EN 60115-1:2011

SLOVENSKI STANDARD
01-januar-2012
Fiksni upori za elektronsko opremo - 1. del: Rodovna specifikacija
Fixed resistors for use in electronic equipment - Part 1: Generic specification
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 1:
Fachgrundspezifikation
Résistances fixes utilisées dans les équipements électroniques - Partie 1: Spécification
générique
Ta slovenski standard je istoveten z: EN 60115-1:2011
ICS:
31.040.10 Fiksni upor Fixed resistors
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60115-1
NORME EUROPÉENNE
November 2011
EUROPÄISCHE NORM
ICS 31.040.10 Supersedes EN 60115-1:2001 + A1:2001 + A11:2007

English version
Fixed resistors for use in electronic equipment -
Part 1: Generic specification
(IEC 60115-1:2008, modified)
Résistances fixes utilisées dans les Festwiderstände zur Verwendung in
équipements électroniques - Geräten der Elektronik -
Partie 1: Spécification générique Teil 1: Fachgrundspezifikation
(CEI 60115-1:2008, modifiée) (IEC 60115-1:2008, modifiziert)

This European Standard was approved by CENELEC on 2011-08-15. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60115-1:2011 E
Contents
1 General . 7
1.1 Scope . 7
1.2 Normative references . 7
2 Technical data . 9
2.1 Units and symbols . 9
2.2 Terms and definitions . 9
2.3 Preferred values . 13
2.4 Marking . 13
2.5 Coding . 13
2.6 Packaging . 13
2.7 Storage . 14
2.8 Transportation . 14
3 Quality assessment procedures . 14
4 Test and measurement procedures . 14
4.1 General . 14
4.2 Standard atmospheric conditions . 14
4.3 Drying . 15
4.4 Visual examination and checking of dimensions . 15
4.5 Resistance . 16
4.6 Insulation resistance . 17
4.7 Voltage proof . 20
4.8 Variation of resistance with temperature . 20
4.9 Reactance . 22
4.10 Non-linearity . 23
4.11 Voltage coefficient . 23
4.12 Current Noise . 24
4.13 Short time overload . 24
4.14 Temperature rise . 24
4.15 Robustness of the resistor body . 25
4.16 Robustness of terminations . 26
4.17 Solderability . 27
4.18 Resistance to soldering heat . 28
4.19 Rapid change of temperature . 28
4.20 Bump . 29
4.21 Shock . 29
4.22 Vibration . 30
4.23 Climatic sequence . 30
4.24 Damp heat, steady state . 32
4.25 Endurance . 33
4.26 Accidental overload test . 42

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4.27 Single-pulse high-voltage overload test . 44
4.28 Periodic-pulse high-voltage overload test . 47
4.29 Component solvent resistance . 49
4.30 Solvent resistance of marking . 50
4.31 Mounting of surface mount resistors . 50
4.32 Shear test . 51
4.33 Substrate bending test . 51
4.34 Corrosion . 52
4.35 Flammability . 52
4.36 Operation at low temperature . 52
4.37 Damp heat, steady state, accelerated . 53
4.38 Electrostatic discharge . 53
4.39 Periodic-pulse overload test . 54
4.40 Whisker growth test . 55
4.41 Hydrogen sulphide test . 55
Annex B (normative) Rules for the preparation of detail specifications for resistors and capacitors
for electronic equipment for use within the IECQ system . 56
Annex C (informative) Example of test equipment for the periodic-pulse high-voltage overload test . 57
Annex F (informative) Letter symbols and abbreviations . 59
Annex G (informative) Index table for test and measurement procedures . 61
Annex Q (normative) Quality assessment procedures . 63
Annex ZA (informative) Example of a certified test record . 71
Annex ZR (normative) Failure rate level evaluation, determination and qualification . 73
Annex ZX (informative) Cross reference . 80
Figures
Figure 1 – Insulation resistance and voltage proof test jig for rectangular surface mount resistors . 18
Figure 2 – Insulation resistance and voltage proof test jig for cylindrical surface mount resistors . 19
Figure 3 – Test circuit . 22
Figure 4 – Oscilloscope trace . 23
Figure 5 – Testing of resistor body robustness . 26
Figure 6 – Derating curve with specification of a suitable test dissipation . 37
Figure 7 – Derating curve without specification of a suitable test dissipation . 37
Figure 8 – Derating curve for UCT = MET . 40
Figure 9 – Derating curve for UCT < MET . 41
Figure 10 – Gauze cylinder fixture . 43
Figure 11 – Pulse generator 1,2/50 . 45
Figure 12 – Pulse generator 10/700 . 45
Figure C.1 – Block diagram of test equipment . 57
Figure C.2 – Tolerances on the pulse shape . 58

