IEC 62769-4:2023

IEC 62769-4 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside ®
Field Device Integration (FDI ) –
Part 4: FDI Packages
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Secretariat Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC Products & Services Portal - products.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always have
committee, …). It also gives information on projects, replaced access to up to date content tailored to your needs.
and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 300 terminological entries in English
details all new publications released. Available online and once
and French, with equivalent terms in 19 additional languages.
a month by email.
Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc

If you wish to give us your feedback on this publication or need
further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC 62769-4 ®
Edition 3.0 2023-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside ®
Field Device Integration (FDI ) –
Part 4: FDI Packages
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-6827-8
– 2 – IEC 62769-4:2023 RLV © IEC 2023
CONTENTS
FOREWORD . 8
INTRODUCTION .
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, abbreviated terms and conventions acronyms . 12
3.1 Terms and definitions . 13
3.2 Abbreviated terms and acronyms . 14
3.3 Conventions . 14 ®
4 FDI Package Model . 14
4.1 Overview. 14 ®
4.2 FDI Package Elements . 15
4.2.1 Package Catalog . 15
4.2.2 Package Feature Table . 15
4.2.3 Feature Unit Conversion . 16
4.2.4 Electronic Device Description . 15
4.2.5 User Interface Plug-in . 16
4.2.6 Attachment . 18 ®
4.3 FDI Package Types . 18 ®
4.3.1 FDI Device Package . 18 ®
4.3.2 FDI Communication Package . 19 ®
4.3.3 FDI UIP Package . 19 ®
4.3.4 FDI Profile Package . 20 ®
5 FDI Package implementation . 21
5.1 Packaging technology . 21
5.2 Use of Open Packaging Conventions . 21
5.2.1 Unknown parts . 21
5.2.2 Invalid parts . 22
5.2.3 Unknown relationships . 22
5.2.4 Interleaving. 22
5.2.5 Core properties . 22
5.2.6 Thumbnails . 22
5.2.7 Digital Signatures . 22 ®
5.3 FDI Package parts. 22
5.3.1 Package Catalog . 22
5.3.2 Package Feature Table . 23
5.3.3 Electronic Device Description . 23
5.3.4 User Interface Plug-in . 24
5.3.5 Attachments . 27 ®
6 FDI Package versioning . 30
6.1 Version scheme . 30
6.2 Versioned elements . 31
6.3 Version hierarchy . 31
6.4 UIP compatibility . 33 ®
7 Digital Signatures and FDI Registration Certificates . 34
7.1 Signed elements and certification documents . 34
7.2 Signing mechanism . 35

® ®
7.3 FDI Package Originator, FDI Registration Authority . 36 ®
7.4 FDI Host behaviour . 36
Annex A (normative) File name conventions . 37
A.1 Identification . 37 ®
A.2 FDI Package filename convention . 37 ®
Annex B (informative) FDI Package creation . 39
B.1 General . 39
B.2 Tools and components . 39
B.2.1 Overview . 39 ®
B.2.2 FDI Reference Implementation/Common EDD Engine . 39 ®
B.2.3 FDI Package IDE . 39 ®
B.2.4 FDI Device Package Conformance Test Tool . 39
B.3 Development . 39 ®
B.3.1 FDI Package core development . 39
B.3.2 User Interface Plug-in development . 40 ®
B.3.3 FDI Package Attachment development . 40 ®
B.3.4 FDI Package binding and packaging . 40
B.3.5 Conformance Test . 41 ®
Annex C (informative) FDI Package deployment . 42
C.1 General . 42
C.2 Scenarios . 42 ®
C.2.1 FDI Package deployment to PC based client/server systems . 42
® ®
C.2.2 FDI Package deployment to an FDI standalone system . 43
Annex D (informative) Example . 45
D.1 General . 45
D.2 Open Packaging Conventions . 45
D.2.1 Overview . 45
D.2.2 Parts. 45
D.2.3 Relationships . 46
D.2.4 OPC Core features . 46
D.2.5 OPC additional features . 47 ®
D.3 Creation and handling of FDI Packages. 48 ®
D.4 FDI Device Package example . 48
D.4.1 Overview . 48
D.4.2 User Interface Plug-in . 53
D.4.3 EDD reference to UIP . 55 ®
D.4.4 FDI Registration Certificate . 56 ®
Annex E (normative) FDI Package Catalog XML Schema . 57
E.1 Target Namespace . 57
E.2 Catalog . 57
E.3 ClassificationIdT . 57
E.4 CommunicationProfileT . 57
E.5 CommunicationRoleT . 57
E.6 CommunicationServerT . 58
E.7 DeviceTypeT . 58
E.8 FDIRegistrationCert . 59
E.9 FDIRegistrationCertT . 59
E.10 InterfaceT . 60

