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EUROPEAN STANDARD EN 62258-1
NORME EUROPÉENNE
EUROPÄISCHE NORM November 2005

ICS 31.080.99 Supersedes ES 59008-1:1999 & ES 59008-2:1999 & ES 59008-3:1999


English version


Semiconductor die products
Part 1: Requirements for procurement and use
(IEC 62258-1:2005)


Produits de matrice de semi-conducteur Halbleiter-Chip-Erzeugnisse
Partie 1: Exigences pour l'acquisition Teil 1: Anforderungen für Beschaffung
et l'utilisation und Anwendung
(CEI 62258-1:2005) (IEC 62258-1:2005)






This European Standard was approved by CENELEC on 2005-10-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 62258-1:2005 E

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EN 62258-1:2005 - 2 -
Foreword
The text of document 47/1820/FDIS, future edition 1 of IEC 62258-1, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-1 on 2005-10-01.
This European Standard supersedes ES 59008-1:1999, ES 59008-2:1999 and ES 59008-3:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-10-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-1:2005 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2 NOTE Harmonized in EN 60068-2 series (not modified).
ISO 9000 NOTE Harmonized as EN ISO 9000:2000 (not modified).
ISO 10303 NOTE Harmonized in ENV ISO 10303 series (not modified).
IEC 61540 NOTE Harmonized as HD 639 S1:2002 (modified).
ISO 8879 NOTE Harmonized as EN 28879:1990 (not modified).
IEC 61340-5-1 NOTE Harmonized as EN 61340-5-1:2001 (not modified).
IEC 61340-5-2 NOTE Harmonized as EN 61340-5-2:2001 (not modified).
__________

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- 3 - EN 62258-1:2005
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191-4 1999 Mechanical standardization of EN 60191-4 1999
A1 2001 semiconductor devices A1 2002
A2 2002 Part 4: Coding system and classification A2 2002
into forms of package outlines for
semiconductor device packages

IEC 61360-1 2002 Standard data element types with EN 61360-1 2002
associated classification scheme for
electric components
Part 1: Definitions - Principles and
methods

IEC 62258-2 2005 Semiconductor die products EN 62258-2 2005
Part 2: Exchange data formats

ISO 14644-1 1999 Cleanrooms and associated controlled EN ISO 14644-1 1999
environments
Part 1: Classification of air cleanliness

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INTERNATIONAL IEC


STANDARD 62258-1





First edition
2005-08


Semiconductor die products –
Part 1:
Requirements for procurement and use

 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale W
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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– 2 – 62258-1  IEC:2005(E)
CONTENTS
FOREWORD.5
INTRODUCTION .7

1 Scope .8
2 Normative references.8
3 Terms and definitions.9
3.1 Basic definitions .9
3.2 General terminology.9
3.3 Semiconductor manufacturing and interconnection terminology .11
4 General requirements .12
4.1 General .12
4.2 Identity .13
4.3 Source.13
4.4 Function .13
4.5 Electrical and physical characteristics .13
4.6 Geometry.13
4.7 Connectivity.13
4.8 Documentation .13
4.9 Test and quality .13
4.10 Handling .13
4.11 Assembly.13
4.12 Thermal data .13
4.13 Models .14
5 Data exchange.14
6 Requirements for bare die with and without connection structures .14
6.1 Form of supply.14
6.2 Die name.14
6.3 Die version .14
6.4 Manufacturer .14
6.5 Type number .14
6.6 Function .14
6.7 Information source.14
6.8 Data version .14
6.9 Units of measurement.14
6.10 Geometric view.14
6.11 Die size .15
6.12 Die thickness .15
6.13 Geometric origin .15
6.14 Dimension tolerances .15
6.15 Pad count .15
6.16 Pad information .15
6.17 Signal type.15
6.18 Technology.15
6.19 Semiconductor material .15
6.20 Substrate material .15
6.21 Substrate connection .16

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62258-1 IEC:2005(E) – 3 –
6.22 Passivation material.16
6.23 Pad metallization .16
6.24 Backside finish .16
6.25 Wafer size .16
6.26 Wafer thickness.16
6.27 Wafer map.16
6.28 Power dissipation.16
6.29 Operating temperature.16
6.30 Packing .16
6.31 Supplier.16
6.32 Bump material .16
6.33 Bump size.17
6.34 Bump height tolerance .17
6.35 Connection material.17
6.36 Die picture .17
6.37 Die fiducials.17
7 Minimally packaged devices .17
7.1 General .17
7.2 Terminal position .17
7.3 Terminal size .17
7.4 Number of terminals .18
7.5 Package size .18
7.6 Seated height .18
7.7 Encapsulation material.18
7.8 Terminal material.18
7.9 Package style code.18
8 Test, quality and reliability.18
8.1 General .18
8.2 Outgoing quality level.18
8.3 Electrical parameters specified .18
8.4 Compliance to standards .18
8.5 Additional device screening.19
8.6 Reliability.19
8.7 Product status .19
9 Requirements for handling and shipping.19
9.1 General .19
9.2 Specific requirements for bare die or wafers - Die version .20
9.3 Specific requirements for wafers - Product grading.20
9.4 Special item requirements.20
10 Requirements for storage.21
10.1 General .21
10.2 Storage duration and conditions .21
10.3 Long-term storage .21
11 Information related to assembly .21
11.1 General .21
11.2 Attach methods and materials .21
11.3 Bonding method and materials .22