Tables
Table 1 – Referee conditions . 15
Table 2 – Measuring voltages . 16
Table 3 – Calculation of resistance value (R) and change in resistance (∆R) . 21
Table 4 – Calculation of temperature differences (∆T) . 21
Table 5 – Tensile force for wire terminations. 26
Table 6 – Torque . 27
Table 7 – Number of cycles . 31
Table 8 – Severities . 46
Table 9 – List of preferred severities . 48
Table 10 – Periodic-pulse overload test condition . 54
Table ZR.1 – Component hours and permitted number of non-conformances for the qualification
and extension of the qualification of a failure rate level (60 % statistic confidence level) . 74
Table ZR.2 – Component hours, permitted number of non-conformances and periodicity for the
maintenance of the qualification of a failure rate level (10 % statistic confidence level) . 76
Table ZR.3 – Environmental factor π . 79
E
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Foreword
This document EN 60115-1 consists of the text of IEC 60115-1:2008 prepared by IEC TC 40, Capacitors and
resistors for electronic equipment, together with the common modifications prepared by the Technical
Committee CENELEC TC 40XB, Resistors.

The following dates are fixed:

• latest date by which the document has to be (dop) 2012-08-15
implemented at national level
by publication of an identical
national standard or by endorsement
(dow) 2014-08-15
• latest date by which the national standards conflicting
with the document have to be withdrawn
This document supersedes EN 60115-1:2001 + A1:2001 + A11: 2007.
European common modifications to the text of IEC 60115-1:2008 are incdicated by a vertical line in the left
margin of the text.
Clauses, subclauses, notes, tables and figures which are additional to those in IEC 60115-1:2008 are
prefixed “Z”.
Preceding documents on the subject covered by this specification have been:
– EN 140000:1993-12
– CECC 40 000:1973-00, 1979:00
Compared to EN 60115-1:2001, the following changes have been implemented:
— revision of the terms and definitions in 2.2;
— removal of the property “temperature characteristics” from 4.8;
— revision of the solderability test in 4.17;
— revision of the resistance to soldering heat test in 4.18;
— introduction of new bias voltages for the damp heat, steady-state test in 4.24;
— revision of Clause 4.25;
— introduction of new test severities for the single-pulse high-voltage overload test on 4.27;
— introduction of a new system of test severities for the shear test in 4.32;
— deletion of the seal test in 4.36;
— introduction of the operation at low temperature test in 4.36, as a replacement of 4.38;
— revision of the damp heat, steady state, accelerated test in 4.37, as a replacement of 4.39, with
introduction of a new test severity
— introduction of the electrostatic discharge test in 4.38, as a replacement of 4.40;
— revision of the periodic-pulse overload test in 4.39, as a replacement of 4.37;
— introduction of a whisker growth test in 4.40;
— deletion of normative Annex A;
— revision of normative Annex B;
— deletion of normative Annexes D and E;
— introduction of informative Annexes F and G;
— revision of normative Annex Q, as a replacement of Clause 3;
— revision of informative Annex ZA;
— revision of normative Annex ZR, as a replacement of Annex ZB;
— editorial revision.
See also the cross reference of informative Annex ZX.

