipation in resistors;

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IEC 60115-8:2023 © IEC 2023 – 9 –
d) test boards have been revised so that they can be set vertically instead of horizontally during
specified tests to optimize the temperature rise stability, area and spacing inside the test
chamber;
e) 'Periodic-pulse high-voltage overload test' of IEC 60115-1:2020, 8.3 has been added to the
default test method in 5.3.8, however, the legacy test 'periodic-pulse overload test' of
IEC 60115-1:2020, 8.4 is still maintained for historical products;
f) revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.21 and 5.3.22;
g) combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in 5.3.24;
h) 'Single-pulse high-voltage overload test' of IEC 60115-1:2020, 8.2, applied with the pulse
shape 10/700 in 5.3.7, is complemented with the optional alternative provided by the pulse
shape 1,2/50 in 5.4.1;
i) climatic tests for 'operation at low temperature' of IEC 60115-1:2020, 10.2, and for 'damp
heat, steady state, accelerated' of IEC 60115-1:2020, 10.5, have been adopted as optional
tests in 5.4.3 and 5.4.4, respectively;
j) new guidance is provided in 6.2 on the presentation of stability requirements with their
permissible absolute and relative deviations;
k) acceptance criteria for the visual examination have been added in 6.5 and in Annex B;
l) visual examination for the primary and proximity packaging has been added in 6.5.3 and in
7.2;
m) periodical evaluation of termination plating has been added as a new topic of quality
assessment in 9.8;
n) revised test clause numbering of IEC 60115-1:2020 has been applied;
o) normative Annex A has been moved from Annex B of the old version to stay in line with
other sectional specifications;
p) normative Annex B has been added to show the criteria for general visual examinations;
q) informative Annex C has been added to summarize workmanship requirements for the
assembly;
r) normative Annex D has been moved from Annex A of the old version to stay in line with
other sectional specifications;
s) informative Annex E has been added to show guidance for optional and/or additional tests;
t) informative Annex F has been added to show typical temperature rise of re
...