SIST EN 62769-103-1:2015

SLOVENSKI STANDARD
SIST EN 62769-103-1:2015
01-november-2015
1DSUDYHLQ]GUXåHYDQMHYSURL]YRGQHVLVWHPH9NOMXþLWHYSURFHVQHQDSUDYH)',
3URILOLGHO352),%86,(&
Devices and integration in enterprise systems; Field Device Integration (FDI) - Profiles -
Part 103-1: PROFIBUS (IEC 62769-103-1:2015)
Feldgeräteintegration (FDI) - Profile - Teil 103-1: PROFIBUS (IEC 62769-103-1:2015)
Intégration des appareils de terrain (FDI) - Partie 103-1: Profils - PROFIBUS (IEC 62769-
103-1:2015)
Ta slovenski standard je istoveten z: EN 62769-103-1:2015
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
SIST EN 62769-103-1:2015 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------

SIST EN 62769-103-1:2015

---------------------- Page: 2 ----------------------

SIST EN 62769-103-1:2015


EUROPEAN STANDARD EN 62769-103-1

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2015
ICS 25.040.40; 35.100

English Version
Field Device Integration (FDI) - Part 103-1: Profiles - PROFIBUS
(IEC 62769-103-1:2015)
Intégration des appareils de terrain (FDI) - Partie 103-1: Feldgeräteintegration (FDI) - Profile - Teil 103-1:
Profils - PROFIBUS PROFIBUS
(IEC 62769-103-1:2015) (IEC 62769-103-1:2015)
This European Standard was approved by CENELEC on 2015-06-16. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.


European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62769-103-1:2015 E

---------------------- Page: 3 ----------------------

SIST EN 62769-103-1:2015
EN 62769-103-1:2015
European foreword
The text of document 65E/354/CDV, future edition 1 of IEC 62769-103-1, prepared by SC 65E
"Devices and integration in enterprise systems", of IEC/TC 65 "Industrial-process measurement,
control and automation" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 62769-103-1:2015.
The following dates are fixed:
• latest date by which the document has to be implemented at (dop) 2016-03-16
national level by publication of an identical national
standard or by endorsement
(dow) 2018-06-16
• latest date by which the national standards conflicting with
the document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62769-103-1:2015 was approved by CENELEC as a
European Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated :
1)
IEC 61804-3 NOTE Harmonized as EN 61804-3 (not modified).


1) To be published.
2

---------------------- Page: 4 ----------------------

SIST EN 62769-103-1:2015
EN 62769-103-1:2015
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is
available here: www.cenelec.eu.

Publication Year Title EN/HD Year
IEC 61784-1 -  Industrial communication networks - EN 61784-1 -
Profiles -
Part 1: Fieldbus profiles
IEC 61804 series Function blocks (FB) for process control - EN 61804 series
Electronic device description language
(EDDL)
IEC 62541-100 2015 OPC unified architecture - EN 62541-100 2015
Part 100: Device Interface
2)
IEC 62769-2 -  Field Device Integration (FDI) - EN 62769-2 -
Part 2: FDI Client
2)
IEC 62769-4 -  Field Device Integration (FDI) - EN 62769-4 -
Part 4: FDI Packages
2)
IEC 62769-5 -  Field Device Integration (FDI) - EN 62769-5 -
Part 5: FDI Information Model
2)
IEC 62769-7 -  Field Device Integration (FDI) - EN 62769-7 -
Part 7: FDI Communication Devices


2) To be published.
3

---------------------- Page: 5 ----------------------

SIST EN 62769-103-1:2015

---------------------- Page: 6 ----------------------

SIST EN 62769-103-1:2015




IEC 62769-103-1

®


Edition 1.0 2015-05




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Field device integration (FDI) –

Part 103-1: Profiles – PROFIBUS




Intégration des appareils de terrain (FDI) –

Partie 103-1: Profils – PROFIBUS
















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 25.040.40; 35.100 ISBN 978-2-8322-2623-0



