IEC 60352-5:2008

IEC 60352-5
Edition 3.0 2008-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Solderless connections –
Part 5: Press-in connections – General requirements, test methods and practical
guidance
Connexions sans soudure –
Partie 5: Connexions insérées à force – Exigences générales, méthodes d’essai
et guide pratique
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IEC 60352-5
Edition 3.0 2008-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Solderless connections –
Part 5: Press-in connections – General requirements, test methods and practical
guidance
Connexions sans soudure –
Partie 5: Connexions insérées à force – Exigences générales, méthodes d’essai
et guide pratique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.220.10 ISBN 2-8318-9522-7

– 2 – 60352-5 © IEC:2008
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object .7
2 Normative references.7
3 Terms and definitions .8
4 Requirements .9
4.1 General .9
4.2 Tools .9
4.2.1 Tools evaluation .9
4.3 Press-in terminations.9
4.3.1 Materials.9
4.3.2 Dimensions of the press-in zone .9
4.3.3 Surface finishes .9
4.3.4 Design features .10
4.4 Printed boards .10
4.4.1 General .10
4.4.2 Materials.10
4.4.3 Thickness of printed boards .10
4.4.4 Plated-through hole.10
4.5 Press-in connections .11
4.6 Manufacturer´s specification .11
5 Tests .12
5.1 General .12
5.1.1 General remarks.12
5.1.2 Standard conditions for testing.13
5.1.3 Mounting of specimens/sets of parts .13
5.2 Test and measuring methods.13
5.2.1 General examination.13
5.2.2 Mechanical tests .14
5.2.3 Electrical tests .18
5.2.4 Climatic tests.18
5.3 Test schedules .19
5.3.1 General .19
5.3.2 Qualification test schedule .19
5.3.3 Application test schedule .21
5.3.4 Flow chart.23
5.4 Test report.24
5.4.1 Qualification test report.24
5.4.2 Application test report .24
6 Practical guidance .25
6.1 Current-carrying capacity.25
6.2 Tool information.25
6.2.1 Termination insertion tool.25
6.2.2 Support block .25
6.2.3 Termination removal tool.26

60352-5 © IEC:2008 – 3 –
6.3 Termination information .26
6.3.1 General .26
6.3.2 Design features .26
6.3.3 Materials and surface finishes.26
6.3.4 Press-in termination with wrap post.27
6.3.5 Press-in terminations with connector contact elements.27
6.4 Printed board information.28
6.4.1 General .28
6.4.2 Plated-through hole.28
6.5 Connection information .29
6.5.1 General .29
6.5.2 Repair of press-in connections .30
6.5.3 Combination of press-in connections and soldered connections.31
6.5.4 Bimetallic electrolytic corrosion effects.31

Annex A (normative) Solid press-in terminations.32
Annex B (informative) Plated through hole tolerance range .34

Bibliography .36

Figure 1 – Test arrangement, bending .14
Figure 2 – Test arrangement – push-out force .15
Figure 3 – Transverse section of a press-in connection .17
Figure 4 – Longitudinal section of a press-in connection .17
Figure 5 – Test arrangement for contact resistance .18
Figure 6 – Qualification test schedule .23
Figure 7 – Press-in connection made with a press-in termination, application level a).29
Figure 8 – Press-in connection made with a press-in termination, application level b).30
Figure 9 – Example of a termination removal tool .31
Figure A.1 – Parallelism of a solid press-in zone.33
Figure B.1 – Example of hole ranges .34

Table 1 – Finished plated-through holes .11
Table 2 – Vibration, preferred test severities.16
Table 3 – Push-out force for application level b) .29
Table A.1 – Plated-through holes for solid press-in zones .32

– 4 – 60352-5 © IEC:2008
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_____________
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections –
General requirements, test methods and practical guidance

