IEC PAS 62647-21:2011

IEC/PAS 62647-21


®


Edition 1.0 2011-07



PUBLICLY AVAILABLE



SPECIFICATION



PRE-STANDARD

Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 21: Program management – Systems engineering guidelines for managing
the transition to lead-free electronics




IEC/PAS 62647-21:2011(E)

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IEC/PAS 62647-21


®


Edition 1.0 2011-07



PUBLICLY AVAILABLE



SPECIFICATION




PRE-STANDARD

Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 21: Program management – Systems engineering guidelines for managing
the transition to lead-free electronics



INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
V
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-88912-600-2
® Registered trademark of the International Electrotechnical Commission

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– 2 – PAS 62647-21 © IEC:2011(E)



CONTENTS

FOREWORD . 4


INTRODUCTION . 6

1 Scope . 7

2 Normative references . 8


3 Terms and definitions . 9

4 Symbols and abbreviated terms . 11

5 General discussion of program management/systems engineering management

concerns . 11
5.1 Concerns in accordance to IEC/PAS 62647-1 (GEIA-STD-0005-1) . 12
5.1.1 Reliability . 12
5.1.2 Configuration control . 12
5.1.3 Risk management . 12
5.1.4 Detrimental effects of tin . 12
5.1.5 Rework/repair and maintenance . 13
5.2 Additional program management / system engineering concerns . 13
5.2.1 Cost . 13
5.2.2 Commercial off-the-shelf. 14
5.2.3 Quality . 14
5.2.4 Contractual language . 14
5.2.5 Program constraints . 14
5.2.6 System engineering management plan . 14
6 Requirements definition . 15
6.1 Customer requirements . 15
6.1.1 WEEE and RoHS Directives . 15
6.1.2 Executive Order 13148 (green initiative) . 15
6.2 Additional prime contractor requirements . 15
6.3 Change control . 15
7 Use environment(s) . 15
7.1 Impact on use environment(s) . 15
7.2 Impact on storage and transport . 15
8 Decision criteria . 15
8.1 Program decision concerning Pb-free . 15

8.2 Compliance to IEC/PAS 62647-1 (GEIA-STD-0005-1) . 16
8.3 Solder alloy chosen . 16
8.4 Other programs . 16
8.4.1 Percentages of product . 16
8.4.2 Supplier awareness . 16
9 Suppliers lead-free control plan . 16
9.1 Supplier procurement & subcontractor control . 16
9.1.1 Supplier procurement . 17
9.1.2 Supplier subcontractor control plan . 17
9.2 Productibility plan . 17
9.3 Manufacturing changes . 17
9.4 Manufacturing risk management . 18
9.5 Supplier schedule of Pb-free implementation . 18
10 Requalification / test plan . 18

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PAS 62647-21 © IEC:2011(E) – 3 –


10.1 Delta qualification or requalification . 18

10.2 Acceptance by analysis / test . 18

10.3 Acceptance by similarity . 18

11 Rework / repair and maintenance . 18

11.1 Supplier recommendations for rework/repair of Pb-free products . 18

11.2 Maintenance and training documentation. 19

12 Risk management . 19

12.1 Program-level identification of program-level risks . 19


12.2 Risk analyses . 19

12.3 Risk mitigation . 19
13 Cost . 19
14 Presentation to customer . 19
14.1 Compliance to IEC/PAS 62647-1 (GEIA-STD-0005-1) . 19
14.2 System engineering management plan . 19
14.3 Other deliverables to the customer . 20
Annex A (informative) Matrix of tier level versus associated risk . 21
Annex B (informative) Links to the European Union Directives and Executive Order
13148 . 23
Annex C (informative) General program manager checklist for dealing with Pb-free
issues . 24
Annex D (informative) General manufacturing process assessment checklist for
assessing supplier compliance to IEC/PAS 62647-1 (GEIA-STD-0005-1) . 26
Annex E (informative) Recommended program language (subject to contractual
agreements) . 33
Bibliography . 34

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– 4 – PAS 62647-21 © IEC:2011(E)


INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________



PROCESS MANAGEMENT FOR AVIONICS –

AEROSPACE AND DEFENCE ELECTRONIC

SYSTEMS CONTAINING LEAD-FREE SOLDER –



Part 21: Program management –

Systems engineering guidelines for managing

the transition to lead-free electronics



FOREWORD
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
A PAS is a technical specification not fulfilling the requirements for a standard, but made
available to the public.

