CEN/TR 17603-20-07:2022

SLOVENSKI STANDARD
01-marec-2022
Vesoljska tehnika - Priročnik o elektromagnetni združljivosti
Space engineering - Electromagnetic compatibility handbook
Raumfahrttechnik - Handbuch zur elektromagnetischen Kompatibilität
Ingénierie spatiale - Manuel pour la compatibilité électromagnétique
Ta slovenski standard je istoveten z: CEN/TR 17603-20-07:2022
ICS:
33.100.01 Elektromagnetna združljivost Electromagnetic compatibility
na splošno in general
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

TECHNICAL REPORT CEN/TR 17603-20-07

RAPPORT TECHNIQUE
TECHNISCHER BERICHT
January 2022
ICS 49.140
English version
Space engineering - Electromagnetic compatibility
handbook
Ingénierie spatiale - Manuel pour la compatibilité Raumfahrttechnik - Handbuch zur
électromagnétique elektromagnetischen Kompatibilität

This Technical Report was approved by CEN on 29 November 2021. It has been drawn up by the Technical Committee
CEN/CLC/JTC 5.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2022 CEN/CENELEC All rights of exploitation in any form and by any means
Ref. No. CEN/TR 17603-20-07:2022 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European Foreword . 11
Introduction . 12
1 Scope . 13
2 References . 14
3 Terms, definitions and abbreviated terms . 15
3.1 Terms from other documents . 15
3.2 Terms specific to the present document . 15
3.3 Abbreviated terms. 16
3.4 Nomenclature . 20
4 Rationale for ECSS-E-ST-20-07C unit level test requirements . 21
4.1 General rationale for standard EMC test requirements . 21
4.2 Test set-up requirements . 21
4.2.1 Line impedance stabilization network . 21
4.2.2 Mains isolation transformers . 23
4.2.3 Anechoic chambers . 23
4.3 EMC test requirements . 24
4.3.1 Overview . 24
4.3.2 CE, power leads, differential mode, 30 Hz to 100 kHz . 24
4.3.3 CE, power and signal leads, 100 kHz to 100 MHz . 24
4.3.4 CE, power leads, inrush current . 25
4.3.5 DC Magnetic field emission, magnetic moment . 25
4.3.6 Absence of RE magnetic field requirement, 30 Hz to 50 kHz, in the
standard . 26
4.3.7 RE, electric field, 30 MHz to 18 GHz . 26
4.3.8 CS, power leads, 30 Hz to 100 kHz . 27
4.3.9 CS, bulk cable injection, 50 kHz to 100 MHz . 27
4.3.10 CS, power leads, transients . 31
4.3.11 RS, magnetic field, 30 Hz to 100 kHz . 31
4.3.12 RS, electric field, 30 MHz to 18 GHz . 32
4.3.13 Susceptibility to electrostatic discharges . 32
5 System level activities. 34
5.1 EMC Programme . 34
5.1.1 Introduction . 34
5.1.2 EMC Programme philosophy . 34
5.1.3 Early EMC activities . 36
5.1.4 EMC control plan . 42
5.2 System level design aspects . 43
5.2.1 Introduction . 43
5.2.2 Electrical bonding . 43
5.2.3 Grounding methods and rationale . 49
5.2.4 Cable shields connection rules, methods and rationale . 65
5.2.5 EGSE grounding rules and methods . 73
5.2.6 Protection against ESD . 74
5.2.7 Magnetic cleanliness . 74
5.2.8 Design methods for RFC . 77
5.3 System level verification . 77
5.3.1 System level analyses . 77
5.3.2 System level tests . 107
5.4 Troubleshooting and retrofit techniques . 116
5.4.1 RFC below 500 MHz . 116
5.4.2 Reduction of RF leakages of external units . 116
5.4.3 Filter connectors . 117
6 Design techniques for EMC . 118
6.1 Unit level design techniques . 118
6.1.1 Introduction . 118
6.1.2 Control of the radiated emission from digital electronics . 118
6.1.3 Connection of zero volt planes to chassis . 124
6.1.4 Mixed signal PCBs . 126
6.2 Design rules and techniques for magnetic cleanliness . 127
6.2.1 Overview . 127
6.2.2 Electronic Parts and Circuits . 127
6.2.3 Solar Array . 130
6.2.4 Shielding . 130
6.2.5 Structure and housings . 130
6.2.6 Harness, Wiring and Grounding . 131
6.2.7 Compensation . 132
6.3 Controlling the CE from DC/DC converters . 132
7 EMC test methods . 140
7.1 DC and low frequency magnetic field measurements . 140
7.1.1 Measurements for multiple dipole modelling. 140
7.1.2 Measurements for spherical harmonics modelling . 143
7.1.3 “Six points method” . 146
7.1.4 Perm and deperm . 149
7.1.5 Low frequency magnetic field measurements . 151
7.1.6 Magnetic properties measurements . 151