– 4 – IEC 62769-4:2023 RLV © IEC 2023
E.11 ListOfCommunicationProfilesT . 61
E.12 ListOfDeviceImagesT . 61
E.13 ListOfDeviceTypesT . 62
E.14 ListOfDocumentsT . 62
E.15 ListOfInterfacesT . 63
E.16 ListOfLocalizedStringsT . 63
E.17 ListOfProtocolSupportFilesT . 64
E.18 ListOfRegDeviceTypesT . 64
E.19 ListOfRegistrationsT . 64
E.20 ListOfSupportedDeviceRevisionsT . 65
E.21 ListOfSupportedUipsT . 65
E.22 ListOfUipVariantsT . 66
E.23 LocalizedStringT . 66
E.24 PackageT . 66
E.25 PackageTypeT . 67
E.26 PlatformT . 68
E.27 RegDeviceTypeT . 68
E.28 RegistrationT . 69
E.29 RelationshipIdT . 69
E.30 String256T . 70
E.31 SupportedUipT . 70
E.32 UipCatalog . 70
E.33 UipStyleT . 71
E.34 UipT . 71
E.35 UipVariantT . 72
E.36 UuidT . 73
E.37 VersionSupportedT . 73
E.38 VersionT . 73
Annex F (normative) Communication protocol specific profiles . 74 ®
Annex G (informative) FDI Package life-cycle use cases . 75
G.1 New device type . 75
G.2 Replacement of device . 75
G.3 Firmware enhancements . 75 ®
G.4 FDI Package life-cycle polices . 76 ®
G.5 FDI Package update . 76 ®
G.6 FDI Package upgrade . 76 ®
G.7 FDI Package replacement/exchange . 76 ®
G.8 FDI Package uninstallation . 77
Annex H (normative) Health status Method . 78
H.1 Background. 78
H.2 Device health status model . 78
H.3 Standard EDD Method signature . 78
H.4 Performance considerations . 79
Annex I (normative) Modular devices . 80
I.1 Concept . 80
I.2 EDDL usage profile . 80
I.3 Processing recommendations . 81
I.3.1 Monolithic device with device variants . 81

I.3.2 Remote IOs . 81
I.3.3 How to identify the top level topology element . 81
I.3.4 Packaging details example . 81
® ®
Annex J (normative) FDI Communication Packages for FDI Communication Server . 83
J.1 General . 83
J.2 Protocol Support File . 83
J.3 CommunicationProfile definition . 83
J.4 Profile Device . 83
J.5 Protocol version information . 83 ®
J.6 Associating a Package with an FDI Communication Server . 83
J.7 Handling of Catalog elements . 83
J.8 Example. 84 ®
Annex K (normative) FDI Profile for EDDs . 85
K.1 Overview. 85
K.2 Entry point to online handling . 85
K.3 Entry point to offline handling . 85
K.4 Non-interactive upload and download. 85
K.5 Interactive download . 85
K.6 Interactive upload . 85
K.7 Initial data set . 85
K.8 Method GetHealthStatus . 86
K.9 Actions . 86
K.9.1 Pre- and Post-Read Actions . 86
K.9.2 Pre- and Post-Write Actions . 86
K.9.3 Refresh Actions on Variables . 86
K.9.4 Actions on BIT_ENUMERATION . 86
K.10 Shared files . 86 ®
Annex L (normative) FDI Package Documentation Catalog Schema . 87
L.1 Target namespace . 87
L.2 ListOfDocumentMetadataT . 87
L.3 DocumentMetadataT . 87 ®
Annex M (normative) FDI Package Feature Table Schema . 89
M.1 Target namespace . 89
M.2 FeatureTableT . 89
M.3 Feature . 89
M.4 FeatureProvidedbyPackage . 89
M.5 UnitConversion . 90
Bibliography . 91
®
Figure 1 – FDI architecture diagram . 11 ®
Figure 2 – FDI Package Model . 14
Figure 3 – Architectural mapping . 15
Figure 4 – User Interface Plug-in Reference Model . 17 ®
Figure 5 – Multiple FDI Packages referencing a common UIP . 18 ®
Figure 6 – FDI Device Package . 18 ®
Figure 7 – FDI Communication Package . 19 ®
Figure 8 – FDI UIP Package . 20