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– 4 – 62258-1  IEC:2005(E)
Annex A (informative) Terminology.23
A.1 Assembly terminology .23
A.2 Test terminology .23
A.3 Semiconductor terminology .25
A.4 Semiconductor assembly technology.27
A.5 Design and simulation terminology .28
A.6 Packing and delivery terminology .31
A.7 Handling terminology .32

Annex B (informative) Acronyms.33
B.1 Organizations and standards.33
B.2 General terminology.33
B.3 Manufacturing and test terminology.34
B.4 Semiconductors .35
B.5 Design, simulation and data exchange .35
B.6 Electronic technology.36
B.7 Packaging.37

Bibliography .38

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62258-1 IEC:2005(E) – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DIE PRODUCTS –

Part 1: Requirements for procurement and use


FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62258-1 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1820/FDIS 47/1832/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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– 6 – 62258-1  IEC:2005(E)
IEC 62258, as currently conceived, consists of the following parts, under the general title
Semiconductor die products:
Part 1: Requirements for procurement and use
1
Part 2: Exchange data formats
Part 3: Recommendations for good practice in handling, packing and storage (Technical
1
Report)
2
Part 4: Questionnaire for die users and suppliers (Technical Report)
2
Part 5: Requirements for information concerning electrical simulation
2
Part 6: Requirements for information concerning thermal simulation
Further parts may be added as required.
A bilingual version of this publication may be issued at a later date.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.

___________
1
To be published.
2
In preparation.

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62258-1 IEC:2005(E) – 7 –
INTRODUCTION
th
This International Standard is based on the work carried out in the ESPRIT 4 Framework
project GOOD-DIE which resulted in the publication of the ES59008 series of European
specifications. Organizations that helped prepare this standard include the ESPRIT GOOD-DIE
project, The Die Products Consortium, JEITA, JEDEC and ZVEI.

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– 8 – 62258-1  IEC:2005(E)
SEMICONDUCTOR DIE PRODUCTS –

Part 1: Requirements for procurement and use



1 Scope
This part of IEC 62258 has been developed to facilitate the production, supply and use of
semiconductor die products, including
– wafers,
– singulated bare die,
– die and wafers with attached connection structures,
– minimally or partially encapsulated die and wafers.
This standard defines the minimum requirements for the data which are needed to describe
such die products and is intended as an aid in the design of and procurement of assemblies
incorporating die products. It covers the requirements for data, including
– product identity,
– product data,
– die mechanical information,
– test, quality, assembly and reliability information,
– handling, shipping and storage information.
This standard covers the specific requirements for data needed to describe the geometrical
properties of die, their physical properties and the means of connection necessary for their use
in the development and manufacture of products. It also contains, in Annexes A and B,
terminology and a list of common acronyms, respectively.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60191-4:1999, Mechanical standardization of semiconductor devices – Part 4: Coding
system and classification into forms of package outlines for semiconductor device packages
Amendment 1 (2001)
Amendment 2 (2002)
IEC 61360-1:2002, Standard data element types with associated classification scheme for
electric components – Part 1: Definitions – Principles and methods
3
IEC 62258-2, Semiconductor die products – Part 2: Exchange data formats
ISO 14644-1:1999, Cleanrooms and associated controlled environments – Part 1: Classification
of air cleanliness
___________
3 To be published.

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62258-1 IEC:2005(E) – 9 –
3 Terms and definitions
For the purposes of this document, the following terms apply.
NOTE 1 All terms defined here are in addition to relevant terms defined in IEC 60050: International
Electrotechnical Vocabulary.
NOTE 2 Additional terms and acronyms are given for information in Annexes A and B.
3.1 Basic definitions
3.1.1
die (singular or plural)
separated piece(s) of semiconductor wafer that constitute(s) a discrete semiconductor or whole
integrated circuit
3.1.2
wafer
slice or flat disc, either of semiconductor material or of such a material deposited on a
substrate, in which devices or circuits are simultaneously processed and which may be
subsequently separated into die
3.1.3
singulated die
individual and distinct die which have been separated from the wafer
3.1.4
bare die
unpackaged discrete semiconductor or integrated circuit with pads on the upper surface
suitable for interconnection to the substrate or package
3.1.5
bare die with connection structures
unpackaged die that have had added bumps, lead frames or other terminations to interconnect
for electrical attachment
NOTE Typically these can be die that have had solder or other metallic bumps added to the metallized pads on the
die in the form of peripheral bumps or arrays (also known as flip-chip) or die that have had fine leads attached to
the metallized pads on the die known as TAB.
3.1.6
minimally packaged die
MPD
die that have had some exterior packaging medium and interconnection structure added for
protection and ease of handling
NOTE This definition includes such packaging technologies as chip scale packages (CSP) in which the area of the
package is not significantly greater than the area of the bare die.
3.1.7
die device
bare die, with or without connection structures, or a minimally packaged die
3.2 General terminology
3.2.1
chip
common parlance for die

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– 10 – 62258-1  IEC:2005(E)
3.2.2
chip scale package
chip size package
CSP
generic term for packaging technologies that result in a packaged part that is only marginally
larger than the internal die
3.2.3
discrete (semiconductor)
single two-, three- or four-terminal semiconductor device
NOTE Discrete semiconductors include such devices as individual diodes, transistors and thyristors.
3.2.4
hybrid (circuit)
module or encapsulated sub-assembly that comprises semiconductor die and printed or
otherwise attached passive components
NOTE Also see m
...