ISO 26262-11:2018

INTERNATIONAL ISO
STANDARD 26262-11
First edition
2018-12
Road vehicles — Functional safety —
Part 11:
Guidelines on application of ISO
26262 to semiconductors
Véhicules routiers — Sécurité fonctionnelle —
Partie 11: Lignes directrices sur l'application de l'ISO 26262 aux semi-
conducteurs
Reference number
©
ISO 2018
© ISO 2018
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ii © ISO 2018 – All rights reserved

Contents Page
Foreword .v
Introduction .vi
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 1
4 A semiconductor component and its partitioning . 2
4.1 How to consider semiconductor components . 2
4.1.1 Semiconductor component development . 2
4.2 Dividing a semiconductor component in parts . 2
4.3 About hardware faults, errors and failure modes . 3
4.3.1 Fault models. 3
4.3.2 Failure modes . 4
4.3.3 The distribution of base failure rate across failure modes . 4
4.4 About adapting a semiconductor component safety analysis to system level . 5
4.5 Intellectual Property (IP) . 6
4.5.1 About IP . 6
4.5.2 Category and safety requirements for IP . 7
4.5.3 IP lifecycle . 9
4.5.4 Work products for IP .11
4.5.5 Integration of black-box IP .14
4.6 Base failure rate for semiconductors .15
4.6.1 General notes on base failure rate estimation .15
4.6.2 Permanent base failure rate calculation methods .20
4.7 Semiconductor dependent failure analysis .41
4.7.1 Introduction to DFA .41
4.7.2 Relationship between DFA and safety analysis .42
4.7.3 Dependent failure scenarios .42
4.7.4 Distinction between cascading failures and common cause failures .45
4.7.5 Dependent failure initiators and mitigation measures.45
4.7.6 DFA workflow .51
4.7.7 Examples of dependent failures analysis .54
4.7.8 Dependent failures between software element and hardware element .55
4.8 Fault injection .55
4.8.1 General.55
4.8.2 Characteristics or variables of fault injection .55
4.8.3 Fault injection results .57
4.9 Production and Operation .57
4.9.1 About Production .57
4.9.2 Production Work Products .58
4.9.3 About service (maintenance and repair), and decommissioning .58
4.10 Interfaces within distributed developments .58
4.11 Confirmation measures .59
4.12 Clarification on hardware integration and verification .59
5 Specific semiconductor technologies and use cases .60
5.1 Digital components and memories.60
5.1.1 About digital components .60
5.1.2 Fault models of non-memory digital components .60
5.1.3 Detailed fault models of memories .61
5.1.4 Failure modes of digital components .62
5.1.5 Example of failure mode definitions for common digital blocks .62
5.1.6 Qualitative and quantitative analysis of digital component .66
5.1.7 Notes on quantitative analysis of digital components .67
5.1.8 Example of quantitative analysis .69
5.1.9 Example of techniques or measures to detect or avoid systematic failures
during design of a digital component .70
5.1.10 Verification using fault injection simulation .74
5.1.11 Example of safety documentation for a digital component .75
5.1.12 Examples of safety mechanisms for digital components and memories .76
5.1.13 Overview of techniques for digital components and memories .77
5.2 Analogue/mixed signal components .80
5.2.1 About analogue and mixed signal components .80
5.2.2 Analogue and mixed signal components and failure modes .82
5.2.3 Notes about safety analysis .91
5.2.4 Examples of safety mechanisms .94
5.2.5 Avoidance of systematic faults during the development phase .97
5.2.6 Example of safety documentation for an analogue/mixed-signal component .100
5.3 Programmable logic devices .101
5.3.1 About programmable logic devices .101
5.3.2 Failure modes of PLD .105
5.3.3 Notes on safety analyses for PLDs .106
5.3.4 Examples of safety mechanisms for PLD .112
5.3.5 Avoidance of systematic faults for PLD .113
5.3.6 Example of safety documentation for a PLD .116
5.3.7 Example of safety analysis for PLD .116
5.4 Multi-core components.116
5.4.1 Types of multi-core components .116
5.4.2 Implications of ISO 26262 series of standards for multi-core components .117
5.5 Sensors and transducers .119
5.5.1 Terminology of sensors and transducers .119
5.5.2 Sensors and transducers failure modes .120
5.5.3 Safety analysis for sensors and transducers .125
5.5.4 Examples of safety measures for sensors and transducers .126
5.5.5 About avoidance of systematic faults for sensors and transducers .130
5.5.6 Example of safety documentation for sensors and transducers.131
Annex A (informative) Example on how to use digital failure modes for diagnostic coverage
evaluation .132
Annex B (informative) Examples of dependent failure analysis .136
Annex C (informative) Examples of quantitative analysis for a digital component .150
Annex D (informative) Examples of quantitative analysis for analogue component .155
Annex E (informative) Examples of quantitative ana
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