7.2 Measuring the primary to secondary capacitance of a DC/DC converter . 157
7.3 Electric and electromagnetic field measurements . 158
7.3.1 Low frequency electric field measurements . 158
7.3.2 UHF/SHF sniff tests . 160
7.3.3 Reverberation chamber tests . 162
7.4 Voltage and current probes . 173
7.4.1 Passive measurement and injection current probes . 173
7.4.2 “True differential” uses of current probes . 176
7.4.3 Voltage probes . 178
7.5 Conducted susceptibility techniques . 179
7.5.1 CS, power leads, transients . 179
7.5.2 Double BCI . 187
7.6 Radiated susceptibility techniques . 194
7.6.1 UHF/SHF spray tests . 194
7.6.2 Reverberation chamber tests . 195
8 EMC analysis methods and computational models . 197
8.1 EMC analysis methods . 197
8.1.1 DC magnetic, multiple dipole modelling . 197
8.1.2 DC magnetic, spherical harmonics . 200
8.1.3 Electrical interfaces survival to ESD . 204
8.1.4 Oversized cavity theory . 206
8.1.5 Shielding analyses . 211
8.2 EMC computational models and software . 219
Annex A References . 220

Figures
Figure 4-1: Line impedance stabilization network schematic . 22
Figure 4-2: LISN with return internally grounded at input . 22
Figure 4-3: ECSS-E-ST-20-07C BCI signal test characteristics . 28
Figure 4-4: MIL-STD-461F/CS114 signal characteristics . 28
Figure 4-5: MIL-STD-461F/CS115 signal characteristics . 29
Figure 4-6: MIL-STD-461F/CS116 signal characteristics . 29
Figure 4-7: ECSS-E-ST-20-07C BCI calibration setup . 30
Figure 4-8: CS transient, as a percentage of power line voltage, as recommended in
ECSS-E-ST-20-07C Annex. . 31
Figure 4-9: ESD test performed with a commercial ESD generator . 33
Figure 5-1: Example of receiver sensitivity mask (ESS Rosetta S-Band receiver) . 37
Figure 5-2: Coupling of an external unit to an antenna connected receiver. 38
Figure 5-3: Coupling of an internal unit to an antenna connected receiver . 39
Figure 5-4: Coupling of transmitter connected antenna to an external unit . 40
Figure 5-5: Inputs and perimeter of the EMC control plan . 42
Figure 5-6: Filter decreased efficiency due to poor bonding . 43
Figure 5-7: Narrow strips, fixation by screws . 45
Figure 5-8: Wide strips, fixation by rivets and screws . 46
Figure 5-9: Thick strips, fixation by screws . 46
Figure 5-10: Shaped grounding strips, fixation by rivets . 47
Figure 5-11: Shaped grounding sheet . 48
Figure 5-12: SMOS arm panel featuring an external Al foil co-cured with the CFRP . 48
Figure 5-13: General configuration of equipment bonding . 49
Figure 5-14: Simple sensor acquisition with floating reference at sensor end . 50
Figure 5-15: Complex electrical sub-system with floating reference at sensor end . 50
Figure 5-16: General representation of a floating device . 52
Figure 5-17: Typical CMVR for 10m cable length . 52
Figure 5-18: Example of simulated CMVR for an infra-red bolometer experiment . 54
Figure 5-19: Conceptual representation of circuits sharing a common reference through
connections having parasitic impedance . 56
Figure 5-20: Illustration of current distribution and resulting voltage drop across a
ground plane . 57
Figure 5-21: Net partial inductance of a ground plane as a function of track height h
and track length ℓ (similar to Fig. 14 of [11]) . 58
Figure 5-22: Common mode voltage generation and propagation with improper
grounding . 59
Figure 5-23: Common mode voltage propagation mitigation . 59
Figure 5-24: Primary to secondary common mode decoupling . 60
Figure 5-25: Example of equipment internal grounding for internal decoupling (top view) . 61
Figure 5-26: Common mode current segregation in an EGSE cabinet . 62
Figure 5-27: High EMI decoupling and current segregation using module enclosures in
a rack/bin or equipment housing. . 63
Figure 5-28: Typical equipment bonding implementation (bonding strap) . 63
Figure 5-29: Equivalent diagram of a unit-to-panel connection by bonding strap . 64
Figure 5-30: Impedance between equipment housing and structure panel for
non-conductive and conductive thermal fillers . 65
Figure 5-31: Cable shield connected to the chassis at both ends . 66