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 7 ----------------------

SIST EN 62769-103-1:2015
– 2 – IEC 62769-103-1:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, abbreviated terms and acronyms . 8
3.1 Terms and definitions . 8
3.2 Abbreviated terms and acronyms . 8
4 Conventions . 8
4.1 EDDL syntax . 8
4.2 XML syntax . 8
4.3 Capitalizations . 8
5 Profile for PROFIBUS . 9
5.1 General . 9
5.2 Catalog profile . 9
5.2.1 Protocol support file . 9
5.2.2 CommunicationProfile definition . 9
5.2.3 Profile device . 10
5.2.4 Protocol version information . 10
5.3 Associating a Package with a device . 11
5.3.1 Device type identification mapping . 11
5.3.2 Device type revision mapping . 12
5.4 Information Model mapping . 13
5.4.1 ProtocolType definition . 13
5.4.2 DeviceType mapping . 14
5.4.3 FunctionalGroup identification definition . 14
5.5 Topology elements . 15
5.5.1 ConnectionPoint definition . 15
5.5.2 Communication Device definition . 17
5.5.3 Communication service provider definition . 18
5.5.4 Network definition . 18
5.6 Methods . 19
5.6.1 Methods for FDI Communication Servers . 19
5.6.2 Methods for Gateways . 21
Annex A (normative) Topology Scan result schema . 28
A.1 General . 28
A.2 Network . 28
A.3 ProfibusNetworkT . 28
A.4 ProfibusConnectionPointT . 28
A.5 ProfibusIdentificationT . 29
A.6 ProfibusAddressT . 30
Annex B (normative) Transfer service parameters . 31
B.1 General . 31
B.2 sendData . 31
B.3 xsreceiveData . 31
B.4 xsTransferSendDataT . 31

---------------------- Page: 8 ----------------------

SIST EN 62769-103-1:2015
IEC 62769-103-1:2015 © IEC 2015 – 3 –
B.5 TransferResultDataT . 32
B.6 OperationT . 32
Bibliography . 33

Figure 1 – Version mapping problem . 12

Table 1 – ProtocolSupportFile for FDI Device Packages . 9
Table 2 – ProtocolSupportFile for FDI Communication Packages . 9
Table 3 – PROFIBUS CommunicationProfile definition schema . 10
Table 4 – Catalog values for profile devices . 10
Table 5 – Version mapping examples . 11
Table 6 – Device identification information mapping . 12
Table 7 – Protocol type Profibus_DP . 13
Table 8 – Protocol type Profibus_PA . 14
Table 9 – DeviceType property mapping . 14
Table 10 – PROFIBUS Device Types identification attributes . 14
Table 11 – ConnectionPoint type for Profibus_DP . 15
Table 12 – ConnectionPoint type for Profibus_PA . 16
Table 13 – Method Connect arguments . 19
Table 14 – Method Disconnect arguments . 19
Table 15 – Method Transfer arguments . 20
Table 16 – Method SetAddress arguments . 21
Table 17 – Connect service arguments . 22
Table 18 – Method Transfer arguments . 25
Table 19 – Method SetAddress arguments . 26
Table A.1 – Elements of ProfibusNetworkT . 28
Table A.2 – Attributes of ProfibusConnectionPointT . 29
Table A.3 – Elements of ProfibusConnectionPointT . 29
Table A.4 – Attributes of ProfibusIdentificationT . 30
Table B.1 – Attributes of TransferSendDataT . 32
Table B.2 – Attributes of TransferResultDataT . 32

---------------------- Page: 9 ----------------------

SIST EN 62769-103-1:2015
– 4 – IEC 62769-103-1:2015 © IEC 2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

FIELD DEVICE INTEGRATION (FDI) –

Part 103-1: Profiles – PROFIBUS

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
International Standard IEC 62769-103-1 has been prepared by subcommittee 65E: Devices
and integration in enterprise systems, of IEC technical committee 65: Industrial-process
measurement, control and automation.
The text of this standard is based on the following documents:
CDV Report on voting
65E/354/CDV 65E/417/RVC

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62769 series, published under the general title Field Device
Integration (FDI), can be found on the IEC website.

