Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) (Withdrawn 2023)

SIGNIFICANCE AND USE
5.1 Digital integrated circuits are specified to operate with their inputs and outputs in either a logical 1 or a logical 0 state. The occurrence of signals having voltage levels not meeting the specifications of either of these levels (an upset condition) may cause the generation and propagation of erroneous data in a digital system.  
5.2 Knowledge of the radiation dose rate that causes upset in digital integrated circuits is essential for the design, production, and maintenance of electronic systems that are required to operate in the presence of pulsed radiation environments.
SCOPE
1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits only under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).  
1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation dosimetry and the recording instrumentation.  
1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested absorbs a total radiation dose exceeding some predetermined level. Because this level depends both on the kind of integrated circuit and on the application, a specific value must be agreed upon by the parties to the test (6.8).  
1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.  
1.5 Procedures for lot qualification and sampling are not included in this test method.  
1.6 Because of the variability of the response of different device types, the initial dose rate and device upset conditions for any specific test is not given in this test method but must be agreed upon by the parties to the test.  
1.7 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.  
1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
WITHDRAWN RATIONALE
This test method covered the measurement of the threshold level of radiation dose rate that causes upset in digital integrated circuits only under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear accelerator (LINAC).
Formerly under the jurisdiction of F01 on Electronics, this test method was withdrawn in November 2023. This standard is being withdrawn without replacement because Committee F01 was disbanded.

General Information

Status
Withdrawn
Publication Date
30-Apr-2016
Withdrawal Date
28-Nov-2023
Current Stage
Ref Project

Relations

Buy Standard

Standard
ASTM F744M-16 - Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric)
English language
7 pages
sale 15% off
Preview
sale 15% off
Preview
Standard
REDLINE ASTM F744M-16 - Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric)
English language
7 pages
sale 15% off
Preview
sale 15% off
Preview
Standard
ASTM F744M-16 - Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) (Withdrawn 2023)
English language
7 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)

This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the
Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.
Designation: F744M − 16
Standard Test Method for
Measuring Dose Rate Threshold for Upset of Digital
1
Integrated Circuits (Metric)
This standard is issued under the fixed designation F744M; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision.Anumber in parentheses indicates the year of last reapproval.A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope 2. Referenced Documents
2
2.1 ASTM Standards:
1.1 This test method covers the measurement of the thresh-
E666Practice for CalculatingAbsorbed Dose From Gamma
old level of radiation dose rate that causes upset in digital
or X Radiation
integrated circuits only under static operating conditions. The
E668 Practice for Application of Thermoluminescence-
radiation source is either a flash X-ray machine (FXR) or an
Dosimetry (TLD) Systems for Determining Absorbed
electron linear accelerator (LINAC).
DoseinRadiation-HardnessTestingofElectronicDevices
1.2 The precision of the measurement depends on the
E1894Guide for Selecting Dosimetry Systems for Applica-
homogeneity of the radiation field and on the precision of the
tion in Pulsed X-Ray Sources
radiation dosimetry and the recording instrumentation.
F526Test Method for Using Calorimeters for Total Dose
1.3 Thetestmaybedestructiveeitherforfurthertestsorfor
Measurements in Pulsed Linear Accelerator or Flash
purposes other than this test if the integrated circuit being
X-ray Machines
tested absorbs a total radiation dose exceeding some predeter-
3. Terminology
mined level. Because this level depends both on the kind of
integrated circuit and on the application, a specific value must
3.1 Definitions:
be agreed upon by the parties to the test (6.8).
3.1.1 combinatorial logic circuit—integrated circuit whose
output is a unique function of the inputs; the output changes if
1.4 Setup,calibration,andtestcircuitevaluationprocedures
and only if the input changes (for example, AND- and
are included in this test method.
OR-gates).
1.5 Procedures for lot qualification and sampling are not
3.1.2 dose rate—energy absorbed per unit time and per unit
included in this test method.
mass by a given material from the radiation to which it is
1.6 Because of the variability of the response of different
exposed.
device types, the initial dose rate and device upset conditions
3.1.3 dose rate threshold for upset—minimumdoseratethat
foranyspecifictestisnotgiveninthistestmethodbutmustbe
causes either: (1) the instantaneous output voltage of an
agreed upon by the parties to the test.
operating digital integrated circuit to be greater than the
1.7 The values stated in SI units are to be regarded as
specified maximum LOW value (for a LOW output level) or
standard. No other units of measurement are included in this less than the specified minimum HIGH value (for a HIGH
standard.
output level), or (2) a change of state of any stored data.
1.8 This standard does not purport to address all of the 3.1.4 sequential logic circuit—integrated circuit whose out-
safety concerns, if any, associated with its use. It is the putorinternaloperatingconditionsarenotuniquefunctionsof
responsibility of the user of this standard to establish appro- the inputs (for example, flip-flops, shift registers, and RAMs).
priate safety and health practices and determine the applica-
4. Summary of Test Method
bility of regulatory limitations prior to use.
4.1 Thetestdeviceandsuitabledosimetersareirradiatedby
eitheranFXRoralinac.Thetestdeviceisoperatingbutunder
1
This test method is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.11 on Nuclear and
2
Space Radiation Effects. For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Current edition approved May 1, 2016. Published May 2016. Originally contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
approved in 1981. Last previous edition approved in 2010 as F744M–10. DOI: Standards volume information, refer to the standard’s Document Summary page on
10.1520/F0744M-16. the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
F744M − 16
static conditions. The output(s) of the test device and of the 6.2 Secondary Emission—Another spurious component of
dosimeters are recorded. the measured signal can result from charge emission from, or
3
chargeinjectioninto,thetestd
...