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60352-5 has been prepared by subcommittee 48B: Connectors, of
IEC technical committee 48: Electromechanical components and mechanical structures for
electronic equipment.
This third edition cancels and replaces the second edition published in 2001 and its
amendment 1 (2003). This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
1) A recommendation to use four layer test boards in 5.1.
2) Removal of sample tolerance range requirements in 5.3.2.1; they have been moved to
Annex B.
3) Subclause 6.4.2 has been modified to clarify that platings other than tin or tin/lead may be
used.
60352-5 © IEC:2008 – 5 –
The text of this standard is based on the following documents:
FDIS Report on voting
48B/1805A/FDIS 48B/1830/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
A list of all parts of the IEC 60352 series, under the general title Solderless connections, can
be found on the IEC website.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – 60352-5 © IEC:2008
INTRODUCTION
This part of IEC 60352 includes requirements, tests and practical guidance information.
Two test schedules are provided.
a) The qualification test schedule applies to individual press-in connections (press-in zone).
They are tested to the specification provided by the manufacturer of the press-in zone (see
4.6) taking into account the requirements of Clause 4.
The qualification is independent of the application of the press-in zone in a component.
b) The application test schedule applies to press-in connections which are part of a
component and are already qualified to the qualification test schedule.
Test sequences focus on the performance of the press-in connection which is affected by
the implementation in a component.
As the manufacturer of the press-in zone has to provide the main part of the information
needed for qualification, the use of the words "the manufacturer" is implemented throughout
this standard for simplicity.
IEC Guide 109 advocates the need to minimise the impact of a product on the natural
environment throughout the product life cycle.
It is understood that some of the materials permitted in this standard may have a negative
environmental impact.
As technological advances lead to acceptable alternatives for these materials, they will be
eliminated from the standard.
60352-5 © IEC:2008 – 7 –
SOLDERLESS CONNECTIONS –
Part 5: Press-in connections –
General requirements, test methods and practical guidance

1 Scope and object
This part of IEC 60352 is applicable to solderless press-in connections for use in tele-
communication equipment and in electronic devices employing similar techniques.
The press-in connection consists of a termination having a suitable press-in zone which is
inserted into a plated-through hole of a double-sided or multilayer printed board.
Information on materials and data from industrial experience is included in addition to the test
procedures to provide electrically stable connections under prescribed environmental
conditions.
The object of this part of IEC 60352 is to determine the suitability of press-in connections under
specified mechanical, electrical and atmospheric conditions.
Only compliant press-in zones can be qualified according to this part of IEC 60352.
Solid press-in zones are in use. Information about these is given in Annex A.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60050(581):1978, International Electrotechnical Vocabulary (IEV) – Chapter 581:
Electromechanical components for electronic equipment
Amendment 1 (1998)
IEC 60068-1:1988, Environmental testing – Part 1: General and guidance
Amendment 1 (1992)
IEC 61249 (all parts), Materials for printed boards and other interconnecting structures
IEC 60352-1:1997, Solderless connections – Part 1: Wrapped connections – General require-
ments, test methods and practical guidance
IEC 60512 (all parts), Connectors for electronic equipment – Tests and measurements
IEC 60512-1-100, Connectors for electronic equipment – Tests and measurements –
Part 1-100: General - Applicable publications
IEC 61188-5-1: Printed boards and printed board assemblies – Design and use – Part 5-1:
Attachment (land/joint) considerations – Generic requirements

– 8 – 60352-5 © IEC:2008
IEC 62326-4:1996, Printed boards – Part 4: Rigid multilayer printed boards with interlayer
connections – Sectional specification
3 Terms and definitions
For the purposes of this document, the terms and definitions of IEC 60050(581) and
IEC 60512-1 as well as the following apply.
3.1
press-in connection
solderless connection made by inserting a press-in termination into a plated-through hole of a
printed board
[IEV 581-03-46]
3.2
press-in termination (press-in post)
termination having a specially shaped zone suitable to provide for a solderless press-in
connection
[IEV 581-03-39]
3.2.1
solid press-in termination
press-in termination having a solid press-in zone
[IEV 581-03-40]
3.2.2
compliant press-in termination
press-in termination having a compliant press-in zone
[IEV 581-03-41]
3.3
press-in zone
specially shaped section of a press-in termination which is suitable to provide for the press-in
connection
[IEV 581-03-52]
3.4
termination insertion tool
device used to insert press-in terminations or components equipped with press-in terminations
into a printed board
[IEV 581-05-22]
3.5
termination removal tool
device for removing a press-in termination from a printed board
[IEV 581-05-23]
3.6
part
press-in terminations and a printed board with plated-through holes. The press-in terminations
are not inserted in the printed board.