Figure 5-32: Example of attenuation of external common mode voltage by a cable
shield, showing the rejection above a certain frequency (here 3 kHz) . 67
Figure 5-33: Typical transfer impedances of shielded cables . 67
Figure 5-34: Cable shield connected to a ground pin (solution to be avoided) . 68
Figure 5-35: Cable shields connected to a halo ring . 69
Figure 5-36: Cable shields connected to a halo ring – Example layout . 69
Figure 5-37: Cable shields connected to a halo ring inside a connector backshell . 70
Figure 5-38: Grounding tag inside a connector back-shell . 70
Figure 5-39: Cable shield connection to a grounding tag inside a connector backshell . 70
Figure 5-40: Tag ring cable shield termination . 71
Figure 5-41: Pigtail . 71
Figure 5-42: Connector backshell and overshield . 71
Figure 5-43: Shielded cables inside an overshield . 72
Figure 5-44: Comparison of various cable and bundle shielding methods . 73
Figure 5-45: Magnetic field versus distance from a magnetic source of 1 Am² . 77
Figure 5-46: Rough overview of noise sources on a star distributed DC power bus . 78
Figure 5-47: Example of TDMA current and resulting bus voltage in sunlight mode . 79
Figure 5-48: Example of LIDAR current consumption profile . 80
Figure 5-49: Electrical (left) and thermal (right) equivalent circuits of a fuse . 80
Figure 5-50: Electrical fuse model with arc . 82
Figure 5-51: Typical fuse current shape . 82
Figure 5-52: Probability density function of P for

= 0 dBm . 85
rdB r dB
Figure 5-53: Cumulative distribution function of P for

= 0 dBm . 86
rdB r dB
Figure 5-54: Cumulative distribution function of P for

= 0 dBm, log scale . 86
rdB r dB
Figure 5-55: RE/RS coupling between high and low power RF units inside the CM
cavity . 87
Figure 5-56: Worst case power received by an EED from the RF environment
according to the frequency, for E = 145 dBµV/m . 89
Figure 5-57: CCS of generic twisted shielded pairs of various lengths loaded by various
impedances . 91
Figure 5-58: Main parts of A5 (courtesy of EADS Astrium) . 94
Figure 5-59: CAD model of the lightning protection system of A5, with the relevant peak
current levels (courtesy of EADS Astrium) . 95
Figure 5-60: Photograph and CAD model of the lightning protection system of A5
(courtesy of EADS Astrium). 96
Figure 5-61: Meshing of A5 and its lightning protection system for FDTD, indirect stroke
(courtesy of EADS Astrium). 97
Figure 5-62: Meshing of A5 for FDTD, direct stroke (courtesy of EADS Astrium). 97
Figure 5-63: Lightning stroke current shape . 98
Figure 5-64: Current distribution along A5 launcher (courtesy of EADS Astrium) . 99
Figure 5-65: Cross-section of the harness and cable duct used to derive the line
parameters, then used in the network simulation . 99
Figure 5-66: Network simulation of lighting stroke coupling to some launcher cables . 100
Figure 5-67: Voltage and current on the launcher external cables, due to a lightning
stroke (simulation results) . 101
Figure 5-68: A5 payload coupling modes . 102
Figure 5-69: Model of the umbilical cable bundle for the calculation of internal voltages
induced by the lightning current . 103
Figure 5-70: Common mode voltage for a shield current Ish = 1 A . 103
Figure 5-71: Coupling of lighting stroke induced magnetic field to an external shielded
harness of a satellite under the fairing . 104
Figure 5-72: Magnetic coupling model results for a shield current Ish = 1A . 104
Figure 5-73: Result of a DC magnetic field simulation involving MTBs . 106
Figure 5-74: Tentative of “EMC oriented” grounding diagram . 106
Figure 5-75: Example of EICD grounding diagram . 107
Figure 5-76: Example of grounding diagram to be avoided . 107
Figure 5-77: TerraSAR-X and TanDEM-X Spacecraft Constellation Flight. 110
Figure 5-78: TerraSAR-X and TanDEM-X in helix flight formation . 111
Figure 5-79: Magnetic Test Facility MFSA with Rosetta Lander (courtesy of IABG) . 113
Figure 5-80: CNES Magnetic laboratory "J.B. BIOT", compensation and simulation coils
(courtesy of CNES) . 114
Figure 5-81: CNES Magnetic laboratory "J.B. BIOT", perm and deperm coils (courtesy