– 6 – IEC 62769-4:2023 RLV © IEC 2023 ®
Figure 9 – FDI Profile Package . 20
Figure 10 – Device Function and Parameter sets (type and profile specific) . 21
Figure 11 – Catalog Element . 23
Figure 12 – User Interface Plug-in . 25
Figure 13 – UIP Catalog . 26 ®
Figure 14 – FDI Registration Certificate . 30
Figure 15 – Version hierarchy . 32
Figure 16 – UIP version support concept . 34 ®
Figure 17 – FDI Package signing . 35 ®
Figure B.1 – Tools used for FDI Package development . 40
Figure D.1 – Parts and relationships in a package . 45 ®
Figure D.2 – Creating an FDI Package with the content files . 48 ®
Figure D.3 – FDI Device Package example . 49
Figure D.4 – User Interface Plug-in example (fancytrend.uip) . 53
Figure I.1 – Modular device's package . 80

Table 1 – UIP Platform Capabilities . 17
Table 2 – Package Catalog part . 23
Table 3 – Package Feature Table part . 24
Table 4 – EDD part . 24
Table 5 – User Interface Plug-in part . 25
Table 6 – UIP Catalog part. 27
Table 7 – UIP Variant part . 27
Table 8 – Image part . 28
Table 9 – Documentation part . 28
Table 10 – Documentation Catalog part . 28
Table 11 – Protocol Support File part . 29 ®
Table 12 – FDI Registration Certificate part . 29
Table 13 – Versioned elements . 31 ®
Table 14 – Influence on FDI Package version. 32 ®
Table A.1 – FDI Package Naming Convention . 38 ®
Table D.1 – Examples of standard MIME media types that can be used in FDI
Packages . 47
® ®
Table D.2 – Examples of FDI -custom MIME media types that can be used in FDI
Packages . 47
Table E.1 – Enumerations of CommunicationRoleT . 58
Table E.2 – Elements of CommunicationServerT . 58
Table E.3 – Elements of DeviceTypeT . 59
Table E.4 – Elements of FDIRegistrationCertT . 60
Table E.5 – Elements of InterfaceT . 61
Table E.6 – Elements of ListOfCommunicationProfilesT . 61
Table E.7 – Elements of ListOfDeviceImagesT . 62
Table E.8 – Elements of ListOfDeviceTypesT . 62
Table E.9 – Elements of ListOfDocumentsT . 63

Table E.10 – Elements of ListOfInterfacesT . 63
Table E.11 – Elements of ListOfLocalizedStringsT . 63
Table E.12 – Elements of ListOfProtocolSupportFilesT . 64
Table E.13 – Elements of ListOfRegDeviceTypesT . 64
Table E.14 – Elements of ListOfRegistrationsT . 65
Table E.15 – Elements of ListOfSupportedDeviceRevisionsT . 65
Table E.16 – Elements of ListOfSupportedUipsT . 65
Table E.17 – Elements of ListOfUipVariantsT. 66
Table E.18 – Attributes of LocalizedStringT . 66
Table E.19 – Elements of PackageT . 67
Table E.20 – Enumerations of PackageTypeT . 68
Table E.21 – Enumerations of PlatformT . 68
Table E.22 – Elements of RegDeviceTypeT . 69
Table E.23 – Elements of RegistrationT . 69
Table E.24 – Elements of SupportedUipT. 70
Table E.25 – Enumerations of UipStyleT . 71
Table E.26 – Elements of UipT . 72
Table E.27 – Elements of UipVariantT . 72
Table F.1 – Communication protocol interest groups (alphabetical order) . 74
Table G.1 – Device replacement guidelines . 75
Table G.2 – Firmware enhancement guidelines . 76
Table H.1 – Health status state . 78
Table J.1 – Catalog Mapping . 83
Table J.2 – Handling of Catalog elements . 83
Table L.1 – Elements of ListOfDocumentsMetadataT . 87
Table L.2 – Enumerations of DocumentMetadataT . 88