---------------------- Page: 10 ----------------------

SIST EN 62769-103-1:2015
IEC 62769-103-1:2015 © IEC 2015 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

---------------------- Page: 11 ----------------------

SIST EN 62769-103-1:2015
– 6 – IEC 62769-103-1:2015 © IEC 2015
INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents concerning
a) method for the supplying and installation of device-specific functionalities, see Patent
Family DE10357276;
b) method and device for accessing a functional module of automation system, see Patent
Family EP2182418;
c) methods and apparatus to reduce memory requirements for process control system
US2013232186;
software applications, see Patent Family
d) extensible device object model, see Patent Family US12/893,680.
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holders of these patent rights have assured the IEC that he/she is willing to negotiate
licences either free of charge or under reasonable and non-discriminatory terms and
conditions with applicants throughout the world. In this respect, the statement of the holder of
this patent right is registered with IEC. Information may be obtained from:
a) ABB Research Ltd
Claes Rytoft
Affolterstrasse 4
Zurich, 8050
Switzerland
b) Phoenix Contact GmbH & Co KG
Intellectual Property, Licenses & Standards
Flachsmarktstrasse 8, 32825 Blomberg
Germany
c) Fisher Controls International LLC
John Dilger, Emerson Process Management LLLP
st
301 S. 1 Avenue, Marshaltown, Iowa 50158
USA
d) Rockwell Automation Technologies, Inc.
1 Allen-Bradley Drive
Mayfield Heights, Ohio 44124
USA
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.

---------------------- Page: 12 ----------------------

SIST EN 62769-103-1:2015
IEC 62769-103-1:2015 © IEC 2015 – 7 –
FIELD DEVICE INTEGRATION (FDI) –

Part 103-1: Profiles – PROFIBUS



1 Scope
This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-1_CP 3/1
1
(PROFIBUS DP) and IEC 61784-1_CP3/2 (PROFIBUS PA).
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61784-1, Industrial communication networks – Profiles – Part 1: Fieldbus profiles
IEC 61804 (all parts), Function blocks (FB) for process control and Electronic Device
Description Language (EDDL)
IEC 62541-100:2015, OPC unified architecture – Part 100: Device Interface
IEC 62769-2, Field Device Integration (FDI) – Part 2: FDI Client
NOTE 1 IEC 62769-2 is technical identical to FDI-2022.
IEC 62769-4, Field Device Integration (FDI) – Part 4: FDI Packages
NOTE 2 IEC 62769-4 is technically identical to FDI-2024.
IEC 62769-5, Field Device Integration (FDI) – Part 5: FDI Information Model
NOTE 3 IEC 62769-5 is technically identical to FDI-2025.
IEC 62769-7, Field Device Integration (FDI) – Part 7: FDI Communication Devices
NOTE 4 IEC 62769-7 is technically identical to FDI-2027.
PI Order No.: 2.122:2008, Specification for PROFIBUS – Device Description and Device
Integration – Volume 1: GSD, V5.1, July 2008: GSD; available at
—————————
1
 PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given
for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder
or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the
trade name holder.