of CNES) . 115
Figure 5-82: CNES Magnetic laboratory "J.B. BIOT", geometry of the compensation
and of the simulation coils . 115
Figure 6-1: Trapezoidal signal with 50% duty cycle . 119
Figure 6-2: Spectrum of a trapezoidal signal with 50% duty cycle . 119
Figure 6-3: Clock signal routed on the top layer of a PCB . 120
Figure 6-4: Spectrum radiated by a clock signal routed on the top layer of a PCB . 120
Figure 6-5: Small loop model for differential mode radiated emission . 121
Figure 6-6: Limitation of rise and fall times . 122
Figure 6-7: Example of PCB ground plane connection to chassis for a modular unit . 124
Figure 6-8: Ground plane connection to chassis - Example with a backplane . 125
Figure 6-9: Good practice to achieve GND plane electrical continuity to chassis via
surface contact using card lock retainers (also called wedge locks) . 125
Figure 6-10: Alternative method using multiple screws to minimize current constriction
effects . 126
Figure 6-11: Common mode current segregation at PCB level . 126
Figure 6-12: Canonical model showing the three essential functions of a DC/DC
converter . 133
Figure 6-13: Model of the general switching-mode regulator with addition of an input
filter and incorporation of the canonical model . 134
Figure 6-14: Simplified circuit example of open-loop input impedance . 135
Figure 6-15: Voltage and current snubbers . 136
Figure 6-16: One-cell low-pass LC filter . 136
Figure 6-17: LC filter with parallel RC damping . 137
Figure 6-18: Example of double cell filter . 138
Figure 7-1: Rotational magnetic measurement . 140
Figure 7-2: Mobile Coil Facility . 141
Figure 7-3: Illustration of most narrow protuberance and maximum signal . 142
Figure 7-4: Optimal distance for magnetic measurements . 143
Figure 7-5: Measurements for spherical harmonics modelling: regular coverage of a
sphere . 144
Figure 7-6: The “six-point method” . 147
Figure 7-7: Improved “six-point method” . 148
Figure 7-8: Perm B-Field . 149
Figure 7-9: Deperm H-Field (not to scale). 149
Figure 7-10: Deperm signal as measured with an air-core coil at the centre of the coil
system of the “Ulysses” MCF of ESTEC . 150
Figure 7-11: Steps of induced magnetic moment measurement . 152
Figure 7-12: Example of rotational measurement at 10 cm (central sensor) from the
component under test; magnetic moment = 0,13 mAm . 153
Figure 7-13: BIPM method for magnetic susceptibility measurement . 154
Figure 7-14: Real and imaginary parts of AC magnetic susceptibility . 156
Figure 7-15: DC/DC converter equivalent model for primary to secondary parasitic
capacitance measurement . 157

Figure 7-16: Primary to secondary parasitic capacitance measurement, step 1 . 157
Figure 7-17: Primary to secondary parasitic capacitance measurement, step 2 . 158
Figure 7-18: Low frequency electric field measurement set-up . 159
Figure 7-19: Sniff antenna made of a coax-waveguide transition and dielectric spacer . 161
Figure 7-20: Example of test set-up for UHF/SHF sniff test . 161
Figure 7-21: Simulation illustrating the modal structure of the field . 163
Figure 7-22: Mechanical stirring/tuning principle . 164
Figure 7-23: Measurement of the quality factor of a reverberation chamber . 165
Figure 7-24: Computation and measurement of the quality factor of a reverberation
chamber . 166
Figure 7-25: Calibration of Reverberation chamber . 168
Figure 7-26: Standard deviation of the field corresponding to a good quality of stirring
(DO-160) . 168
Figure 7-27: Shielding effectiveness measurement in a reverberation chamber . 172
Figure 7-28: Shielding effectiveness measurement of an empty enclosure in a
reverberation chamber . 172
Figure 7-29: Injection probe clamped on a quasi-short-circuit . 174
Figure 7-30: Equivalent circuit of an injection probe clamped on a low impedance circuit . 174
Figure 7-31: Maximum injected current according to the frequency . 175
Figure 7-32: Injection probe clamped on a cable with one high impedance end . 175
Figure 7-33: Equivalent circuit of an injection probe clamped on a cable with one high
impedance end. 176