60352-5 © IEC:2008 – 9 –
3.7
specimen
printed board, or a part of a printed board, with an inserted press-in termination, with or without
a component housing
4 Requirements
4.1 General
This Clause is applicable to compliant press-in zones only. For solid press-in zones, see
Annex A.
The connections shall be processed in a careful and workmanlike manner, in accordance with
good current practice.
4.2 Tools
Tools shall be used and inspected according to the instructions and dimensions provided by
the manufacturer.
The tools shall be capable of making uniformly reliable connections during their useful life.
The tools shall be so designed that they do not damage the press-in termination or the printed
board when correctly operated.
4.2.1 Tools evaluation
Tools are evaluated for performance by testing the connections made by them and carrying out
tests according to 4.5 and 5.1.2. They shall meet the requirements of 4.6d) and 5.2.1.4.
4.3 Press-in terminations
4.3.1 Materials
Material used in the press-in zone shall be specified by the manufacturer.
For information on materials, see 6.3.3.
4.3.2 Dimensions of the press-in zone
The performance of a press-in connection depends on the dimensions of the specially shaped
press-in zone and the materials used for the press-in termination together with the dimensions
and materials of the plated-through hole in the printed board. The dimensions and shape
including the tolerances of the press-in zone shall be specified by the manufacturer.
NOTE For dimensions of plated-through holes, see 4.4.4.2.
4.3.3 Surface finishes
The press-in zone of the press-in termination shall be either unplated or plated. The surface
finish shall be specified by the manufacturer.
The surface shall be free of detrimental contamination or corrosion. For information on surface
finishes, see 6.3.3.
– 10 – 60352-5 © IEC:2008
4.3.4 Design features
For the shape of the press-in zone, a wide variety of designs can be used.
The press-in termination shall be so designed that a press-in connection is achieved by
inserting the press-in zone to a predetermined depth in a specified plated-through hole in the
board.
The press-in terminations and their press-in zones shall be so designed and manufactured that
damage to the plated-through hole in the printed board is avoided (see also 4.5).
Press-in terminations shall have insert features, for example a shoulder or suitable surface, to
facilitate the insertion operation.
4.4 Printed boards
4.4.1 General
Printed boards according to IEC 61188-5-1 and IEC 62326-4 or to a specification given by the
manufacturer shall be used.
4.4.2 Materials
The manufacturer shall specify the types of base material for which the press-in zone is
designed.
Examples of base materials may be found in IEC 61249.
4.4.3 Thickness of printed boards
The manufacturer shall specify for which range of board thicknesses the press-in zone is
designed.
4.4.4 Plated-through hole
4.4.4.1 Plating of the plated-through hole
The thickness of the plating of the plated-through hole shall be: copper ≥ 25 μm.
Further plating requirements shall be specified by the manufacturer.
4.4.4.2 Hole dimensions
The hole diameter prior to plating is of great importance in determining the reliability of a press-
in connection.
The tolerances on the hole diameters prior to and after plating are given in Table 1.

60352-5 © IEC:2008 – 11 –
Table 1 – Finished plated-through holes
All dimensions are in millimetres
Diameter of the finished Recommended diameter of
Nominal hole diameter
a b
plated-through hole the hole prior to plating
0,50 0,50 ± 0,05 0,60 ± 0,01
0,55
0,55 ± 0,05 0,64 ± 0,01
0,60 0,60 ± 0,05 0,70 ± 0,02
+0,07 +0
0,65 0,65 0,80
−0,04 −0,03
+0,07 +0,03
0,70 0,70 0,80
−0,05 −0,02
+0,05 +0,01
0,75 0,85
0,75
−0,07 −0,04
+0,09
0,80 0,80
0,90 ±0,025
−0,03
+0,10 +0,01
0,85 0,85 1,00
−0,05 −0,04
0,90
0,90 ± 0,07 1,00 ± 0,025
+0,09
1 1,00
1,15 ± 0,025
−0,06
+0,09
1,45 1,45 1,60 ± 0,025
−0,06
+0,09
1,60
1,60 1,75 ± 0,025
−0,06
a
These are typical values for the as-drilled pc board hole diameters for FR4
materials and do not necessarily apply to other pc board materials.
b
These values do not apply to moulded interconnection devices.

