SIST EN 61190-1-2:2007

SLOVENSKI STANDARD
SIST EN 61190-1-2:2007
01-oktober-2007
1DGRPHãþD
SIST EN 61190-1-2:2003
Povezovalni materiali za elektronske sestave - 1-2. del: Zahteve za spajkalne paste
za visoko kakovostne povezave v elektronskih sestavih (IEC 61190-1-2:2007)
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering
pastes for high-quality interconnects in electronics assembly
Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-2: Anforderungen an
Lotpaste für hochwertige Verbindungen in der Elektronikmontage
Matériaux de fixation pour les assemblages électroniques -- Partie 1-2: Exigences
relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les
assemblages de composants électroniques
Ta slovenski standard je istoveten z: EN 61190-1-2:2007
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61190-1-2:2007 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61190-1-2:2007

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SIST EN 61190-1-2:2007


EUROPEAN STANDARD
EN 61190-1-2

NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM

ICS 31.190 Supersedes EN 61190-1-2:2002


English version


Attachment materials for electronic assembly -
Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly
(IEC 61190-1-2:2007)


Matériaux de fixation  Verbindungsmaterialien
pour les assemblages électroniques - für Baugruppen der Elektronik -
Partie 1-2: Exigences relatives Teil 1-2: Anforderungen an Lotpaste
aux crèmes de brasage für hochwertige Verbindungen
pour les interconnexions de haute qualité in der Elektronikmontage
dans les assemblages de composants (IEC 61190-1-2:2007)
électroniques
(CEI 61190-1-2:2007)




This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-2:2007 E

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SIST EN 61190-1-2:2007
EN 61190-1-2:2007 - 2 -
Foreword
The text of document 91/646/FDIS, future edition 2 of IEC 61190-1-2, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61190-1-2 on 2007-05-01.
This European Standard supersedes EN 61190-1-2:2002.
The main changes with regard to EN 61190-1-2:2002 concern a definition of lead-free solder alloy and an
explanation of solder ball test standards.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-2:2007 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 61190-1-2:2007
- 3 - EN 61190-1-2:2007
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

1) 2)
IEC 60194 - Printed board design, manufacture and EN 60194 2006
assembly - Terms and definitions


1) 2)
IEC 61189-5 - Test methods for electrical materials, EN 61189-5 2006
interconnection structures and assemblies -
Part 5: Test methods for printed board
assemblies


1) 2)
IEC 61189-6 - Test methods for electrical materials, EN 61189-6 2006
interconnection structures and assemblies -
Part 6: Test methods for materials used in
manufacturing electronic assemblies


1) 2)
IEC 61190-1-1 - Attachment materials for electronic EN 61190-1-1 2002
assembly -
Part 1-1: Requirements for soldering fluxes
for high-quality interconnections in electronics
assembly


1) 2)
IEC 61190-1-3 - Attachment materials for electronic EN 61190-1-3 2007
assembly -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications


1) 2)
IEC 61191-1 - Printed board assemblies - EN 61191-1 1998
Part 1: Generic specification - Requirements
for soldered electrical and electronic
assemblies using surface mount and related
assembly technologies


1) 2)
IEC 61191-2 - Printed board assemblies - EN 61191-2 1998
Part 2: Sectional specification - Requirements
for surface mount soldered assemblies


1) 2)
IEC 61191-3 - Printed board assemblies - EN 61191-3 1998
Part 3: Sectional specification - Requirements
for through-hole mount soldered assemblies


1) 2)
IEC 61191-4 - Printed board assemblies - EN 61191-4 1998
Part 4: Sectional specification - Requirements
for terminal soldered assemblies



1)
Undated reference.
2)
Valid edition at date of issue.

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SIST EN 61190-1-2:2007
EN 61190-1-2:2007 - 4 -
Publication Year Title EN/HD Year
1) 2)
ISO 9000 - Quality management systems - EN ISO 9000 2005
Fundamentals and vocabulary


1) 2)
ISO 9001 - Quality management systems - EN ISO 9001 2000
Requirements


1) 2)
ISO 9453 - Soft solder alloys - Chemical compositions EN ISO 9453 2006
and forms


1) 2)
ISO 9454-2 - Soft soldering fluxes - Classification and EN ISO 9454-2 2000
requirements -
Part 2: Performance requirements


1) 3) 2)
ISO 10012-1 - Quality assurance requirements for EN 30012-1 1993
measuring equipment -
Part 1: Metrological confirmation system for
measuring equipment




3)
EN 30012-1:1993 is superseded by EN ISO 10012:2003, which is based on ISO 10012:2003.