Figure 7-34: Maximum induced voltage according to the frequency . 176
Figure 7-35: “True” differential and common mode current probe set-ups . 177
Figure 7-36: DM CS, 100 kHz to 10 MHz, with balanced injection set-up and CM
voltage monitoring . 177
Figure 7-37: Test demonstrating passive voltage probe shortcomings . 178
Figure 7-38: Comparison of voltage measured with a passive 1:10 voltage probe, an
active differential voltage probe and a coupler (reference measurement) . 178
Figure 7-39: Slow CS DM transient by commutation between 2 power supplies . 180
Figure 7-40: Example 1 of slow transient requirement . 180
Figure 7-41: Example 2 of slow transient requirement . 181
Figure 7-42: Test method 1 using a fast 4-quadrant power supply . 181
Figure 7-43: Test method 2 with dedicated pulse amplifier . 182
Figure 7-44: Simplified circuit diagram of a pulse amplifier . 182
Figure 7-45: Circuit diagram of a 50 Ω-charged line pulse generator . 184
Figure 7-46: Pulse injection calibration setup . 184
Figure 7-47: Typical CS115 transient shape due to inductive coupling mechanisms
inside the injection probe. . 185
Figure 7-48: Calibration setup to determine the broadband transfer impedance of a
current probe. . 186
Figure 7-49: Set up for CS115 transient tests acc. MIL-STD-461F . 187
Figure 7-50: Set-up configuration for Bulk Current Injection (a) and example of injection
probe represented as a three-port device (b). . 188
Figure 7-51: “Implicit” model of an injection probe . 189
Figure 7-52: Cross-sectional view of an injection probe . 190
Figure 7-53: “Explicit” lumped-parameter circuit model of an injection probe clamped
onto a conductor under test . 190
Figure 7-54: DBCI test setup. (a) Block diagram. (b) Circuit model . 191
Figure 7-55: Currents induced by radiation and DBCI . 192
Figure 7-56: RS at unit level with vertically polarized electric field . 193
Figure 7-57: Magnitude of current distribution induced along cable shield at 275 MHz . 193
Figure 7-58: Example of test set-up for UHF/SHF spray . 194
Figure 7-59: Radiated susceptibility set up inside reverberation chamber . 196
Figure 8-1: Spherical harmonics up to degree 3 . 203
Figure 8-2: Failure power (resp. energy) as a function of transient duration . 204
Figure 8-3: Gaussian distribution of the real and imaginary parts of each component of
the field, occurring when the number of modes is large enough . 206
2 2
Figure 8-4: Probability density function of E or E and E or E (arbitrary
i dB idB dB dB
“location” parameter), log scale . 208
Figure 8-5: Circular aperture in a conductive plane . 210
Figure 8-6: Normalised effective area of a circular aperture . 211
Figure 8-7: Low frequency AC magnetic shielding effect of a unit metallic case . 212
Figure 8-8: H-field attenuation by a unit enclosure according to the frequency . 212
Figure 8-9: Shielding effectiveness of an infinite copper plane of 254 μm for a source at
1 m . 214
Figure 8-10: Waveguide attenuation effect for deep apertures . 216
Figure 8-11: Rectangular box with a rectangular slot illuminated by an incident plane
wave, showing axes and dimensions . 217
Figure 8-12: Comparison of ILCM with CST and FEKO (case 1) . 218
Figure 8-13: Comparison of ILCM with CST (case 2) . 219
Tables
Table 5-1: Example of RE notch requirement . 39
Table 5-2: Some results of EED sensitivity to pulsed RF power . 92
Table 6-1: Examples of parts/unit magnetic properties . 128
Table 6-2: Magnetic field close to the surface of D connectors after exposure to a field
of 0,5 T . 132
Table 6-3: Transformer ratio and effective inductance value in the canonical model for
different types of converters . 133
Table 7-1: Comparison of (total) average received power and (total) maximum received
power test methods . 171
Table 8-1: Schmidt Quasi-Normalized Spherical Harmonics [79] . 201
Table 8-2: Cases for the comparison of the Intermediate Level Circuit Model method
with CST and FEKO (from [88]) . 218

European Foreword
This document (CEN/TR 17603-20-07:2022) has been prepared by Technical Committee
CEN/CLC/JTC 5 “Space”, the secretariat of which is held by DIN.