This document has been prepared under a mandate given to CENELEC by the European Commission and
the European Free Trade Association, and supports essential requirements of EU Directive(s).

Endorsement notice
The text of the International Standard IEC 60115-1:2008 was approved by CENELEC as a European
Standard with common modifications.
___________
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1 General
1.1 Scope
This part of IEC 60115 is a generic specification and is applicable to fixed resistors for use in electronic
equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail
specifications of electronic components for quality assessment or any other purpose.
1.2 Normative references
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
EN 60027-1, Letter symbols to be used in electrical technology - Part 1: General (IEC 60027-1)
EN 60060-1:2010, High-voltage test techniques – Part 1: General definitions and test requirements
(IEC 60060-1:2010)
EN 60062, Marking codes for resistors and capacitors (IEC 60062)
EN 60068-1:1994, Environmental testing - Part 1: General and guidance
(IEC 60068-1:1988 + A1:1992 + corrigendum Oct. 1988)
EN 60068-2-1, Environmental testing - Part 2-1: Tests - Test A: Cold (IEC 60068-2-1)
EN 60068-2-2, Environmental testing - Part 2-2: Tests - Test B: Dry heat (IEC 60068-2-2)
EN 60068-2-6, Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) (IEC 60068-2-6)
EN 60068-2-11, Environmental testing - Part 2: Tests - Test Ka: Salt mist (IEC 60068-2-11)
EN 60068-2-13, Environmental testing - Part 2: Tests - Test M: Low air pressure, (IEC 60068-2-13)
EN 60068-2-14, Environmental testing - Part 2-14: Tests - Test N: Change of temperature (IEC 60068-2-14)
EN 60068-2-20:2008, Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and
resistance to soldering heat of devices with leads (IEC 60068-2-20:2008)
EN 60068-2-21, Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral
mounting devices (IEC 60068-2-21)
EN 60068-2-27, Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock (IEC 60068-2-27)
EN 60068-2-30, Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
(IEC 60068-2-30)
EN 60068-2-45, Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning
solvents (IEC 60068-2-45)
EN 60068-2-54, Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic
components by the wetting balance method (IEC 60068-2-54)
EN 60068-2-58, Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance
to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58)
EN 60068-2-67:1996, Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated
test primarily intended for components (IEC 60068-2-67:1995)
EN 60068-2-69, Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69)
EN 60068-2-78, Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
(IEC 60068-2-78)
EN 60068-2-82:2007, Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for
electronic and electric components (IEC 60068-2-82:2007 + corrigendum Dec. 2009)
EN 60286 (all parts), Packaging of components for automatic handling
EN 60695-11-5:2005, Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus,
confirmatory test arrangement and guidance (IEC 60695-11-5:2004)
EN 61193-2, Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of
electronic components and packages (IEC 61193-2)
EN 61249-2-7, Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base
materials, clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning
test), copper-clad (IEC 61249-2-7)
EN 61249-2-22, Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced
base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of
defined flammability (vertical burning test), copper-clad (IEC 61249-2-22)
EN 61249-2-35, Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced
base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability
(vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35)
EN 61340-3-1, Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model
(HBM) electrostatic discharge test waveforms (IEC 61340-3-1)
EN 61760-1, Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs) (IEC 61760-1)
EN 61760-2, Surface mounting technology - Part 2: Transportation and storage conditions of surface
mounting devices (SMD) - Application guide (IEC 61760-2)
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 60063:1963, Preferred number series for resistors and capacitors
A1:1967
A2:1977
IEC 60195, Method of measurement of current noise generated in fixed resistors
IEC 60294:1969, Measurement of the dimensions of a cylindrical component having two axial terminations
IEC 60410, Sampling plans and procedures for inspection by attributes
IEC/TR 60440, Method of measurement of non-linearity in resistors
IEC 60617, Graphical symbols for diagrams
IEC QC 001002-2:1998, IEC Quality Assessment System for Electronic Components (IECQ) – Rules of
procedure – Part 2: Documentation
IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) – Rules of
procedure – Part 3: Approval procedures
IEC QC 210000, Technology Approval Schedules – Requirements under the IECQ Quality Assessment
System for Electronic Components
ISO 80000-1, Quantities and unitis – Part 1: General