---------------------- Page: 13 ----------------------

SIST EN 62769-103-1:2015
– 8 – IEC 62769-103-1:2015 © IEC 2015
3 Terms, definitions, abbreviated terms and acronyms
3.1 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 61784-1,
IEC 61804, IEC 62541-100, IEC 62769-4, IEC 62769-5, IEC 62769-7 and PI Order
No.: 2.122:2008 apply.
3.2 Abbreviated terms and acronyms
For the purposes of this document, the following abbreviations apply:
EDD Electronic Device Description
EDDL Electronic Device Description Language (see IEC 61804)
GSD General station description (see PI Order No.: 2.122:2008)
I&M Identification and maintenance function
UIP User Interface Plug-in
UUID Universally unique identifier (see ISO/IEC 11578)
XML Extensible markup language (see REC-xml-20081126)
4 Conventions
4.1 EDDL syntax
This part of IEC 62769 specifies content for the EDD component that is part of FDI
Communication Packages. The specification content using EDDL syntax uses the font
Courier New. The EDDL syntax is used for method signature, variable, data structure and
component declarations.
4.2 XML syntax
XML syntax examples use the font Courier New. The XML syntax is used to describe XML
document schema.
EXAMPLE:
4.3 Capitalizations
The IEC 62769 series use capitalized terms to emphasize that these terms have an FDI
specific meaning.
Some of these terms use an acronym as a prefix for example
• FDI Client, or
• FDI Server.
Some of these terms are compound terms such as:
• Communication Servers, or
• Profile Package.
Parameter names or attributes are concatenated to a single term, where the original terms
start in this term with a capital letter such as:
• ProtocolSupportFile or
• ProtocolType.

---------------------- Page: 14 ----------------------

SIST EN 62769-103-1:2015
IEC 62769-103-1:2015 © IEC 2015 – 9 –
Parameter names or attributes can also be constructed by using an underscore character to
concatenate two or more terms such as:
• PROFILE_ID or
• Profibus_PA_Network
5 Profile for PROFIBUS
5.1 General
This profile document to the FDI specification in IEC 62769 specifies the protocol specifics
needed for FDI Packages describing Communication Servers, Gateways and Devices.
For Communication Servers this document defines also protocol specifics as these need to be
considered in the Communication Servers hosted Information Model.
5.2 Catalog profile
5.2.1 Protocol support file
5.2.1.1 FDI Device Package
Protocol specific attachments are mentioned in the Package Catalog as defined in
IEC 62769-5. A communication feature list (GSD) file according to PI Order No.: 2.122:2008 is
a mandatory attachment for FDI Device Packages representing PROFIBUS DP and
PROFIBUS PA devices. Table 1 specifies the parameters of the ProtocolSupportFile in the
FDI Device Package.
Table 1 – ProtocolSupportFile for FDI Device Packages
Parameter Description
Content Type text/plain
Root Namespace empty
Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename According to PI Order No.: 2.122:2008

5.2.1.2 FDI Communication Packages
A GSD file as specified in PI Order No.: 2.122:2008 is an optional attachment for FDI
Communication Packages representing PROFIBUS DP and PROFIBUS PA devices. Table 2
specifies the parameters of ProtocolSupportFile for FDI Communication Packages.
Table 2 – ProtocolSupportFile for FDI Communication Packages
Parameter Description
Content Type: text/plain
Root Namespace: empty
Source Relationship: http://fdi-cooperation.com/2010/relationship/attachment-protocol
Filename: According to PI Order No.: 2.122:2008

5.2.2 CommunicationProfile definition
IEC 62769-4 defines a CommunicationProfileT enumeration type for the Catalog XML
schema. Table 3 defines the PROFIBUS specific values for this enumeration.

---------------------- Page: 15 ----------------------

SIST EN 62769-103-1:2015
– 10 – IEC 62769-103-1:2015 © IEC 2015
Table 3 – PROFIBUS CommunicationProfile definition schema
Profile Identifier Protocol
"profibus_dp" PROFIBUS DP/V0; PROFIBUS DP/V1; PROFIBUS DP/V2
“profibus_pa” PROFIBUS PA

5.2.3 Profile device
A Profile Package shall provide the catalog values for profile devices, enabling the FDI Server
to leverage a generic device description, if a specific one is not available. The definitions in
Table 4 focus on catalog content that is vendor independent.
Table 4 – Catalog values for profile devices
Element Attribute Content
PackageType – Profile
CommunicationProfile – Empty
DeviceModel – The allowed profile identifier values (PROFILE_ID) are provided by
PROFIBUS & PROFINET International (PI). PI provides and maintains
an XML file (Profile_ID_Table) containing the assignment of
PRO
...