Piezoelectric devices - Preparation of outline drawings of surface-mounted device (SMD) for frequency control and selection - General rules

This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this standard as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs for frequency control and selection.

Piezoelektrische Bauelemente - Anfertigung von Gehäusezeichnungen von oberflächenmontierbaren Bauelementen (SMDs) zur Frequenzstabilisierung und -Selektion - Allgemeine Regeln

Dispositifs piézoélectriques - Préparation des dessins d'encombrement des dispositifs à montage en surface pour la commande et le choix de la fréquence - Règles générales

La CEI 61240:2012 donne les règles générales pour dessiner toutes les caractéristiques dimensionnelles et géométriques de dispositif piézoélectrique d'un boîtier à montage en surface afin d'assurer et l'interchangeabilité mécanique avec tous les autres dessins d'encombrement des dispositifs à montage en surface pour la commande et le choix de la fréquence. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:   - les dessins d'encombrement en trois vues, (de dessus, de face et de dessous) ont été changés pour celles basées sur la mise en page ISO et une projection du troisième dièdre, dans lesquelles la vue de droite est ajoutée aux vues de dessus, de face et de dessous;  - la ligne de référence et les dimensions géométriques du boîtier pour enveloppes ont été changées pour une utilisation pratique;  - les informations sur les enveloppes céramiques sans plomb des dispositifs piézoélectriques (CMS) pour la commande et le choix de la fréquence ont été incluses dans une annexe.

Piezoelektrični elementi - Priprava tehničnih risb površinsko montiranega elementa (SMD) za frekvenčno regulacijo in filtriranje - Splošna pravila

Ta mednarodni standard postavlja splošna pravila za risanje dimenzionalnih in geometričnih karakteristik paketov površinsko montiranih piezoelektričnih elementov (v tem standardu navedeni kot SMD-ji), da zagotovi mehanično zamenljivost vseh tehničnih risb površinsko montiranih piezoelektričnih elementov za frekvenčno regulacijo in filtriranje.

General Information

Status
Withdrawn
Publication Date
25-Oct-2012
Withdrawal Date
17-Dec-2019
Technical Committee
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
18-Dec-2019
Due Date
10-Jan-2020
Completion Date
18-Dec-2019

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SLOVENSKI STANDARD
SIST EN 61240:2012
01-december-2012
1DGRPHãþD
SIST EN 61240:2002
3LH]RHOHNWULþQLHOHPHQWL3ULSUDYDWHKQLþQLKULVESRYUãLQVNRPRQWLUDQHJD
HOHPHQWD 60' ]DIUHNYHQþQRUHJXODFLMRLQILOWULUDQMH6SORãQDSUDYLOD
Piezoelectric devices - Preparation of outline drawings of surface-mounted device (SMD)
for frequency control and selection - General rules
Piezoelektrische Bauelemente - Anfertigung von Gehäusezeichnungen von
oberflächenmontierbaren Bauelementen (SMDs) zur Frequenzstabilisierung und -
Selektion - Allgemeine Regeln
Dispositifs piézoélectriques - Préparation des dessins d'encombrement des dispositifs à
montage en surface pour la commande et le choix de la fréquence - Règles générales
Ta slovenski standard je istoveten z: EN 61240:2012
ICS:
31.140 3LH]RHOHNWULþQHLQ Piezoelectric and dielectric
GLHOHNWULþQHQDSUDYH devices
SIST EN 61240:2012 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61240:2012

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SIST EN 61240:2012

EUROPEAN STANDARD
EN 61240

NORME EUROPÉENNE
October 2012
EUROPÄISCHE NORM

ICS 31.140 Supersedes EN 61240:1997


English version


Piezoelectric devices -
Preparation of outline drawings of surface-mounted devices (SMD) for
frequency control and selection -
General rules
(IEC 61240:2012)


Dispositifs piézoélectriques -  Piezoelektrische Bauelemente -
Préparation des dessins d'encombrement Anfertigung von Gehäusezeichnungen
des dispositifs à montage en surface pour von oberflächenmontierbaren
la commande et le choix de la fréquence - Bauelementen (SMD) zur Frequenz-
Règles générales Stabilisierung und -Selektion -
(CEI 61240:2012) Allgemeine Regeln
(IEC 61240:2012)





This European Standard was approved by CENELEC on 2012-08-29. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61240:2012 E

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SIST EN 61240:2012
EN 61240:2012 - 2 -

Foreword
The text of document 49/995/FDIS, future edition 2 of IEC 61240, prepared by IEC TC 49 "Piezoelectric,
dielectric and electrostatic devices and associated materials for frequency control, selection and
detection" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
EN 61240:2012.