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2 Technical data
2.1 Units and symbols
Units, graphical symbols and letter symbols should, whenever possible, be taken from the following
publications:
– EN 60027-1;
– IEC 60050;
– IEC 60617;
– ISO 80000-1.
When further items are required they shall be derived in accordance with the principles of the publications
listed above.
2.2 Terms and definitions
For the purposes of this document, the following terms and definitions apply, in alphabetical order of the
English terms:
NOTE The sequential numbering of terms and definations is not suitable for referencing.
2.2.1
category dissipation
fraction of the rated dissipation exactly defined in the detail specification, applicable at the upper category
temperature, taking account of the derating curve prescribed in the detail specification
NOTE 1 For resistors the category dissipation is zero, where the upper category temperature is the maximum element
temperature.
NOTE 2 Related terminology: rated dissipation, upper category temperature, derating curve.
2.2.2
category temperature range
range of ambient temperatures for which the resistor has been designed to operate continuously; this is
given by the lower and upper category temperature
NOTE Related terminology: lower category temperature, upper category temperature.
2.2.3
critical resistance
resistance value at which the rated voltage is equal to the limiting element voltage
NOTE 1 At an ambient temperature of 70 °C, the maximum voltage which may be applied across the terminations of a
resistor is either the calculated rated voltage, if the resistance is less than the critical resistance, or the limiting element
voltage, if the resistance is equal to or greater than the critical resistance. At temperatures other than 70 °C, it is
important that account be taken of the derating curve and of the limiting element voltage in the calculation of any voltage
to be applied.
NOTE 2 Related terminology: Rated voltage, limiting element voltage.
2.2.4
derating curve
curve which shows the maximum allowable dissipation at ambient temperatures between the upper
and lower category temperature
NOTE 1 In the range between lower category temperature and rated temperature it shows the rated dissipation, and
between rated temperature and maximum element temperature it shows a linear slope down to zero dissipation at the
maximum element temperature. The slope depends on the thermal properties of the resistor, i.e. its capability to abduct
the dissipation to the environment.
NOTE 2 Related terminology: rated dissipation, rated temperature, maximum element temperature.

2.2.5
failure rate level
accumulated number of non-conforming units under specified operating conditions and specified
accumulation time, evaluated for a given confidence level
NOTE Related terminology: non-conformance, non-conforming unit.
2.2.6
grade
term indicating additional general characteristics concerning the intended application, for example,
long-life applications
NOTE 1 The term "grade" may be used only in combination with one or more words (for example, long-life grade) and
not with a single letter or number.
NOTE 2 Related terminology: stability class.
2.2.7
heat-sink resistor
resistor type designed for mounting on a separate heat-sink
NOTE Related terminology: rated dissipation
2.2.8
insulated resistor
resistor which fulfils the voltage proof and insulation resistance test requirements and the damp-heat, steady-
state test with a polarizing voltage applied when mounted on a metal plate
NOTE Related terminology: insulation resistance, insulation voltage.
2.2.9
insulation resistance
resistance of the encapsulation of the insulated resistor measured between the resistor terminations
connected together and any conducting mounting surface
NOTE Related terminology: insulated resistor.
2.2.10
insulation voltage
maximum peak voltage which may be applied under continuous operating conditions between the
resistor terminations and any conducting mounting surface
NOTE Related terminology: insulated resistor.
2.2.11
limiting element voltage
U
max
maximum d.c. or a.c. r.m.s. voltage that may be continuously applied to the terminations of a resistor
(generally dependent upon size and manufacturing technology of the resistor)
NOTE 1 Where the term "a.c. r.m.s. voltage" is used in this standard, the peak voltage is not exceed 1,42 times the
r.m.s. value.
NOTE 2 This voltage can only be applied to resistors when the resistance value is equal to or higher than the critical
resistance value.
NOTE 3 Related terminology: rated voltage, critical resistance.
2.2.12
Lower Category Temperature
LCT
minimum ambient temperature at which a resistor has been designed to operate continuously
NOTE Related terminology: upper category temperature, category temperature range.

