ASTM F487-88(1995)e1

NOTICE: This standard has either been superseded and replaced by a new version or
withdrawn. Contact ASTM International (www.astm.org) for the latest information.
e1
Designation: F 487 – 88 (Reapproved 1995)
AMERICAN SOCIETY FOR TESTING AND MATERIALS
100 Barr Harbor Dr., West Conshohocken, PA 19428
Reprinted from the Annual Book of ASTM Standards. Copyright ASTM
Standard Specification for
Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-
Bonding
This standard is issued under the fixed designation F 487; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
e NOTE—Keywords were added editorially in June 1995.
1. Scope 3.1.5 Special requirements, such as for certificate of com-
pliance (see Section 10).
1.1 This specification covers aluminum–1 % silicon alloy
wire for internal connections in semiconductor devices and is
4. Physical Requirements
limited to wire of diameter up to and including 0.0020 in.
4.1 Elongation and breaking-load ranges for the wire shall
(0.051 mm). For diameters larger than 0.0020 in. (0.051 mm),
be specified by the purchaser. The maximum ranges of these
the specifications are to be agreed upon between the purchaser
mechanical properties are listed in Table 1.
and the supplier.
4.2 Mechanical property requirements in ranges smaller
1.2 The values stated in inch-pound units are to be regarded
than those listed in Table 1 may be specified upon agreement
as the standard. The values given in parentheses are for
between the purchaser and the supplier.
information only.
NOTE 1—The nature of aluminum–1 % silicon alloy is such that the
2. Referenced Documents
mechanical properties of both as-drawn and annealed wires overlap
considerably. It is also possible to alter the properties of hard wire by
2.1 ASTM Standards:
varying the manufacturing parameters and procedures. For these reasons,
F 16 Test Methods for Measuring Diameter or Thickness of
no distinction is made between the two types of wire in this specification.
Wire and Ribbon for Electronic Devices and Lamps
F 72 Specification for Gold Wire for Semiconductor Lead
5. Dimensions, Weights, and Permissible Variations
Bonding
5.1 Wire size shall be expressed in terms of wire diameter in
F 205 Test Method for Measuring Diameter of Fine Wire by
decimal fractions of an inch (or millimetre) or in weight per
Weighing
unit length. Tolerances for various size ranges are specified in
F 219 Test Methods of Testing Fine Round and Flat Wire for
Table 2.
Electron Devices and Lamps
5.2 When wire size is expressed in terms of weight, the
F 584 Practice for Visual Inspection of Semiconductor Lead
following values shall be used:
Bonding Wire
5.2.1 Density of Aluminum–1 % Silicon—2.7 g/cm .
2.2 Military Standard:
5.2.2 Weight of a 200-mm Length of Wire 0.0254 mm in
MIL-STD-105 Sampling Procedures and Tables for Inspec-
Diameter—0.274 mg.
tion by Attributes
6. Surface Finish
3. Ordering Information
6.1 The wire surface shall be clean and free of finger oils,
3.1 Orders for material under this specification shall include
lubricant residues, stains, and particulate matter.
the following information:
6.2 Mechanical damage to the wire surface, such as nicks,
3.1.1 Quantity,
scratches, and kinks, shall be held to a minimum.
3.1.2 Size (see Section 5),
6.3 The inspection shall be carried out under conditions
3.1.3 Breaking load and elongation (see Section 4),
prescribed in Practice F 584 unless some other inspection
3.1.4 Packaging and marking (see Section 11), and
method is agreed upon between the purchaser and the supplier.
The nature and extent of defects permitted to be present on the
surface of the wire shall be agreed upon between the purchaser
This specification is under the jurisdiction of ASTM Committee F-1 on
and the supplier.
Electronics and is the direct responsibility of Subcommittee F01.07 on Intercon-
nection Bonding Carrier Bonding.
7. Chemical Requirements
Current edition approved May 27, 1988. Published July 1988. Originally
published as F 487 – 77. Last previous edition F 487 – 82.
7.1 The alloy composition shall be 1.00 6 0.15 % silicon,
Annual Book of ASTM Standards, Vol 10.04.
and between 98.84 and 99.15 % aluminum. All other elements
Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS. are considered impurities.
F 487
TABLE 1 Elongation and Breaking Load of Aluminum–1 % NOTE 2—Optical methods for measuring wire diameter are under
Silicon Alloy Wire
development by Committee F-1 on Electronics.
NOTE 1—Select the desired nominal breaking load and elongation for 9.3 Chemical Analysis—Verify that the chemical require-
the wire by specifying a range of mechanical properties that includes the
ments are satisfied by means of spectrographic analysis or
A
desired values.
other means agreed upon between the purchaser and the
Breaking Load, g Elongation, %
supplier.
Nominal Diameter,
Max Max
in. (mm)
Min Max Min Max
B C
10. Certification
Range Range
0.0005 (0.013) 1 5 2 0.5 2.0 1.5 10.1 When agreed upon in writing by the purchaser and the
0.0007 (0.018) 3 12 2 0.5 3.0 2.0
supplier, a certification shall be made the basis of acceptance of
0.0010 (0.025) 12 22 3 0.5 4.0 2.5
the material. This shall consist of a copy of the manufacturer’s
0.0012 (0.030) 14 30 3 0.5 4.0
...