– 8 – IEC 62769-4:2023 RLV © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________ ®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 4: FDI Packages
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 62769-4:2021. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
IEC 62769-4 has been prepared by subcommittee 65E: Devices and integration in enterprise
systems, of IEC technical committee 65: Industrial-process measurement, control and
automation. It is an International Standard.
This third edition cancels and replaces the second edition published in 2021. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) added DocumentClass to Package Schema, Description of Feature Table and
Documentation Catalog, individual schemas for Feature Table and Package Documentation
Catalog, schema for UnitConversion, interactive download to device, and Feature Unit
Conversion;
b) moved DocumentClass to Package Documentation Catalog Schema;
c) updated Description of Feature Table updated XML schema for Feature Table.
The text of this International Standard is based on the following documents:
Draft Report on voting
65E/857/CDV 65E/914/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
A list of all parts in the IEC 62769 series, published under the general title Field device ®
integration (FDI ), can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
understanding of its
contains colours which are considered to be useful for the correct
contents. Users should therefore print this document using a colour printer.

– 10 – IEC 62769-4:2023 RLV © IEC 2023
INTRODUCTION
The IEC 62769 series has the general title Field Device Integration (FDI) and the following
parts:
– Part 1: Overview
– Part 2: FDI Client
– Part 3: FDI Server
– Part 4: FDI Packages
– Part 5: FDI Information Model
– Part 6: FDI Technology Mapping
– Part 7: FDI Communication Devices
– Part 100: Profiles – Generic Protocol Extensions
– Part 101-1: Profiles – Foundation Fieldbus H1
– Part 101-2: Profiles – Foundation Fieldbus HSE
– Part 103-1: Profiles – PROFIBUS
– Part 103-4: Profiles – PROFINET
– Part 109-1: Profiles – HART and WirelessHART
– Part 115-2: Profiles – Protocol-specific Definitions for Modbus RTU
– Part 150-1: Profiles – ISA 100.11a
®
FIELD DEVICE INTEGRATION (FDI ) –
®
Part 4: FDI Packages
1 Scope
®1 ®
This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated
in Figure 1. The architectural components that are within the scope of this document have been
highlighted in this figure. ®
Figure 1 – FDI architecture diagram
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
___________
1 ®
FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given
for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark
holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires
permission of the trade name holder.

– 12 – IEC 62769-4:2023 RLV © IEC 2023
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61804 (all parts), Function blocks (FB) for process control and electronic device description
language (EDDL)
IEC 61804-3, Devices and integration in enterprise systems − Function blocks (FB) for process
control and electronic device description language (EDDL) − Part 3: EDDL syntax and
semantics
IEC 61804-5:20152020, Devices and intergration in enterprise systems − Function blocks (FB)
for process control and electronic device description language (EDDL) − Part 5: EDDL Builtin
library ®
IEC 62769-1, Field Device Integration (FDI ) – Part 1: Overview ®
) – Part 2: Client
IEC 62769-2, Field Device Integration (FDI
® ®
IEC 62769-5, Field Device Integration (FDI ) – Part 5: FDI Information Model
® ®
IEC 62769-6, Field Device Integration (FDI ) – Part 6: FDI Technology Mappings ®
IEC 62769-7, Field Device Integration (FDI ) – Part 7: Communication Devices ®
IEC 62769-1xx (all parts), Field Device Integration (FDI ) – Part 1xx-y: Profiles
ISO/IEC 11578, Information technology – Open Systems Interconnection – Remote Procedure
Call (RPC)
ISO/IEC 29500-2:20162021, Information technology – Document description and processing
languages – Office Open XML file formats – Part 2: Open packaging conventions
ISO 639-1, Codes for the representation of names of languages – Part 1: Alpha-2 code
ISO 32000-1, Document management – Portable document format – Part 1: PDF 1.7
Dublin Core Metadata Initiative: DCMI Metadata Terms, 2020 ®
) – Technology Management
FCG TS10099, Field Device Integration (FDI
FIPS 140-3:2019, Security Requirements for Cryptographic Modules
Extensible Markup Language (XML) 1.0, W3C Recommendation, available at

XML Schema Definition Language (XSD) 1.1, W3C Recommendation, available at

FIPS 140-2, Security Requirements for Cryptographic Modules
ETSI EN 319 132-1, Electronic Signatures and Infrastructures (ESI); XAdES digital signatures;
Part 1: Building blocks and XAdES baseline signatures
ETSI TS 101 733, Electronic Signatures and Infrastructures (ESI); CMS Advanced Electronic
Signatures (CAdES)
...