SIST EN 61192-5:2008

SLOVENSKI STANDARD
01-februar-2008
Zahteve za izdelavo spajkanih elektronskih sestavov - 5. del: Nadaljnja obdelava,
predelava in popravilo spajkanih elektronskih sestavov (IEC 61192-5:2007)
Workmanship requirements for soldered electronic assemblies - Part 5: Rework,
modification and repair of soldered electronic assemblies
Anforderungen an die Ausführungsqualität von Lötbaugruppen - Teil 5: Nacharbeit,
Änderungen und Reparatur von gelöteten elektronischen Baugruppen
Exigences relatives a la qualité d'exécution des assemblages électroniques brasés -
Partie 5: Retouche, modification et réparation des assemblages électroniques brasés
Ta slovenski standard je istoveten z: EN 61192-5:2007
ICS:
31.190
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61192-5
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 31.190
English version
Workmanship requirements for soldered electronic assemblies -
Part 5: Rework, modification and repair of soldered electronic assemblies
(IEC 61192-5:2007)
Exigences relatives à la qualité Anforderungen an die Ausführungsqualität
d'exécution des assemblages von Lötbaugruppen -
électroniques brasés - Teil 5: Nacharbeit, Änderungen
Partie 5: Retouche, modification und Reparatur von gelöteten
et réparation des assemblages elektronischen Baugruppen
électroniques brasés (IEC 61192-5:2007)
(CEI 61192-5:2007)
This European Standard was approved by CENELEC on 2007-06-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61192-5:2007 E
Foreword
The text of document 91/652/FDIS, future edition 1 of IEC 61192-5, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61192-5 on 2007-06-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2008-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61192-5:2007 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 61760-1 NOTE Harmonized as EN 61760-1:2006 (not modified).
ISO 9000 NOTE Harmonized as EN ISO 9000:2005 (not modified).
ISO 9001 NOTE Harmonized as EN ISO 9001:2000 (not modified).
ISO 9453 NOTE Harmonized as EN ISO 9453:2006 (not modified).
ISO 9454-1 NOTE Harmonized as EN 29454-1:2003 (not modified).
__________
- 3 - EN 61192-5:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions

1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly
1)
IEC 61190-1-2 - Attachment materials for electronic EN 61190-1-2 2007
assembly -
Part 1-2: Requirements for soldering paste for
high-quality interconnects in electronics
assembly
1)
IEC 61190-1-3 - Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

IEC 61191-1 1998 Printed board assemblies - EN 61191-1 1998
Part 1: Generic specification - Requirements
for soldered electrical and electronic
assemblies using surface mount and related
assembly technologies
IEC 61191-2 1998 Printed board assemblies - EN 61191-2 1998
Part 2: Sectional specification - Requirements
for surface mount soldered assemblies

1) 2)
IEC 61191-3 - Printed board assemblies - EN 61191-3 1998
Part 3: Sectional specification - Requirements
for through-hole mount soldered assemblies

1)
Undated reference.
2)
Valid edition at date of issue.

Publication Year Title EN/HD Year
1) 2)
IEC 61191-4 - Printed board assemblies - EN 61191-4 1998
Part 4: Sectional specification - Requirements
for terminal soldered assemblies

1) 2)
IEC 61192-1 - Workmanship requirements for soldered EN 61192-1 2003
electronic assemblies -
Part 1: General
1) 2)
IEC 61192-2 - Workmanship requirements for soldered EN 61192-2 2003
electronic assemblies -
Part 2: Surface-mount assemblies

1) 2)
IEC 61192-3 - Workmanship requirements for soldered EN 61192-3 2003
electronic assemblies -
Part 3: Through-hole mount assemblies

1) 2)
IEC 61192-4 - Workmanship requirements for soldered EN 61192-4 2003
electronic assemblies -
Part 4: Terminal assemblies
1) 2)
IEC 61193-1 - Quality assessment systems - EN 61193-1 2002
Part 1: Registration and analysis of defects
on printed board assemblies
IEC 61249 Series Materials for printed boards and other EN 61249 Series
interconnecting structures
INTERNATIONAL IEC
STANDARD 61192-5
First edition
2007-05
Workmanship requirements
for soldered electronic assemblies –
Part 5:
Rework, modification and repair
of soldered electronic assemblies
PRICE CODE
Commission Electrotechnique Internationale W
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 61192-5 © IEC:2007(E)
CONTENTS
FOREWORD.5

1 Scope.7
2 Normative references .8
3 Terminology .9
3.1 Terms and definitions .9
3.2 Abbreviations .9
4 Classification of rework activities.10
4.1 Pre-soldering rework .10
4.2 Post-soldering rework.10
4.3 Essential prerequisites for successful and reliable rework .10
5 Pre-soldering rework .11
5.1 General .11
5.2 Reworking solder paste and non-conducting adhesive deposits.11
5.2.1 General .11
5.2.2 General misalignment or smudging of deposits.11
5.2.3 Local misalignment or smudging of deposit.11
5.2.4 General paste or adhesive quantity incorrect .12
5.2.5 Local paste or adhesive quantity incorrect .12
5.3 Reworking placed components .12
5.3.1 General overall component misalignment .12
5.3.2 Local component misalignment.12
5.4 Realigning components after curing thermoplastic adhesive .12
5.5 Realigning components after curing thermosetting adhesive.12
6 Factors affecting post-soldering rework .13
6.1 Component marking and unmarked components .13
6.2 Reuse of removed components .13
6.3 Sensitive components .13
6.4 Printed board layout design and space constraints .14
6.5 Heat-sink effects .14
6.6 Printed board material type .14
6.7 Solder resist material and aperture size .15
6.8 Reworking individual fine pitch device leads .16
6.9 Reworking grid arrays .16
7 Preparation for post-soldering rework and repair .17
7.1 Electrostatic precautions .17
7.2 Avoiding exposure of components to contaminants.17
7.3 Removal of conformal coating .17
7.4 Unsuitable components .18
7.5 Cleaning prior to rework .18
7.6 Protecting adjacent sensitive components .18
7.7 Baking of assemblies prior to component replacement .18
7.8 Preheating large multilayer boards .18
7.9 Preheating replacement sensitive components .18
8 Post-soldering rework.19
8.1 General .19

61192-5 © IEC:2007(E) – 3 –
8.2 Component realignment (tweaking) .19
8.3 Component removal .19
8.4 Removal of adjacent components .19
8.5 Reuse of components.19
8.6 Addition of flux and solder .20
8.7 Topping-up.20
8.8 Removal of excess solder from joints .21
8.9 Preparation of lands before component replacement .21
8.10 Component replacement.22
8.11 Cleaning (if required).22
8.12 Visual inspection and electrical testing .22
8.13 Checking thermal integrity of solder joints .22
8.14 Replacement of local conformal coating (if required) .22
9 Selection of rework equipment, tools and methods .22
9.1 General .
...