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2.2.13
maximum element temperature
MET
maximum stated temperature at any point on or within the resistor, under any permissible operating condition
NOTE 1 The maximum element temperature is the sum of the rated temperature and the temperature rise generated
by the rated dissipation. For ambient temperature above the rated temperature, the maximum element temperature is the
sum of the ambient temperature and the related permissible dissipation as specified by the derating curve.
NOTE 2 Related terminology: maximum surface temperature
2.2.14
maximum surface temperature
maximum temperature permitted on the surface for any resistor of that type when operated continuously at
rated dissipation at an ambient temperature of 70 °C
NOTE Related terminology: maximum element temperature
2.2.15
non-conformance
characteristic or attribute of a product that does not meet the specified requirement
NOTE Related terminology: non-conforming unit, failure rate level.
2.2.16
non-conforming unit
unit of product showing one or more non-conformances
NOTE Related terminology: non-conformance, failure rate level.
2.2.17
rated resistance
resistance value for which the resistor has been designed, and which is generally used for denomination of
the resistor
2.2.18
rated dissipation
maximum permissible dissipation at an ambient temperature of 70 °C under the conditions of the test
endurance at the rated temperature 70 °C and of the respective acceptance criteria
NOTE 1 If the rated dissipation depends on special means supporting the abduction of the dissipation to the
environment, for example, special circuit board material, special conductor dimensions, heat-sink, such means have to
be identified whenever the rated dissipation is mentioned.
NOTE 2 The term for heat-sink resistors is defined as maximum allowable dissipation at an ambient temperature of
25 °C, when mounted on the reference heat-sink, under the conditions of the endurance test at room temperature for
heat-sink resistors, and which will result in a change in resistance not greater than that specified for this endurance test.
NOTE 3 Related terminology: rated temperature, rated voltage.
2.2.19
rated temperature
maximum ambient temperature at which the rated dissipation may be applied continuously under the
conditions of the endurance test prescribed for this temperature. It has a value of 70 °C, unless otherwise
prescribed in the relevant sectional specification
NOTE Related terminology: rated dissipation.
2.2.20
rated voltage
U
r
d.c. or a.c. r.m.s. voltage calculated from the square root of the product of the rated resistance and the rated
dissipation
NOTE 1 At high values of resistance, the rated voltage may not be applicable because of the size and the construction
of the resistor.
NOTE 2 Related terminology: rated dissipation, limiting element voltage.