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PAS 62647-21 © IEC:2011(E) – 5 –


IEC-PAS 62647-21 has been processed by IEC technical committee 107: Process

management for avionics.


The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in

the following document

Draft PAS Report on voting

107/130/PAS 107/138A/RVD

Following publication of this PAS, which is a pre-standard publication, the technical committee

or subcommittee concerned may transform it into an International Standard.

This PAS shall remain valid for an initial maximum period of 3 years starting from the
publication date. The validity may be extended for a single 3-year period, following which it
shall be revised to become another type of normative document, or shall be withdrawn.
This PAS is based on GEIA-HB-0005-1 and is published as a double logo PAS. GEIA,
Government Electronics and Information Technology Association, has been transformed into
TechAmerica Association.
This document is intended to be used in concert with IEC/PAS 62647-1 (GEIA-STD-0005-1)
and IEC/PAS 62647-2 (GEIA-STD-0005-2).
It should be noted that suppliers who have been qualified in compliance with
IEC/PAS 62647-1 (GEIA-STD-0005-1) and IEC/PAS 62647-2 (GEIA-STD-0005-2) and utilizing
IEC/PAS 62647-22 (GEIA-HB-0005-2) will have adequately addressed the concerns and
issues delineated in Clauses 5 through 14 of this PAS.

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– 6 – PAS 62647-21 © IEC:2011(E)


INTRODUCTION


Due to a variety of real and potential health issues, many constituent materials used in the

production of electronic products have come under scrutiny. The European Union (EU) has

enacted two directives; 2002/95/EC Restriction of Hazardous Substances (RoHS) and

2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that restrict or eliminate the

use of various substances in a variety of products that are produced after July 2006. One of

the key materials restricted is lead (Pb), which is widely used in electronic solder and

electronic piece part terminations. While these regulations may appear to only affect products

for sale in the EU, due to the reduced market share of the aerospace and high performance

industry in electronics, many of the lower tier Suppliers will change their products because

their primary market is consumer electronics. Additionally, several U.S. states have enacted
similar “green” laws and many Asian electronics manufacturers have recently announced
completely green product lines.
Since the aerospace industry is one of the few major industrial sectors that still repair Circuit
Card Assemblies (CCAs) and since Pb-free materials and processes are relatively immature
and poorly understood, an aerospace-wide approach to the transition was deemed to be
highly valuable.

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PAS 62647-21 © IEC:2011(E) – 7 –


PROCESS MANAGEMENT FOR AVIONICS –

AEROSPACE AND DEFENCE ELECTRONIC

SYSTEMS CONTAINING LEAD-FREE SOLDER –



Part 21: Program management –

Systems engineering guidelines for managing

the transition to lead-free electronics







1 Scope
This PAS is designed to assist program management and/or systems engineering
management in managing the transition to lead-free (Pb-free) electronics to assure product
reliability and performance.
Programs may inadvertently introduce Pb-free elements (including piece part finish, printed
wiring board (PWB) or printed circuit board (PCB) finish, or assembly solder) if careful
coordination between buyer and Supplier is not exercised. For example, piece part
manufacturers may not always change part numbers to identify Pb-free finishes, especially if
the previous tin-lead (Sn/Pb) finished piece part has been discontinued. Detailed examination
of piece parts and documents at receiving inspection while crucial may not be sufficient to
identify Pb-free piece parts.
NOTE Pb-free technology can impact any program regardless of whether the program itself is exempt or bound by
environmental regulations. The industry conversion to Pb-free solder technology may affect an aerospace program
in one or both of the following ways:
1) if the program is required to implement Pb-free technology (contract requirement, environmental regulation,
etc), then the Program Manager/lead systems engineer will need to assess the impact of in-house transition
with respect to design (performance of products using Pb-free) and process (processes to build Pb-free
products);
2) if the program purchases COTS (Commercial-off-the-Shelf) items for its products/systems, then there is a very
good chance that these items will contain Pb-free solder or Pb-free finishes on parts, printed wiring boards
(PWBs), printed circuit boards (PCB), or circuit cards assemblies (CCA).
The basic principles delineated in this PAS can be used for program management and/or
systems engineering management of any aerospace and/or high performance program. The
annexes in the PAS describe tools that can be used in conjunction with this handbook.
1) Annex A describes a matrix of product tier level versus associated risks with respect to a
Pb-free transition.