4.5 Press-in connections
a) The combination of press-in termination, printed board and termination insertion tool shall
be compatible and specified by the manufacturer.
b) The press-in termination shall be correctly mounted in the plated-through hole of the printed
board as specified in the specification of the manufacturer of the press-in zone.
c) The press-in operation may result in deformation of the plated-through hole (visible by
microsectioning).
d) The press-in termination shall not be damaged (e.g. cracked or bent).
e) There shall be no deformation of the printed conductor and/or the plating of the
plated-through hole caused by the termination insertion tool or device.
f) There shall be no lands fractured or lifted.
g) There shall be no delamination, blistering or cracking of layers.
h) After the press-in operation, no detrimental plating particle chips shall be visible.
i) At the opposite side of the press-in direction, no plating of the plated-through hole shall be
loosened.
4.6 Manufacturer´s specification
The following information shall be supplied by the manufacturer of the press-in zone and/or the
component:
– 12 – 60352-5 © IEC:2008
a) Printed board and hole information
– printed board material;
– maximum number of conductive layers;
– printed board minimum and maximum thickness;
– printed board plating material;
– finished plated through holes dimension (Table 1);
– hole dimension prior to plating.
b) Press-in zone information
– material of the press-in termination;
– plating;
– dimensions, including tolerances.
c) Information on the application
– straight or right angle termination;
– rear plug up;
– wrapped connection;
– individual press-in termination;
– connector with pre-assembled press-in terminations.
d) Instruction and tools for the press-in operation
– tools to be used;
– numbers of repairs with or without a new press-in termination.
e) Press-in characteristics
– maximum press-in force per termination;
– minimum push-out force per termination.
f) Any other significant information
If this information cannot be disclosed, the qualification of the press-in connection will not take
place.
5 Tests
5.1 General remarks
5.1.1 General
As explained in the introduction, there are two test schedules which shall be applied according
to the following conditions.
a) Press-in connections, according to the requirements in Clause 4 and the requirements in
the manufacturer’s specification, shall be tested in accordance with the qualification test
schedule in 5.3.2.
This test schedule is intended to be applied on individual press-in terminations without
component housing.
b) Press-in connections which are part of a component and already qualified to the
qualification test schedule shall be tested in accordance with the application test schedule
in 5.3.3.
This test schedule is intended to be applied on complete components consisting of multiple
press-in terminations mounted in a component housing.
The application test schedule shall be implemented in the detail specification of the component
in such a way that the duplication of tests may be avoided.

60352-5 © IEC:2008 – 13 –
Therefore, the test phases in test group D (see 5.3.3.2) may be inserted in any test group of
the component specification, as long as the sequence, conditioning and environment comply
with the requirements of this standard.
Four layer printed circuit boards shall be used for testing unless otherwise specified in the
component specification or in the manufacturer’s specification.
5.1.2 Standard conditions for testing
5.1.2.1 General
Unless otherwise specified, all tests shall be carried out under standard conditions for testing
as specified in IEC 60512-1.
The ambient temperature and the relative humidity at which the measurements are made shall
be stated in the test report.
In case of dispute about test results, the test shall be repeated at one of the referee conditions
of IEC 60068-1.
5.1.2.2 Preconditioning
Where specified, the connections shall be preconditioned under standard conditions for testing
in accordance with the requirements of IEC 60512-1 for a minimum period of 24 h and no
longer than 25 h.
5.1.2.3 Recovery
Where specified, the specimens shall be allowed to recover under standard conditions for
testing for a period of a minimum of 2 h after conditioning.
5.1.3 Mounting of specimens/sets of parts
For the qualification test schedule, the sets of parts consist of press-in terminations and a
printed board with plated-through holes. When mounting is required in a test, the specimens
shall be mounted using the mounting method described in the manufacturer’s specification.
For the application test schedule, complete components shall be pressed on a printed board,
using the normal mounting method, unless otherwise specified in the component specification
or in the manufacturer’s specification.
NOTE For the definitions of part and specimen, see 3.6 and 3.7.
5.2 Test and measuring methods
NOTE As far as test methods are described in this subclause, it is intended that the description be replaced by a
reference to IEC 60512 as soon as the relevant test method is included in IEC 60512.
5.2.1 General examination
5.2.1.1 Visual examination of parts
The test shall be carried out in accordance with IEC 60512, test 1a. Magnification shall be five
times, and all parts shall be examined to ensure that the applicable requirements of 4.3 to 4.6
have been met.
– 14 – 60352-5 © IEC:2008
5.2.1.2 Examination of dimensions
The test shall be carried out in accordance with IEC 60512, test 1b. All parts shall be examined
to ensure that the applicable requirements of 4.3 to 4.6 have been met.
5.2.1.3 Visual examination of specimens
The test shall be carried out in accordance with IEC 60512, test 1a. Magnification shall be five
times, and all specimens shall be examined to ensure that the applicable requirements of 4.3
to 4.6 have been met.
5.2.1.4 Inspection of tools
The tools shall be inspected and controlled according to the manufacturer’s instructions and
specifications to be sure that the applicable requirements of 4.2 and 4.6 have been met.
5.2.2 Mechanical tests
5.2.2.1 Bending
This test is only applicable to press-in terminations having a free post length of ≥10 mm
protruding from the board.
The object of this test is to assess the ability of a press-in connection to withstand the
mechanical stress caused by an unintentional bending of the free length of the termination and
following adjustment.
The test specimen shall consist of a printed board or a part of a printed board, with an inserted
press-in termination having a free post length of ≥10 mm for bending.
15°
15°
IEC  138/01
Figure 1 – Test arrangement, bending
The free end of one press-in termination shall be bent in one direction and the free end of a
second press-in termination shall be bent in the perpendicular direction. Bending over
distances 1, 2 and 3 shall be considered to be one cycle as shown in Figure 1.
Test severity: One cycle shall be carried out unless otherwise specified by the manufacturer.
5.2.2.2 Press-in force
The force necessary to insert a press-in termination into the plated-through hole of a printed
board is determined by
– the type of press-in zone;
– the type of printed board;
– the diameter of the plated-through hole;
– the surface material of the metal plating in the hole.