2.2.21
stability class
term representing a predefined set of stability requirements, i.e. specific limits of permissible
resistance change assigned to individual tests
NOTE 1 The term “stability class” may be used only in combination with a plain number representing the typical stability
requirement for long term test, for example, endurance at upper category temperature or 1 000 h endurance at 70 °C.
Stability requirements for short term tests will typically be lower than indicated by the stability class number.
NOTE 2 Related terminology: grade.
2.2.22
style
subdivision of a type, generally based on dimensional factors, which may include several variants,
generally of a mechanical order
NOTE Related terminology: type.
2.2.23
surface mount resistor
fixed resistor whose small dimensions and nature or shape of terminations make it suitable for use in hybrid
circuits and on printed boards
NOTE Related terminology: type, style.
2.2.24
temperature coefficient of resistance
αααα
relative variation of resistance between two given temperatures divided by the difference in the temperature
producing it
NOTE 1 It should be noted that the use of the term does not imply any degree of linearity for this function, nor should
any be assumed.
NOTE 2 Related terminology: variation of resistance with temperature.
2.2.25
temperature rise
Tr
increase of temperature on or within a resistor generated by application of a dissipation and
depending on the thermal properties of the resistor, i.e. its capability to abduct the dissipation to the
environment
2.2.26
type
group of components having similar design features and manufacturing techniques, enabling them
to be considered together either for qualification approval or for quality conformance inspection.
They are generally covered by a single detail specification
NOTE 1 Components described in several detail specifications, may, in some cases, be considered as belonging to the
same type and may therefore be grouped for quality assessment purposes.
NOTE 2 Mounting accessories are ignored, provided they have no significant effect on the test results.
NOTE 3 Related terminology: style.
2.2.27
Upper Category Temperature
UCT
maximum ambient temperature at which a resistor has been designed to operate continuously at
that portion of the rated dissipation which is indicated in the category dissipation
NOTE 1 For resistors with a linear derating down to zero category dissipation, the upper category temperature is equal
to the maximum element temperature.
NOTE 2 Related terminology: lower category temperature, category temperature range.

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2.2.28
variation of resistance with temperature
Reversible change of resistance due to temperature deviating from reference conditions, usually described
by means of the temperature coefficient of resistance
NOTE Related terminology: temperature coefficient of resistance.
2.2.29
visible damage
damage, perceptible with suitable magnification, which is likely to affect the usability of the component for its
intended purpose
2.2.30
voltage coefficient of resistance
reversible change in resistance caused by the applied voltage and expressed as a percentage change in
resistance per applied volt
2.3 Preferred values
2.3.1 General
Each sectional specification shall prescribe the preferred values appropriate to the group of products covered
therein.
2.3.2 Preferred values of rated resistance
The preferred values of rated resistance shall be taken from a suitable E-series as given in IEC 60063.
2.4 Marking
The information given in the marking is normally selected from the following list; the relative importance of
each item is indicated by its position in the list:
a) rated resistance;
b) tolerance on rated resistance;
c) temperature coefficient (if applicable);
d) year and month (or week) of manufacture;
e) number of the detail specification and style reference;
f) manufacturer's name or trade mark;
g) batch or lot number.
The resistor shall be clearly marked with a) and b) above, and with as many of the remaining items as is
practicable. Preferably, the marking method shall be selected from those given in EN 60062. Any duplication
of information in the marking on the resistor should be avoided.
Small SMD resistor styles are not generally marked on the body. However, if some marking is applied it shall
as a minimum be for the rated resistance, using one of the methods given in of EN 60062. Specific
requirements shall be prescribed in the relevant specifications.
The package containing the resistor(s) shall be clearly marked with all the information listed above.
Any additional marking shall be applied so that no confusion can arise.
2.5 Coding
When coding is used for resistance value, tolerance or date of manufacture, the method shall be selected
from those given in EN 60062.
2.6 Packaging
Where applicable, the sectional specification shall provide information about packaging, preferably selected
from EN 60286 (all parts).
2.7 Storage
Unless otherwise specified, storage conditions shall not exceed the following limits:
Storage temperature: - 25 °C to 45 °C
Relative humidity: ≤ 75 % yearly average
≤ 95 % for 30 days per year
Non-corrosive and dust-free atmosphere.
The resistiors shall be stored in the original package.
NOTE Further recommendations for suitable storage conditions can be found in EN 61760-2.
2.8 Transportation
Unless otherwise specified, environmental conditions under transportation shall not exceed the conditions
prescribed for storage.
NOTE Further recommendations for suitable transportation conditions can be found in EN 61760-2.
3 Quality assessment procedures
When this standard, and related sectional and detail specifications are used for the purpose of a full quality
assessment system such as IEC Quality Assessment System for Electronic Components (IECQ), the
relevant clauses of Annex Q apply.
NOTE Clause 3 has been moved to Annex Q. To maintain reference to previous editions of this standard, the clause
numbers of Clause 3 have been converted into the clause numbers of Annex Q as shown by the following examples:
- Subclause 3.1 → Clause Q.1;
- Subclause 3.1.2 → Subclause Q.1.2.
4 Test and measurement procedures
4.1 General
The sectional and/or blank detail specification shall indicate the tests to be carried out, the measurements
which are to be made before and after each test or subgroup of tests, and the sequence in which the tests
shall be performed. The stages of each test shall be carried out in the order written. The measuring
conditions shall be the same for initial and final measurements.
If national specifications within any quality assessment system include methods other than those specified in
the above documents, these methods shall be fully described.
The limits given in all specifications are absolute limits. The principle of taking measurement uncertainty into
account shall be applied (see IEC QC 001002-3:2005, Annex C to Clause 2).
4.2 Standard atmospheric conditions
4.2.1 Standard atmospheric conditions for testing
Unless otherwise specified, all tests and measurements shall be made under standard atmospheric
conditions for testing, as given in EN 60068-1:1994, 5.3:
– temperature: 15 °C to 35 °C;
– relative humidity: 25 % to 75 %;
– air pressure: 86 kPa to 106 kPa.
Before measurements are made, the resistor shall be stored at the measuring temperature for a time
sufficient to allow the entire resistor to reach this temperature. The period as prescribed for recovery at the
end of a test is normally sufficient for this purpose.