2) Annex B contains links to the European Union Directives and Executive Order 13148.
3) Annex C contains a General Program Manager Checklist for Dealing with Pb-free Issues
that summarizes the content of this document.
4) Annex D contains a General Manufacturing Process Assessment Checklist to assess
Supplier compliance to IEC/PAS 62647-1 (GEIA-STD-0005-1).
5) Annex E describes recommended program language to assure performance, reliability,
airworthiness, safety, and certifiability of Pb-free product(s).
This PAS is designed to assist a program in assuring the performance, reliability,
airworthiness, safety, and certifiability of product(s), in accordance with IEC/PAS 62647-1
(GEIA-STD-0005-1). Please note that the Program Manager and systems engineer (along with
their respective organizations), and the appropriate enterprise authority work together in
ensuring that all impacts of Pb-free technology insertion are understood and risks mitigated
accordingly. Herein “Program Management (or Manager) and/or Systems Engineering
Management (or Manager) and/or the appropriate enterprise authority” shall be defined as
“Program Manager” throughout the remaining document (see Clause 3, Terms and
Definitions).

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– 8 – PAS 62647-21 © IEC:2011(E)


2 Normative references


The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.


Industry Standards

IEC/PAS 62647-1,  Process management for avionics – Aerospace and defence
(GEIA-STD-0005-1), electronics systems containing lead free solder – Part 1: Lead-free

management


IEC/PAS 62647-2 Process management for avionics – Aerospace and defence
electronics systems containing lead-free solder – Part 2: Mitigation
(GEIA-STD-0005-2),
of the deleterious effects of tin
Performance Standard for Aerospace and High Performance
GEIA-STD-0005-1,
Electronic Systems Containing Lead-free Solder


GEIA-HB-0005-1, Program Management/Systems Engineering Guidelines For
Managing The Transition To Lead-Free Electronics
GEIA-HB-0005-2, Technical Guidelines for Aerospace and High Performance
Electronic Systems Containing Lead-free Solder
IPC-A-610, Acceptability of Electronic Assemblies
AS/EN/JISQ9100, Quality Systems – Aerospace – Model For Quality Assurance In
Design, Development, Production, Installation And Servicing
ANSI/ASQC Q9000  Quality Management and Quality Assurance Standards Guidance for
ARINC Project Lead-Free Soldering, Repair and Rework
Paper 671

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PAS 62647-21 © IEC:2011(E) – 9 –


3 Terms and definitions


For purposes of this document, the following terms and definitions apply.


3.1

assemblies

are electronic items that require electrical attachments, including soldering of wires or piece

part terminations; examples include circuit card assemblies and wire harnesses.