This document is not an ASTM standard and is intended only to provide the user of an ASTM standard an indication of what changes have been made to the previous version. Because
it may not be technically possible to adequately depict all changes accurately, ASTM recommends that users consult prior editions as appropriate. In all cases only the current version
of the standard as published by ASTM is to be considered the official document.
Designation: F744M − 10 F744M − 16
Standard Test Method for
Measuring Dose Rate Threshold for Upset of Digital
1
Integrated Circuits (Metric)
This standard is issued under the fixed designation F744M; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope
1.1 This test method covers the measurement of the threshold level of radiation dose rate that causes upset in digital integrated
circuits only under static operating conditions. The radiation source is either a flash X-ray machine (FXR) or an electron linear
accelerator (LINAC).
1.2 The precision of the measurement depends on the homogeneity of the radiation field and on the precision of the radiation
dosimetry and the recording instrumentation.
1.3 The test may be destructive either for further tests or for purposes other than this test if the integrated circuit being tested
absorbs a total radiation dose exceeding some predetermined level. Because this level depends both on the kind of integrated circuit
and on the application, a specific value must be agreed upon by the parties to the test (6.8).
1.4 Setup, calibration, and test circuit evaluation procedures are included in this test method.
1.5 Procedures for lot qualification and sampling are not included in this test method.
1.6 Because of the variability of the response of different device types, the initial dose rate and device upset conditions for any
specific test is not given in this test method but must be agreed upon by the parties to the test.
1.7 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
1.8 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility
of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory
limitations prior to use.
2. Referenced Documents
2
2.1 ASTM Standards:
E665 Practice for Determining Absorbed Dose Versus Depth in Materials Exposed to the X-Ray Output of Flash X-Ray
3
Machines (Withdrawn 2000)
E666 Practice for Calculating Absorbed Dose From Gamma or X Radiation
E668 Practice for Application of Thermoluminescence-Dosimetry (TLD) Systems for Determining Absorbed Dose in
Radiation-Hardness Testing of Electronic Devices
E1894 Guide for Selecting Dosimetry Systems for Application in Pulsed X-Ray Sources
F526 Test Method for Using Calorimeters for Total Dose Measurements in Pulsed Linear Accelerator or Flash X-ray Machines
3. Terminology
3.1 Definitions:
3.1.1 determined integratedcombinatorial logic circuit—integrated circuit whose output is a unique function of the inputs; the
output changes if and only if the input changes (for example, AND- and OR-gates).
3.1.2 dose rate—energy absorbed per unit time and per unit mass by a given material from the radiation to which it is exposed.
1
This test method is under the jurisdiction of ASTM Committee F01 on Electronics and is the direct responsibility of Subcommittee F01.11 on Nuclear and Space
Radiation Effects.
Current edition approved May 1, 2010May 1, 2016. Published June 2010May 2016. Originally approved in 1981. Last previous edition approved in 20032010 as
F744M – 97F744M – 10. (2003). DOI: 10.1520/F0744M-10.10.1520/F0744M-16.
2
For referenced ASTM standards, visit the ASTM website, www.astm.org, or contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM Standards
volume information, refer to the standard’s Document Summary page on the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
F744M − 16
3.1.3 dose rate threshold for upset—minimum dose rate that causes either: (1) the instantaneous output voltage of an operating
digital integrated circuit to be greater than the specified maximum LOW value (for a LOW output level) or less than the specified
minimum HIGH value (for a HIGH output level), or (2) a change of state of any stored data.
3.1.4 non-determined integratedsequential logic circuit—integrated circuit whose output or internal operating conditions are not
unique functions of the i
...