The following dates are fixed:
(dop) 2013-05-29
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2015-08-29
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This document supersedes EN 61240:1997.
EN 61240:2012 includes the following significant technical changes with respect to EN 61240:1997:
– outline drawings have been changed from three views (top, front and bottom) to that based on ISO
layout in the third-angle projection, in which the view from the right has been added to the top, front and
bottom views;
– reference line and geometrical dimensions of the package for enclosures have been changed for
practical use;
– information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for frequency
control and selection has been included in an annex.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 61240:2012 was approved by CENELEC as a European
Standard without any modification.

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SIST EN 61240:2012
- 3 - EN 61240:2012

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60191-6 2009 Mechanical standardization of semiconductor EN 60191-6 2009
devices -
Part 6: General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages


ISO 128-30 2001 Technical drawings - General principles of - -
presentation -
Part 30: Basic conventions for views


ISO 1101 2004 Geometrical Product Specifications (GPS) - EN ISO 1101 2005
Geometrical tolerancing - Tolerances of form,
orientation, location and run-out


ISO 5456-2 1996 Technical drawings - Projection methods - EN ISO 5456-2 1999
Part 2: Orthographic representations

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SIST EN 61240:2012

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SIST EN 61240:2012



IEC 61240

®


Edition 2.0 2012-07




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Piezoelectric devices –

Preparation of outline drawings of surface-mounted devices (SMD) for frequency

control and selection – General rules




Dispositifs piézoélectriques –

Préparation des dessins d'encombrement des dispositifs à montage en surface


pour la commande et le choix de la fréquence – Règles générales













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX R


ICS 31.140 ISBN 978-2-83220-291-3



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 61240:2012
– 2 – 61240 © IEC:2012
CONTENTS

FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Classification of SMD . 6
4 Title of the outline drawing . 7
5 Composition of the outline drawing . 7
5.1 Elements of outline drawings . 7
5.2 Outline drawing . 7
5.3 Table of detailed dimensions . 7
5.4 Actual size sketch . 7
5.5 Drawing of terminal land areas . 7
5.6 Terminal lead details . 7
6 Requirements for terminal leads . 9
7 Requirements for the terminal land area . 9
8 Connections of terminal leads . 9
9 Descriptive notes . 10
10 References . 10
Annex A (informative) Miniaturized leadless ceramic enclosures of piezoelectric
devices (SMD) for frequency control and selection . 14
Annex B (informative) Example of terminal connections for surface-mounted
piezoelectric devices (SMD) for frequency control and selection . 18

Figure 1 – Illustration of terminal projection zone . 8
Figure 2 – Example of a terminal land area . 9
Figure A.1 – Upper part of the view from above . 14
Figure A.2 – Front view (without a board) . 15
Figure A.3 – Front view (with a board) . 15

Table A.1 – Scale of drawings . 14
Table A.2 – Guideline of dimension table . 15
Table A.3 – Guideline for column “Max.” of Table A.2 for A, B . 16
Table A.4 – Examples of correspondence between new and old enclosures . 17
Table B.1 – Examples of terminal connections for various types of piezoelectric
devices . 18

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SIST EN 61240:2012
61240 © IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

PIEZOELECTRIC DEVICES –

Preparation of outline drawings of surface-mounted
devices (SMD) for frequency control and selection –
General rules


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses
arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
lnternational Standard IEC 61240 has been prepared by lEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This second edition cancels and replaces the first edition published in 1994. It constitutes a
technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
– outline drawings have been changed from three views (top, front and bottom) to that based
on ISO layout in the third-angle projection, in which the view from the right has been added
to the top, front and bottom views;
– reference line and geometrical dimensions of the package for enclosures have been
changed for practical use;
– information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for
frequency control and selection has been included in an annex.

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SIST EN 61240:2012
– 4 – 61240 © IEC:2012
The text of this standard is based on the following documents:
FDIS Report on voting
49/995/FDIS 49/1000/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 61240:2012
61240 © IEC:2012 – 5 –
INTRODUCTION
The enclosures of quartz crystal resonators and oscillators are unified in this second edition of
IEC 61240 “Preparation of outline drawings of surface-mounted devices (SMD) for frequency
control and selection – General rules”.
Regarding the c
...

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