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SIST EN 61190-1-2:2007


INTERNATIONAL IEC


STANDARD 61190-1-2





Second edition
2007-04


Attachment materials for electronic assembly –
Part 1-2:
Requirements for soldering pastes
for high-quality interconnects
in electronics assembly

PRICE CODE
Commission Electrotechnique Internationale R
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

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SIST EN 61190-1-2:2007
– 2 – 61190-1-2 © IEC:2007(E)
CONTENTS

FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references .6
3 Terms and definitions .7
4 Standardized description for products.7
5 Test methods .7
6 Requirements .8
6.1 Conflict.8
6.2 Alloy composition .8
6.3 Flux characterization and inspection.8
6.4 Solder powder particle size .9
6.5 Metal per cent .10
6.6 Viscosity.10
6.7 Slump and smear test.10
6.8 Solder ball test .12
6.9 Tack test .12
6.10 Wetting.12
6.11 Labelling .13
7 Quality assurance provisions .14
7.1 Responsibility for inspection .14
7.2 Classification for inspections .15
7.3 Inspection report form .15
7.4 Qualification inspection .15
7.5 Quality conformance .16
8 Preparation for delivery .16
9 Additional information – Performance and shelf-life extension inspections.16

Annex A (normative) Test report on solder paste .18

Figure 1 – Slump test stencil thickness, 0,20 mm.11
Figure 2 – Slump test stencil thickness, 0,10 mm.12
Figure 3 – Solder ball test standards.14

Table 1 – Standardized solder paste description.7
Table 2 – Standard solder powders.9
Table 3 – Test methods for particle size distribution .10
Table 4 – Solder paste qualification inspection .16
Table 5 – User inspection for solder paste prior to use .17
Table A.1 – Solder paste inspection report form.18

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SIST EN 61190-1-2:2007
61190-1-2 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61190-1-2 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 2002, and constitutes
a technical revision. The main changes with regard to the first edition concern a definition of
lead-free solder alloy and an explanation of solder ball test standards.
The text of this standard is based on the following documents:
FDIS Report on voting
91/646/FDIS 91/678/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 61190-1-2:2007
– 4 – 61190-1-2 © IEC:2007(E)
A list of all parts in the IEC 61190 series, under the general title Attachment materials for
electronic assembly, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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SIST EN 61190-1-2:2007
61190-1-2 © IEC:2007(E) – 5 –
INTRODUCTION
This part of IEC 61190 defines the characteristics of solder paste through the definitions of
properties and specification of test methods and inspection criteria. Materials include solder
powder and solder paste flux blended to produce solder paste. Solder powders are classified
according to both shape and size distribution of the particles. It is not the intention of this
standard to exclude those particle sizes or distributions not specifically listed. For flux
properties of solder paste, including classification and testing, see IEC 61190-1-1.
The requirements for solder paste are defined in general terms. In practice, where more
stringent requirements are necessary, additional requirements may be defined by mutual
agreement between the user and supplier. Users are cautioned to perform tests (beyond the
scope of this specification) to determine the acceptability of the solder paste for specific
processes.
This standard is intended to be applicable to all types of solder paste used for soldering in
general, as well as for soldering in electronics assembly. The solder pastes involved relate to
all aspects of application. Generic specifications for soldering pastes are given in ISO 9454-2.

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SIST EN 61190-1-2:2007
– 6 – 61190-1-2 © IEC:2007(E)
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY –

Part 1-2: Requirements for soldering pastes
for high-quality interconnects in electronics assembly



1 Scope
This part of IEC 61190 specifies general requirements for the characterization and testing of
solder pastes used to make high-quality electronic interconnections in electronics assembly.
This standard serves as a quality control document and is not intended to relate directly to the
material's performance in the manufacturing process.
Related information on flux characterization, quality control and procurement documentation
for solder flux and flux containing material may be found in IEC 61190-1-1.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61189-5, Test methods for electrical materials, interconnection structures and assemblies –
Part 5: Test methods for printed board assemblies
IEC 61189-6, Test methods for electrical materials, interconnection structures and assemblies –
Part 6: Test methods for materials used in manufacturing electronic assemblies
IEC 61190-1-1, Attachment materials for electronic assembly – Part 1-1: Requirements for
soldering fluxes for high quality interconnections in electronics assembly
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for
soldered electrical and electronic assemblies using surface mount and related assembly
technologies
IEC 61191-2, Printed board assemblies – Part 2: Sectional specification – Requirements for
surface mount soldered assemb
...