Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

Corrigendum 1 - Composants électriques - Fiabilité - Conditions de référence pour les taux de défaillance et modèles de contraintes pour la conversion

General Information

Status: Published
Publication Date: 09-Oct-2019

ICS: 31.020 - Electronic components in general

Technical Committee: TC 56 - Dependability
Drafting Committee: MT 18 - TC 56/MT 18

Current Stage: PPUB - Publication issued
Start Date: 10-Oct-2019
Completion Date: 28-Nov-2019

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Corrects: IEC 61709:2017 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
Effective Date: 05-Sep-2023

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IEC 61709:2017/COR1:2019 - Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
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IEC 61709:2017/COR1:2019 - Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion Released:10/10/2019

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Frequently Asked Questions

What is IEC 61709:2017/COR1:2019?

IEC 61709:2017/COR1:2019 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion". This standard covers: Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

What is the scope of IEC 61709:2017/COR1:2019?

Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

What ICS categories does IEC 61709:2017/COR1:2019 belong to?

IEC 61709:2017/COR1:2019 is classified under the following ICS (International Classification for Standards) categories: 31.020 - Electronic components in general. The ICS classification helps identify the subject area and facilitates finding related standards.

What standards are related to IEC 61709:2017/COR1:2019?

IEC 61709:2017/COR1:2019 has the following relationships with other standards: It is inter standard links to IEC 61709:2017. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

How can I access IEC 61709:2017/COR1:2019?

IEC 61709:2017/COR1:2019 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)

IEC 61709:2017/COR1:2019 - Cor...

 IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
IEC 61709 IEC 61709
Edition 3.0 2017-02 Édition 3.0 2017-02

ELECTRIC COMPONENTS – RELIABILITY – COMPOSANTS ÉLECTRIQUES – FIABILITÉ –
REFERENCE CONDITIONS FOR FAILURE RATES CONDITIONS DE RÉFÉRENCE POUR LES TAUX
AND STRESS MODELS FOR CONVERSION – DE DÉFAILLANCE ET MODÈLES DE
CONTRAINTES POUR LA CONVERSION –

CO RRI G E NDUM 1
Corrections only apply to the French version.
Les corrections ne s'appliquent qu'à la version française.

Annexe B
B.4 Puissance dissipée d'un circu
...

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IEC

IEC 61163-2:2020(Main)

Reliability stress screening - Part 2: Components

IEC 61163-2:2020 provides guidance on RSS techniques and procedures for electrical, electronic, and mechanical components. This document is procedural in nature and is not, and cannot be, exhaustive with respect to component technologies due to the rapid rate of developments in the component industry. This document is:
a) intended for component manufacturers as a guideline;
b) intended for component users as a guideline to negotiate with component manufacturers on RSS requirements;
c) intended to allow the planning of an RSS process in house to meet reliability requirements or to allow the re-qualification of components for specific, upgraded, environments;
d) intended as a guideline to sub-contractors who provide RSS as a service.
This document is not intended to provide test plans for specific components or for delivery of certificates of conformance for batches of components. The use of bi-modal Weibull analysis to select and optimize an RSS process without having to estimate the reliability and life time of all items is described. This second edition cancels and replaces the first edition published in 1998. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) this version of the document is a complete rewrite and restructure from the previous version.

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60 pages
English and French language
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10-Mar-2020
03.120.01
31.020
TC 56

IEC

IEC 61709:2017(Main)

Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications. Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004.
This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319.
The contents of the corrigendum of October 2019 have been included in this copy.
Keywords: failure rate data, reliability prediction of electric components

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IEC

IEC 61709:2011(Main)

Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

IEC 61709:2011 gives guidance on how failure rate data can be employed for reliability prediction of electric components in equipment. Reference conditions are numerical values of stresses that are typically observed by components in the majority of applications. Reference conditions are useful since they are the basis of the calculation of failure rate under any conditions by the application of stress models that take into account the actual operating conditions. This standard also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. This edition includes the following significant technical changes with respect to the previous edition:
- the addition of a number of component types and the updating of models for a large number of component types;
- the addition of annexes on reliability prediction, sources of failure rate data and component classification information.

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IEC 61163-2:1998(Main)

Reliability stress screening - Part 2: Electronic components

Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.

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IEC 61709:1996(Main)

Electronic components - Reliability - Reference conditions for failure rates and stress models for conversion

Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.

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Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices

IEC 63002:2025 defines common charging interoperability guidelines for power sources (external power supplies (EPSs) and other Sources) used with computing and consumer electronics devices that implement IEC 62680‑1‑3 (USB Type-C® Cable and Connector Specification). This document defines normative requirements for an EPS to ensure interoperability; in particular, it specifies the data communicated from a power source to a device and certain safety elements of the EPS, cable, and device. While the requirements focus of this document is on the EPS and the behaviour at its USB Type-C connector interface, it is also important to comprehend cable assembly and device capabilities and behaviours in order to assure end-to-end charging interoperability. This document does not apply to all design aspects of an EPS. This document does not specify regulatory compliance requirements for aspects such as product safety, EMC, or energy efficiency. This document provides recommendations for the behaviour of a device when used with a power source compliant with this document. It specifies the minimum hardware specification for an EPS implementing IEC 62680‑1‑3. This document also specifies the data objects used by a charging system utilizing IEC 62680‑1‑2 to understand the identity, design and performance characteristics, and operating status of an external power supply. IEC 62680‑1‑2 focuses on power delivery applications ranging to 240 W for a variety of computing and consumer electronics devices including notebook computers, tablets, smartphones, small form-factor desktops, monitor displays and other multimedia devices. This document relies on established mechanical and electrical specifications, and communication protocols specified by IEC 62680‑1‑2 and IEC 62680‑1‑3. These specifications support methods for establishing the best performing interoperability between untested combinations of EPS and devices with the aim of improving consumer satisfaction. Information describing the USB charging interoperability model, overview of USB Type-C and USB Power Delivery specifications, and factors for charging performance are also provided to support implementation of this document. This third edition cancels and replaces the second edition published in 2021. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) power range is increased to 240 W;
b) AVS mode is introduced;
c) Annex A updates issues of arbitrary combinations of AC adapter and device;
d) Annex B describes new safeguards for EPR mode;
e) Annex C and Annex D are updated.

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IEC TR 62500:2024 which is a Technical Report, considers the targets assigned to highly severe stress tests for operating margins research and robustness improvement of avionics equipment, their basic principles, their scope of application and their implementation process. It is primarily intended for avionics programme managers, electronic equipment project managers, designers, test managers, and dependability team.
This document provides guidance which can apply to all avionics programmes and is of primary interest to the original equipment manufacturers (OEMs) in charge of designing, developing and producing equipment built for these programmes, for obtaining early equipment maturity.
This document can be used in conjunction with IEC 62429, IEC 62506, or both, with regard to dependability aspects related to equipment consisting of hardware with embedded software.

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IEC 63203-402-2:2024 specifies test methods for measuring and evaluating the performance, reliability, and accuracy of the step counting feature in any wearable device that can count steps (e.g. activity and fitness trackers, smart bands, smart shoes, and smart insoles).
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This document has the status of a horizontal publication in accordance with IEC Guide 108.
The IEC 61360-7 data dictionary is published in IEC CDD and is available at https://cdd.iec.ch.

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Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

Corrigendum 1 - Composants électriques - Fiabilité - Conditions de référence pour les taux de défaillance et modèles de contraintes pour la conversion

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IEC 61709:2017/COR1:2019 - Corrigendum 1 - Electric components - Reliability - Reference conditions for failure rates and stress models for conversion Released:10/10/2019

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