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
Contact ASTM International (www.astm.org) for the latest information
Designation: F744M − 16
Standard Test Method for
Measuring Dose Rate Threshold for Upset of Digital
1
Integrated Circuits (Metric)
This standard is issued under the fixed designation F744M; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (´) indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the U.S. Department of Defense.
1. Scope 2. Referenced Documents
2
2.1 ASTM Standards:
1.1 This test method covers the measurement of the thresh-
E666 Practice for Calculating Absorbed Dose From Gamma
old level of radiation dose rate that causes upset in digital
or X Radiation
integrated circuits only under static operating conditions. The
E668 Practice for Application of Thermoluminescence-
radiation source is either a flash X-ray machine (FXR) or an
Dosimetry (TLD) Systems for Determining Absorbed
electron linear accelerator (LINAC).
Dose in Radiation-Hardness Testing of Electronic Devices
1.2 The precision of the measurement depends on the
E1894 Guide for Selecting Dosimetry Systems for Applica-
homogeneity of the radiation field and on the precision of the
tion in Pulsed X-Ray Sources
radiation dosimetry and the recording instrumentation.
F526 Test Method for Using Calorimeters for Total Dose
1.3 The test may be destructive either for further tests or for
Measurements in Pulsed Linear Accelerator or Flash
purposes other than this test if the integrated circuit being
X-ray Machines
tested absorbs a total radiation dose exceeding some predeter-
3. Terminology
mined level. Because this level depends both on the kind of
integrated circuit and on the application, a specific value must
3.1 Definitions:
be agreed upon by the parties to the test (6.8).
3.1.1 combinatorial logic circuit—integrated circuit whose
output is a unique function of the inputs; the output changes if
1.4 Setup, calibration, and test circuit evaluation procedures
and only if the input changes (for example, AND- and
are included in this test method.
OR-gates).
1.5 Procedures for lot qualification and sampling are not
3.1.2 dose rate—energy absorbed per unit time and per unit
included in this test method.
mass by a given material from the radiation to which it is
1.6 Because of the variability of the response of different
exposed.
device types, the initial dose rate and device upset conditions
3.1.3 dose rate threshold for upset—minimum dose rate that
for any specific test is not given in this test method but must be
causes either: (1) the instantaneous output voltage of an
agreed upon by the parties to the test.
operating digital integrated circuit to be greater than the
1.7 The values stated in SI units are to be regarded as specified maximum LOW value (for a LOW output level) or
standard. No other units of measurement are included in this
less than the specified minimum HIGH value (for a HIGH
standard. output level), or (2) a change of state of any stored data.
1.8 This standard does not purport to address all of the 3.1.4 sequential logic circuit—integrated circuit whose out-
safety concerns, if any, associated with its use. It is the put or internal operating conditions are not unique functions of
responsibility of the user of this standard to establish appro- the inputs (for example, flip-flops, shift registers, and RAMs).
priate safety and health practices and determine the applica-
4. Summary of Test Method
bility of regulatory limitations prior to use.
4.1 The test device and suitable dosimeters are irradiated by
either an FXR or a linac. The test device is operating but under
1
This test method is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.11 on Nuclear and
2
Space Radiation Effects. For referenced ASTM standards, visit the ASTM website, www.astm.org, or
Current edition approved May 1, 2016. Published May 2016. Originally contact ASTM Customer Service at service@astm.org. For Annual Book of ASTM
approved in 1981. Last previous edition approved in 2010 as F744M – 10. DOI: Standards volume information, refer to the standard’s Document Summary page on
10.1520/F0744M-16. the ASTM website.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States
1

---------------------- Page: 1 ----------------------
F744M − 16
static conditions. The output(s) of the test device and of the 6.2 Secondary Emission—Another spurious component of
dosimeters are recorded. the measured signal can result from charge emission from, or
3
charge injection into, the test device and test circuit. This may
4.2 The dose rate is varied to d
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.