It is highlighted that this technical report does not contain any requirement but only collection of data
or descriptions and guidelines about how to organize and perform the work in support of EN 16603-
20.
This Technical report (CEN/TR 17603-20-07:2022) originates from ECSS-E-HB-20-07A.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN shall not be held responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the European Commission and
the European Free Trade Association.
This document has been developed to cover specifically space systems and has therefore precedence
over any TR covering the same scope but with a wider domain of applicability (e.g.: aerospace).
Introduction
The purpose of the present handbook is to support the use of ECSS-E-ST-20-07C. It aims at providing
practical and helpful information for electromagnetic compatibility (EMC) in the development of
space equipment and systems.
It gathers EMC experience, know-how and lessons-learnt from the European Space Community with
the intention to assist project groups and individual implementers.
Scope
The objective of this EMC Handbook is to point out all the issues relevant to space systems EMC, to
provide a general technical treatment and to address the interested reader to more thorough and in-
depth publications.
NOTE It is possible to find fundamental and advanced treatment of many
aspects related to EMC: many universities offer courses on EMC and a
large number of textbooks, papers and technical documents are
available. Therefore replicating in this Handbook the available
knowledge is impractical and meaningless.
Emphasis is given to space systems EMC design, development and verification, and specifically to the
practical aspects related to these issues.
NOTE This has been possible thanks to the collaboration of space industry,
especially on items which are not textbook issues and whose solution
needs the widespread experience gained in large number of projects.
References
EN Reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS System: - Glossary of terms
EN 17603-20 ECSS-E-ST-20 Space engineering - Electric and electronic
EN 17603-20-07 ECSS-E-ST-20-07 Space engineering - Electromagnetic compatibility
EN 17603-33-11 ECSS-E-ST-33-11 Space engineering - Explosive systems and devices
EN 17603-10-03 ECSS-E-ST-10-03 Space engineering – Testing
EN 17602-70-71 ECSS-Q-ST-70-71 Space product assurance - Materials, processes and their
data selection
Terms, definitions and abbreviated terms
3.1 Terms from other documents
For the purpose of this document, the terms and definitions from ECSS-S-ST-00-01 apply
For the purpose of this document, the following terms and definitions from ECSS-E-ST-20C apply:
electrical bonding
electromagnetic compatibility (EMC)
electromagnetic interference (EMI)
electromagnetic interference safety margin (EMISM)
grounding
susceptibility
For the purpose of this document, the following terms and definitions from ECSS-E-ST-20-07C apply:
line impedance stabilization network (LISN)
overshield
3.2 Terms specific to the present document
3.2.1 balun
type of transformer converting balanced electrical signals to unbalanced electrical signals and vice
versa
NOTE The term balun comes from BALanced/UNbalanced.
3.2.2 shield transfer impedance
ratio of the current on one surface of a shield to the voltage drop generated by this current on the
opposite surface of this shield
NOTE Shields with lower transfer impedance are more effective than shields
with higher transfer impedance.
3.2.3 probe transfer impedance
ratio of voltage at the output port of the probe with respect to the causing current on the electrical line
or cable bundle under test
NOTE This ratio can be influenced by the setup.
3.3 Abbreviated terms
For the purpose of this document, the abbreviated terms from ECSS-S-ST-00-01 and the following
apply:
Abbreviation Meaning
A5 ARIANE 5
AC alternating current
ACF antenna calibration factor (reverberation chambers)
ACS attitude control system
A/D analogue/digital
ADC analogue-to-digital converter
AF antenna factor
AGND analogue ground
AIT assembly integration and test
AIV assembly integration and verification
AM amplitude modulation
AMUX analogue multiplexer
ASD amplitude spectrum density
AWG American Wire Gauge
BCI bulk current injection
BIPM Bureau International des Poids et Mesures
BW bandwidth
CAD computer-aided design
CCF chamber calibration factor (reverberation chambers)
CCS coupling cross section
CE conducted emission
CEI Commission Electrotechnique Internationale
CFRP carbon fibre reinforced plastic
C/I carrier to interference (ratio)
CISPR Comité International Spécial des Perturbations
Radioélectriques
CLF chamber loading factor (reverberation chambers)
CM common mode or communication module
CMI common mode impedance
CMV common mode voltage
CMVR common mode voltage reje
...