SIST EN 62047-4:2010

SLOVENSKI STANDARD
SIST EN 62047-4:2010
01-december-2010
Polprevodniški elementi - Mikroelektromehanski elementi - 4. del: Osnovne
specifikacije za MEMS (IEC 62047-4:2008)
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification
for MEMS (IEC 62047-4:2008)
Halbleiterbauelemente - Bauteile der Mikrosystemtechnik - Teil 4:
Fachgrundspezifikation für Mikrosystemtechnik (IEC 62047-4:2008)
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 4:
Spécification générique pour les MEMS (CEI 62047-4:2008)
Ta slovenski standard je istoveten z: EN 62047-4:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-4:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62047-4:2010

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SIST EN 62047-4:2010

EUROPEAN STANDARD
EN 62047-4

NORME EUROPÉENNE
October 2010
EUROPÄISCHE NORM

ICS 31.080.99


English version


Semiconductor devices -
Micro-electromechanical devices -
Part 4: Generic specification for MEMS
(IEC 62047-4:2008)


Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Dispositifs microélectromécaniques - Bauteile der Mikrosystemtechnik -
Partie 4: Spécification générique pour les Teil 4: Fachgrundspezifikation für
MEMS Mikrosystemtechnik
(CEI 62047-4:2008) (IEC 62047-4:2008)




This European Standard was approved by CENELEC on 2010-10-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-4:2010 E

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SIST EN 62047-4:2010
EN 62047-4:2010 - 2 -
Foreword
The text of document 47/1975/FDIS, future edition 1 of IEC 62047-4, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62047-4 on 2010-10-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-07-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-10-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62047-4:2008 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60721-3-0 NOTE  Harmonized as EN 60721-3-0.
IEC 60721-3-1 NOTE  Harmonized as EN 60721-3-1.
__________

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SIST EN 62047-4:2010
- 3 - EN 62047-4:2010
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60027 Series Letter symbols to be used in electrical EN 60027 Series
technology


IEC 60068-2 Series Environmental testing - EN 60068-2 Series
Part 2: Tests


IEC 60617 - Graphical symbols for diagrams - -


IEC 60747-1 2006 Semiconductor devices - - -
Part 1: General


IEC 60749 Series Semiconductor devices - Mechanical and EN 60749 Series
climatic test methods


IEC 61193-2 - Quality assessment systems - EN 61193-2 -
Part 2: Selection and use of sampling plans
for inspection of electronic components and
packages


IEC 62047-1 - Semiconductor devices - EN 62047-1 -
Micro-electromechanical devices -
Part 1: Terms and definitions


IEC QC 001002-3 2005 IEC Quality Assessment System for Electronic - -
Components (IECQ) - Rules of Procedure -
Part 3: Approval procedures


ISO 1000 - SI units and recommendations for the use of - -
their multiples and of certain other units


ISO 2859-1 - Sampling procedures for inspection by - -
attributes -
Part 1: Sampling schemes indexed by
acceptance quality limit (AQL) for lot-by-lot
inspection

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SIST EN 62047-4:2010

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SIST EN 62047-4:2010
IEC 62047-4
Edition 1.0 2008-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Semiconductor devices – Micro-electromechanical devices –
Part 4: Generic specification for MEMS

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 4: Spécification générique pour les MEMS

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 31.080.99 ISBN 2-8318-9968-0
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62047-4:2010
– 2 – 62047-4 © IEC:2008
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms, definitions, units and symbols .6
4 Standard environmental conditions.7
5 Marking .7
5.1 Device identification .7
5.2 Device traceability.7
5.3 Packing .7
6 Quality assessment procedures.7
6.1 General .7
6.1.1 Eligibility for qualification and/or capability approval .7
6.1.2 Primary stage of manufacture.7
6.1.3 Formation of inspection lots.7
6.1.4 Structurally similar device.7
6.1.5 Subcontracting .8
6.1.6 Incorporated components .8
6.1.7 Validity of release.8
6.2 Qualification approval procedure .8
6.2.1 Qualification approval testing.8
6.2.2 Environmental and climatic tests .8
6.2.3 Granting of qualification approval .8
6.2.4 Statistical sampling procedures .11
6.2.5 Endurance tests .11
6.2.6 Endurance tests where the failure rate is specified .11
6.2.7 Accelerated test procedures .12
7 Test and measurement procedures.12
7.1 Standard conditions and general precautions .12
7.1.1 Standard conditions.12
7.1.2 General precautions .13
7.1.3 Precision of measurements .13
7.2 Physical examination.13
7.2.1 Visual examination .13
7.2.2 Dimensions .13
7.3 Climatic and mechanical tests .13
7.4 Alternative test methods .13
Annex A (normative) Sampling procedures .14
Annex B (informative) Classification for MEMS technologies and devices .15
Bibliography.19

Table 1 – MEMS categories and terms.6
Table 2 – Subgrouping for Group B and Group C .10

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SIST EN 62047-4:2010
62047-4 © IEC:2008 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
––––––––––––

SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 4: Generic specification for MEMS


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-4 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1975/FDIS 47/1985/RVD

Full information on the voting for the approval on this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

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SIST EN 62047-4:2010
– 4 – 62047-4 © IEC:2008
A list of all the parts in the IEC 62047 series, under the general title Semiconductor devices –
Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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SIST EN 62047-4:2010
62047-4 © IEC:2008 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 4: Generic specification for MEMS


1 Scope
This part of IEC 62047 describes generic specifications for micro-electromechanical systems
(MEMS) made by semiconductors, which are the basis for specifications given in other parts
of this series for various types of MEMS applications such as sensors, RF MEMS, excluding
optical MEMS, bio MEMS, micro TAS, and power MEMS. This standard specifies general
procedures for quality assessment to be used in IECQ-CECC systems and establishes
general principles for describing and testing of electrical, optical, mechanical and
environmental characteristics.
This part of IEC 62047 aids in the preparation of standards that define devices and systems
made by micromachining technology, including but not limited to, material characterization
and handling, assembly and testing, process control and measuring methods. MEMS
described in this standard are basically made of semiconductor material. However, the
statements made in this standard are also applicable to MEMS using materials other than
semiconductor, for example, polymers, glass, metals and ceramic materials.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60068-2 (all parts), Environmental testing – Part 2: Tests
IEC 60617, Graphical symbols for diagrams
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60749 (all parts), Semiconductor devices – Mechanical and climatic test methods
IEC 61193-2, Quality assessment systems – Part 2: Selection and use of sampling plans for
inspection of electronic components and packages
IEC 62047-1, Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and
definitions
IEC QC 001002-3:2005, IEC Quality Assessment System for Electronic Components (IECQ) –
Rules of Procedure – Part 3: Approval procedures
ISO 1000, SI units and recommendations for the use of their multiples and of certain other
units
ISO 2859-1, Sampling procedures for inspection by attributes – Part 1: Sampling schemes
indexed by acceptance quality limit (AQL) for lot-by-lot inspection

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SIST EN 62047-4:2010
– 6 – 62047-4 © IEC:2008
3 Terms, definitions, units and symbols
For the purposes of this document, terms shall, wherever possible, be taken from
IEC 62047-1; units, and graphical and letter symbols shall, wherever possible, be taken from
IEC 60027, IEC 60617 and ISO 1000.
Any other units, symbols or terminology peculiar to one of the devices covered by this generic
specification shall be taken from the relevant IEC or ISO standards (see Clause 2) or derived
in accordance with the principles of the standards listed above.
Table 1 shows the categories and terms on MEMS area.
Table 1 – MEMS categories and terms
Category Sub-category Terms
General MEMS, MST, micromachine, micromachine technology
Microscience and engineering, scale effect, mesotribology, microtribology,
Science and engineering
biomimetics, ciliary motion, self-organization
Material science Shape memory polymer, modification
Actuator, micro-actuator, electrostatic actuator, light driven actuator,
Actuator piezoelectric actuator, shape memory alloy actuator, sol-gel conversion
actuator, comb drive actuator, wobble motor
Functional Microsensor, biosensor, integrated microprobe, ion sensitive field effect
Sensor
element transistor (ISFET), accelerometer, micro-gyroscope
Diaphragm structure, microcantilever, microchannel, micromirror, scanning
Other mirror, microswitch, optical switch, microgripper, micropump, microvalve,
integrated mass flow controller, micro fuel cell, photoelectric transducer
General Micromachining
Silicon process, thick film technology, thin film technology, bulk micro-
Silicon process machining, surface micromachining, photolithography, electron beam
lithography, photomask, photoresist, silicon-on-insulator (SOI)
LIGA process LIGA process, UV-LIGA, X-ray lithography
Beam process
Beam processing, sputtering, focused ion beam machining
Etching process, wet etching, dry etching, isotropic etching, anisotropic
Machining Etching
etching, etch stop, lost wafer process, sacrificial etching, reactive ion etching
technology process
（RIE), DRIE, ICP
Deposition
Vapour deposition, physical vapour deposition process (PVD), electroforming
process
Other removal Micro-electro-discharge machining
process
Plastic working Hot embossing process
Other Micro-moulding, STM machining
Bonding, adhesive bonding, anodic bonding, diffusion bonding, silicon fusion
Bonding/
Bonding
bonding
assembling
technology
Other Micro-manipulator, non-contact handling, packaging, wafer level packaging
Scanning probe microscope (SPM), atomic force microscope (AFM), scanning
Microscope
Evaluation
tunneling microscope (STM), near-field microscope
technology
Other Aspect ratio, power-to-weight ratio
General Bio-MEMS, RF-MEMS, MOEMS, lab-on-a-chip, micro TAS, micro-reactor
Microscopic surgery (micro-surgery), active catheter, fibre endoscope, smart
Application
Biomedical use pill, bio-chip, DNA-chip, protein chip, cell handling, cell fusion, polym
...