60352-5 © IEC:2008 – 15 –
The upper limit of the press-in force shall be specified by the manufacturer.
The recommended speed for application of the press-in force during measurement shall be
25 mm/min to 50 mm/min.
5.2.2.3 Push-out force
This test is only applicable in the qualification test schedule.
This test relates only to the press-in connection between the press-in zone and the metal
plating of a plated-through hole in a printed board. The minimum value given in the
manufacturer’s specification shall ensure a good electrical performance of the press-in
connection before and after mechanical, electrical and climatic conditioning according to the
test schedules.
The object of this test is to assess the ability of a press-in connection to withstand the
mechanical stress caused by a force acting along the longitudinal axis of the press-in
termination.
The test specimen shall consist of a printed board or a part of a printed board with a press-in
termination inserted as shown in Figure 2.
After the press-in operation and before carrying out the push-out test, the test specimens shall
be allowed to recover for a period of at least 24 h.

Printed board
Push-out device
Press-in termination
F
Push-out direction Press-in direction
IEC  2352/07
Figure 2 – Test arrangement – push-out force
A force F shall be applied to the press-in termination against the press-in direction.
A suitable device shall be used, for example a tensile testing machine. The head of the tensile
testing machine shall travel steadily at a speed <12 mm/min.
The specimen shall be tested until the press-in termination moves in the plated-through hole of
the printed board. The ultimate load shall be measured.
Requirement: The minimum and maximum push-out force shall be specified by the manu-
facturer of the press-in zone.
NOTE Where, for technical reasons, when carrying out the push-out test, the push-out operation cannot be
applied, a pull-out operation may be applied.
For information on additional mechanical stresses acting on the press-in termination due to the
application of the press-in connection, see 6.5.1.

– 16 – 60352-5 © IEC:2008
5.2.2.4 Vibration
This test is only applicable in the application test schedule.
The test shall be carried out in accordance with IEC 60512, test 6d.
The test specimens shall be firmly held on a vibration table.
A suitable test arrangement for testing press-in connections shall be defined in the component
specification.
Preferred severities are given in Table 2.
Contact disturbance shall be monitored during vibration test in accordance with IEC 60512,
test 2e.
Requirement: No contact disturbance exceeding 1 μs unless otherwise specified in the
applicable detail specification of the component.
Table 2 – Vibration, preferred test severities
Range of frequency 10 Hz to 55 Hz 10 Hz to 500 Hz 10 Hz to 2 000 Hz
Full duration 2 h + 5 min/– 0 min 6 h+ 5 min/– 0 min 6 h+ 5 min/– 0 min
Displacement amplitude below 0,35 mm 0,35 mm 1,5 mm
the cross-over frequency
2 2
Acceleration amplitude above – 50 m/s 200 m/s
the cross-over frequency
Directions Three axes Three axes Three axes
Number of sweep cycles per direction 8 10 8

