Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications

SCOPE
1.1 This specification covers pure aluminum metal (unalloyed) for use in evaporation sources and sputtering targets. This material is intended as a raw material for electronic applications. The material is used as-supplied in some cases (for example, as e-beam evaporation sources). In other instances it may be remelted, alloyed, cast and processed by the purchaser to make finished products (for example, sputtering targets).  
1.2 This specification sets purity grade levels, physical attributes, analytical methods, and packaging.  
1.3 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

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Publication Date
09-Dec-1999
Technical Committee
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ASTM F1513-99 - Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
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NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
Designation: F 1513 – 99
Standard Specification for
Pure Aluminum (Unalloyed) Source Material for Electronic
Thin Film Applications
This standard is issued under the fixed designation F 1513; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
TABLE 1 Aluminum Grades
1. Scope
Maximum Metallic Impurity
1.1 This specification covers pure aluminum metal (unal-
Grade Purity, %
Content (by weight), ppm
loyed) for use in evaporation sources and sputtering targets.
6N 99.9999 1
This material is intended as a raw material for electronic
5N5 99.9995 5
applications. The material is used as-supplied in some cases
5N 99.999 10
(for example, as e-beam evaporation sources). In other in-
stances it may be remelted, alloyed, cast and processed by the
purchaser to make finished products (for example, sputtering
5.1.3 Whether or not certification is required (12.1), and
targets).
5.1.4 Whether or not a sample representative of the finished
1.2 This specification sets purity grade levels, physical
product is required to be provided by the supplier to the
attributes, analytical methods, and packaging.
purchaser.
1.3 The values stated in SI units are to be regarded as the
standard. The values given in parentheses are for information 6. Impurities
only.
6.1 The minimum suite of metallic impurity elements to be
analyzed is defined in Table 2. Acceptable analysis methods
2. Referenced Documents
and detection limits are specified in Section 11. Elements not
2.1 ASTM Standards:
detected will be counted and reported as present at the
D 1971 Practices for Digestion of Samples for Determina-
detection limit. Additional elements may be analyzed and
tion of Metals by Flame Atomic Absorption or Plasma
reported, as agreed upon between the supplier and the pur-
Emission Spectroscopy
chaser, but these shall not be counted in defining the grade
designation.
3. Terminology
6.2 Nonmetalic elements to be analyzed and reported are C,
3.1 material lot—material melted and cast from one cru-
H, O, N, and S.
cible charge.
6.3 Acceptable limits and analytical techniques for particu-
lar elements in critical applications shall be as agreed upon
4. Classification
between the supplier and the purchaser.
4.1 Grades of aluminum are defined in Table 1. Impurity
6.4 Fluorine and chlorine may be important impurities in
contents are reported in parts per million by weight (wt ppm).
some applications. Acceptable limits and analytical techniques
4.2 Purity and total metallic impurity levels are based upon
shall be agreed upon between the supplier and the purchaser.
elements listed in Table 2.
7. Grain Size
5. Ordering Information
7.1 Grain size and measurement method for grain size shall
5.1 Orders for pure aluminum source material shall include
be agreed upon between the supplier and the purchaser.
the following:
5.1.1 Grade (4.1),
TABLE 2 Minimum Suite of Metallic Elements to be Analyzed
5.1.2 Configuration (8.1 and 8.2),
Antimony Gold Silver
Arsenic Iron Sodium
Beryllium Lithium Thorium
Boron Magnesium Tin
This specification is under the jurisdiction of ASTM Committee F-1 on
Calcium Manganese Titanium
Electronics and is the direct responsibility of Subcommittee F01.17 on Sputter
Cerium Nickel Uranium
Metallization.
Cesium Phosphorus Vanadium
Current edition approved Dec. 10, 1999. Published February 2000. Originally
Chromium Potassium Zinc
published as F 1513–94. Last previous edition F 1513–94. Copper Silicon Zirconium
Annual Book of ASTM Standards, Vol 11.01.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
NOTICE: This standard has either been superceded and replaced by a new version or discontinued.
Contact ASTM International (www.astm.org) for the latest information.
F 1513
8. Dimensions 11.1.5 All Others—AA, inductively coupled plasma
...

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