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When measurements are made at a temperature other than the specified temperature, the results shall,
where necessary, be corrected to the specified temperature. The ambient temperature during the
measurements shall be stated in the test report. In the event of a dispute, the measurements shall be
repeated using one of the referee temperatures (as given in 4.2.3) and such other conditions as are
prescribed in this specification.
When tests are conducted in a sequence, the final measurements of one test may be taken as the initial
measurements for the succeeding test.
During the measurements, the resistor shall not be exposed to draughts, direct sunlight or other influences
likely to cause error.
4.2.2 Recovery conditions
Unless otherwise specified, recovery shall take place under the standard atmospheric conditions for testing
(4.2.1).
If recovery under closely controlled conditions is necessary, the controlled recovery conditions of
EN 60068-1:1994, 5.4.1 shall be used.
4.2.3 Referee conditions
For referee purposes, one of the standard atmospheric conditions for referee tests taken from
EN 60068-1:1994, 5.2, as given below, shall be chosen.
Table 1 – Referee conditions
Temperature Relative humidity Air pressure
°C % kPa
63 to 67 86 to 106
20 ± 1
48 to 52 86 to 106
23 ± 1
48 to 52 86 to 106
25 ± 1
27 ± 1 63 to 67 86 to 106
4.2.4 Reference conditions
For reference purposes, the standard atmospheric conditions for reference given in EN 60068-1:1994, 5.1
apply:
– temperature: 20 °C;
– air pressure: 101,3 kPa.
4.3 Drying
When drying is prescribed, the resistor shall be conditioned before measurement is made using procedure I
or procedure II as prescribed by the relevant specification.
Procedure I: for 24 h ± 4 h in an oven at a temperature of 55 °C ± 2 °C and at a relative humidity not
exceeding 20 %
Procedure II: for 96 h ± 4 h in an oven at 100 °C ± 5 °C
The resistor shall then be allowed to cool in a desiccator using a suitable desiccant, such as activated
alumina or silica gel, and it shall be kept therein from the time of removal from the oven to the beginning of
the specified tests.
4.4 Visual examination and checking of dimensions
4.4.1 Visual examination
The condition, workmanship and finish shall be satisfactory, as checked by visual examination.
The marking shall be legible, as checked by visual examination. It shall be in accordance with the
requi
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