Unless otherwise specified in the relevant component detail specification, the 10 Hz to 500 Hz
range shall be carried out.
5.2.2.5 Microsectioning
5.2.2.5.1 General
The test shall be carried out in accordance with IEC 61188-5-1.
5.2.2.5.2 Transverse sectioning
The deformation "a" of the drilled hole contour in the plated-through hole shall be smaller than
70 μm.
The minimum remaining thickness "b" of the plating shall be more than 8 μm. There shall be no
cracks in the plating of the through hole. See Figure 3. Compliance is checked by inspection
and measurement.
60352-5 © IEC:2008 – 17 –
Press-in
b
direction
Measurement of
the deformation
Location of the
microsection
a
Original hole
contour
IEC  140/01
Dimensions in millimetres
Figure 3 – Transverse section of a press-in connection
5.2.2.5.3 Longitudinal sectioning
The deformation "c" of the connected pattern to the plated-through hole shall be not more than
50 μm (see Figure 4).
Neither the plating of the plated-through hole nor the conductor may have cracks ("d"). For
double-sided printed boards, these requirements are applicable to the outer layers. Compliance
is checked by inspection, measurement and visual examination according to 5.2.1.3. The
measurement shall be recorded.

Press-in zone
d
Printed board
IEC  2353/07
Figure 4 – Longitudinal section of a press-in connection
The area of contact between the press-in zone and the hole shall be appropriate to carry the
specified current.
5.2.2.6 Replacement (repairing)
The manufacturer shall specify if replacement is allowed and, if so, the number of replace-
ments allowed. The test of the ability of a press-in zone to withstand replacement and its
possibility to show equal performance is made by having a part of the press-in zone replaced.

+0,2
0,3
–0,1
c
– 18 – 60352-5 © IEC:2008
Replacement is always carried out with new press-in terminations, using the tools specified by
the manufacturer. All requirements are identical to those applicable to the first press-in cycle.
The repaired sets of parts shall be inspected. No loose parts of metal or cracks in the board
layer or conductors shall be visible.
If the component allows the replacement of the press-in termination, the operation and the
tools shall be specified by the manufacturer of the component or a detail specification.
5.2.3 Electrical tests
5.2.3.1 Contact resistance
The contact resistance test shall be carried out in accordance with IEC 60512, test 2a. Care
shall be taken regarding the resolution of the micro-voltmeter as well as corrections for thermo-
electrical voltage. The measuring points should be made as close as possible to minimize the
bulk resistance.
Figure 5 shows an example of the test arrangement.
Printed board
Press-in zone
μV
mA
IEC  2354/07
Figure 5 – Test arrangement for contact resistance
Requirements after mechanical, electrical or climatic conditioning:
a) qualification test schedule: The maximum change of contact resistance shall be less than
0,5 mΩ for each test phase.
b) application test schedule: The maximum change of contact resistance shall be specified
in the component detail specification, if any, or in the
manufacturer’s specification.
If necessary, when direct measurement of press-in connection is not possible, an overall
measurement of contact resistance shall be specified and the requirement for the press-in
connection shall be included in the value required for the component.
5.2.4 Climatic tests
5.2.4.1 General
The detail specification of the component, if any, or the manufacturer’s specification shall
prescribe the upper category temperature (UCT) and the lower category temperature (LCT)
which shall be used in the following tests.
When the printed board associated with this component has a different temperature category,
the climatic test shall be carried out with the temperature category either of the component, or
the printed board, whichever is the less severe.
NOTE The maximum operating temperature of the printed board is the limiting value.

60352-5 © IEC:2008 – 19 –
5.2.4.2 Rapid change of temperature
The test shall be carried out in accordance with IEC 60512, test 11d. Unless otherwise
specified by the manufacturer of the component or a detail specification, the following details
shall apply:
– low temperature T –40 °C (LCT)
A
– high temperature T 85 °C (UCT)
B
– duration of exposure t 30 min
– number o
...