3.2

COTS

is defined as “commercial off the shelf”. It can apply to a piece part, assembly, or unit.
3.3
critical
item or function, if defective, will result in the system’s inability to retain operational capability,
meet primary objective, or affect safety.
3.4
customer
refers to an entity or organization that (a) integrates a piece part, soldered assembly, unit, or
system into a higher level system, (b) operates the higher level system, or (c) certifies the
system for use. For example, this may include end item users, integrators, regulatory
agencies, operators, original equipment manufacturers (OEMs), and subcontractors.
3.5
High performance system or product
requires continued performance or performance on demand, or equipment down time cannot
be tolerated, or end-use environment may be uncommonly harsh, and the equipment must
function when required, such as life support or other critical systems
3.6
lead-free
is defined as less than 0,1 % by weight of lead in accordance with Waste Electrical and
Electronic Equipment (WEEE) guidelines
3.7
Lead-free Control Plan (LFCP)
refers to an aerospace or defence system Supplier’s document that defines the processes
that assure the plan owners, their Customers, and all other stakeholders that aerospace and
high performance high-reliability electronics systems containing Pb-free solder will continue to
be reliable, safe, producible, affordable, and supportable. An acceptable LFCP, per
IEC/PAS 62647-1 (GEIA-STD-0005-1), will fulfill all intentions of the standard. ANSI/ASQC
Q9000 documentation may provide a strong basis for the control plan. Technical guidance on
evaluating an adequate LFCP can be found in IEC/PAS 62647-1 (GEIA-STD-0005-1).
3.8
may
indicates a course of action that is permissible within the limits of this PAS, but not required.
3.9
Pb-free Tin
is defined to be pure tin or any tin alloy with < 3 % lead (Pb) content by weight. This means
that some Pb-free finishes other than pure tin, such as tin-bismuth and tin-copper, are
considered to be “tin” for the purposes of this handbook. Many of these alloys have not been
assessed for whiskering behavior.

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– 10 – PAS 62647-21 © IEC:2011(E)


3.10

Pb-free tin finish

is defined to be Pb-free tin final finish or under-plate either external or internal to a piece part,

printed wiring board (PWB), printed circuit board (PCB), circuit card assembly (CCA) or other

hardware. This includes all leads and surfaces, even those coated, encapsulated, or

otherwise not exposed. It may include finishes on electrical piece parts, mechanical piece

parts, and printed wiring boards (PWB) printed circuit board (PCB) or circuit card assembly
(CCA). It does not include Pb-free bulk solders, assembly materials, ball-grid-array

terminations, or those devices where the Pb-free tin finish has been completely replaced.


3.11

PCB

stands for Printed Circuit Board, which is also commonly referred to as a Printed Wiring Board
(PWB)
3.12
piece part
is defined as an electronic component that is not normally disassembled without destruction
and is normally attached to a printed wiring board (PWB), printed circuit board (PCB) or circuit
card assembly (CCA), to perform an electrical function
3.13
program manager
for purposes of this PAS (and this PAS only), refers to program management (or manager)
and/or systems engineering management (or manager) and/or the appropriate enterprise
authority. The reason for this is to streamline this PAS. The implications are that the program
manager and systems engineer (along with their respective organizations) and the
appropriate enterprise authority work together in ensuring that all impacts of Pb-free
technology insertion are understood and risks mitigated accordingly.
3.14
PWB
stands for Printed Wiring Board, which is also commonly referred to as a Printed Circuit Board
(PCB)
3.15
repair
is the act of restoring the functional capability of a defective article in a manner that precludes
compliance of the article with applicable drawings or specifications.
3.16
rework

is the act of reprocessing non-complying articles, through the use of original or equivalent
processing in a manner that assures full compliance of the article with applicable drawings or
specifications
3.17
should
indicates that, among several possibilities, one is recommended as particularly suitable,
without mentioning or excluding others; or that a certain course of action is preferred but not
necessarily required; or that (in the negative form) a certain course of action is discouraged
but not prohibited.
3.18
sub-contractor
refers to an organization, within the given high-reliability industry, that supplies, maintains,
repairs, or supports electronic systems, and is not the direct Supplier to the Customer or user
of those systems

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PAS 62647-21 © IEC:2011(E) – 11 –


3.19

supplier

refers to an entity or organization that designs, manufactures, repairs, or maintains a piece

part, unit, or system. For example, this includes original equipment manufacturers (OEMs),

repair facilities, subcontractors, and piece part manufacturers.


3.20

system

is defined as one or more units that perform electrical function(s).


3.21

tin whisker
is a spontaneous crystal growth that emanates from a tin surface. They may be cylindrical,
kinked, or twisted. Typically they have an aspect ratio (length/width) greater than two, with
shorter growths referred to as nodules or odd-shaped eruptions. See IEC/PAS 62647-2
(GEIA-STD-0005-2) for further description of tin whiskers and their physical attributes.
3.22
unit
is defined as one or more assemblies wit
...