ASTM F487-88(2001)

NOTICE: This standard has either been superseded and replaced by a new version or withdrawn.
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Designation: F 487 – 88 (Reapproved 2001)
Standard Specification for
Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-
Bonding
This standard is issued under the fixed designation F 487; the number immediately following the designation indicates the year of
original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A
superscript epsilon (e) indicates an editorial change since the last revision or reapproval.
1. Scope 3.1.3 Breaking load and elongation (see Section 4),
3.1.4 Packaging and marking (see Section 11), and
1.1 This specification covers aluminum–1 % silicon alloy
3.1.5 Special requirements, such as for certificate of com-
wire for internal connections in semiconductor devices and is
pliance (see Section 10).
limited to wire of diameter up to and including 0.0020 in.
(0.051 mm). For diameters larger than 0.0020 in. (0.051 mm),
4. Physical Requirements
the specifications are to be agreed upon between the purchaser
4.1 Elongation and breaking-load ranges for the wire shall
and the supplier.
be specified by the purchaser. The maximum ranges of these
1.2 The values stated in inch-pound units are to be regarded
mechanical properties are listed in Table 1.
as the standard. The values given in parentheses are for
4.2 Mechanical property requirements in ranges smaller
information only.
than those listed in Table 1 may be specified upon agreement
2. Referenced Documents between the purchaser and the supplier.
2.1 ASTM Standards:
NOTE 1—The nature of aluminum–1 % silicon alloy is such that the
F 16 Test Methods for Measuring Diameter or Thickness of mechanical properties of both as-drawn and annealed wires overlap
considerably. It is also possible to alter the properties of hard wire by
Wire and Ribbon for Electronic Devices and Lamps
varying the manufacturing parameters and procedures. For these reasons,
F 72 Specification for Gold Wire for Semiconductor Lead
2 no distinction is made between the two types of wire in this specification.
Bonding
F 205 Test Method for Measuring Diameter of FineWire by
5. Dimensions, Weights, and Permissible Variations
Weighing
5.1 Wiresizeshallbeexpressedintermsofwirediameterin
F219 TestMethodsofTestingFineRoundandFlatWirefor
decimal fractions of an inch (or millimetre) or in weight per
Electron Devices and Lamps
unit length. Tolerances for various size ranges are specified in
F 584 Practice forVisual Inspection of Semiconductor Lead
Table 2.
Bonding Wire
5.2 When wire size is expressed in terms of weight, the
2.2 Military Standard:
following values shall be used:
MIL-STD-105 Sampling Procedures and Tables for Inspec-
5.2.1 Density of Aluminum–1 % Silicon—2.7 g/cm .
tion by Attributes
5.2.2 Weight of a 200-mm Length of Wire 0.0254 mm in
Diameter—0.274 mg.
3. Ordering Information
3.1 Orders for material under this specification shall include
6. Surface Finish
the following information:
6.1 The wire surface shall be clean and free of finger oils,
3.1.1 Quantity,
lubricant residues, stains, and particulate matter.
3.1.2 Size (see Section 5),
6.2 Mechanical damage to the wire surface, such as nicks,
scratches, and kinks, shall be held to a minimum.
6.3 The inspection shall be carried out under conditions
This specification is under the jurisdiction of ASTM Committee F01 on
Electronics and is the direct responsibility of Subcommittee F01.07 on Intercon-
prescribed in Practice F 584 unless some other inspection
nection Bonding Carrier Bonding.
method is agreed upon between the purchaser and the supplier.
Current edition approved May 27, 1988. Published July 1988. Originally
The nature and extent of defects permitted to be present on the
published as F 487 – 77. Last previous edition F 487 – 82.
surface of the wire shall be agreed upon between the purchaser
Annual Book of ASTM Standards, Vol 10.04.
AvailablefromStandardizationDocumentsOrderDesk,Bldg.4SectionD,700
and the supplier.
Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.
Copyright © ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.
F 487 – 88 (2001)
TABLE 1 Elongation and Breaking Load of Aluminum–1 %
9.2.2 Measure the diameter indirectly (by weighing) in
Silicon Alloy Wire
accordance with Test Method F 205.
9.2.3 Measure the diameter by optical means agreed upon
NOTE 1—Select the desired nominal breaking load and elongation for
the wire by specifying a range of mechanical properties that includes the
between the purchaser and the supplier.
A
desired values.
NOTE 2—Optical methods for measuring wire diameter are under
Breaking Load, g Elongation, %
development by Committee F-1 on Electronics.
Nominal Diameter,
Max Max
in. (mm)
9.3 Chemical Analysis—Verify that the chemical require-
Min Max Min Max
B C
Range Range
ments are satisfied by means of spectrographic analysis or
0.0005 (0.013) 1 5 2 0.5 2.0 1.5
other means agreed upon between the purchaser and the
0.0007 (0.018) 3 12 2 0.5 3.0 2.0
supplier.
0.0010 (0.025) 12 22 3 0.5 4.0 2.5
0.0012 (0.030) 14 30 3 0.5 4.0 2.5
0.00125 (0.032) 15 32 3 0.5 4.0 3.0 10. Certification
0.0015 (0.038) 20 50 4 0.5 4.0 3.0
10.1 When agreed upon in writing by the purchaser and the
0.0020 (0.051) 32 90 6 1.0 4.0 3.0
supplier,acertificationshallbemadethebasisofacceptanceof
A
Example: Wire of 0.0010-in. (0.025-mm) diameter with a breaking load of 16 g
the material. This shall consist of a copy of the manufacturer’s
and an elongati
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