IEC 60747-16-4:2004+AMD1:2009 CSV

IEC 60747-16-4
®

Edition 1.1 2011-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

IEC 60747-16-4:2004+A1:2009

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IEC 60747-16-4
®

Edition 1.1 2011-04

INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-4: Microwave integrated circuits – Switches

Dispositifs à semiconducteurs –
Partie 16-4: Circuits intégrés hyperfréquences – Commutateurs

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX CL
ICS 31.080.99 ISBN 978-2-88912-773-3

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – 60747-16-4  IEC:2004+A1:2009
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 6
4 Essential ratings and characteristics . 7
4.1 Circuit identification and types . 7
4.2 Application description . 8
4.3 Specification of the function . 8
4.4 Limiting values (absolute maximum rating system) . 10
4.5 Operating conditions (within the specified operating temperature range) . 11
4.6 Electrical characteristics . 12
4.7 Mechanical and environmental ratings, characteristics and data . 12
4.8 Additional information . 13
5 Measuring methods . 13
5.1 General . 13
5.2 Insertion loss (L ) . 14
ins
5.3 Isolation (L ) . 16
iso
5.4 Return loss (L ) . 17
ret
5.5 Input power at 1 dB compression (P ) and output power at 1 dB
i(1dB)
compression (P ) . 19
o(1dB)
5.6 Turn-on time (t ), turn-off time (t ), rise time (t ), and fall time (t ) . 20
on off r(out) f(out)
5.7 Adjacent channel power ratio (P /P ) . 22
o(mod) adj
5.8 nth order harmonic distortion ratio (P /P ) (P /P ) . 26
nth 1 1 nth

Bibliography . 28

Figure 1 – Circuit diagram for the measurement of the insertion loss L . 14
ins
Figure 2 – Circuit diagram for the measurement of the isolation L . 16
iso
Figure 3 – Circuit for the measurements of the return loss . 17
Figure 4 – Circuit for the measurements of switching time . 20
Figure 5 – Input and output waveforms . 21
Figure 6 – Circuit for the measurement of the adjacent channel power ratio . 23
Figure 7 – Circuit diagram for the n-th order harmonic distortion ratio . 26

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60747-16-4  IEC:2004+A1:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –

Part 16-4: Microwave integrated circuits –
Switches



FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

This consolidated version of IEC 60747-16-4 consists of the first edition (2004)
[documents 47E/256/FDIS and 47E/261/RVD] and its amendment 1 (2009) [documents
47E/358/CDV and 47E/373/RVC]. It bears the edition number 1.1.
The technical content is therefore identical to the base edition and its amendment and
has been prepared for user convenience. A vertical line in the margin shows where the
base publication has been modified by amendment 1. Additions and deletions are
displayed in red, with deletions being struck through.

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– 4 – 60747-16-4  IEC:2004+A1:2009
International Standard IEC 60747-16-4 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The French version of this standard has not been voted upon.
This bilingual consolidated version (2011-11) replaces the English version.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

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60747-16-4  IEC:2004+A1:2009 – 5 –
SEMICONDUCTOR DEVICES –

Part 16-4: Microwave integrated circuits –
Switches



1 Scope
This part of IEC 60747 provides new measuring methods, terminology and letter symbols, as
well as essential ratings and characteristics for integrated circuit microwave switches.
There are many combinations for RF ports in switches, such as SPST (single pole single
throw), SPDT (single pole double throw), SP3T (single pole triple throw), DPDT (double pole
double throw), etc. Switches in this standard are based on SPDT. However, this standard is
applicable to the other types of switches.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60617-12, Graphical symbols for diagrams – Part 12: Binary logic elements
IEC 60617-13, Graphical symbols for diagrams – Part 13: Analogue elements
IEC 60617, Graphical symbols for diagrams
IEC 60747-1(1983), Semiconductor devices – Discrete devices and integrated circuits –
Part 1: General
Amendment 3 (1996)
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-4, Semiconductor devices – Discrete devices – Part 4: Microwave devices
IEC 60747-16-1:2001, Semiconductor devices – Part 16-1: Microwave integrated circuits –
Amplifiers
1
Amendment 1 (2007)
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60748-3, Semiconductor devices – Integrated circuits – Part 3: Analogue integrated
circuits
IEC 60748-4, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
IEC 61340-5-1:2007, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements
IEC/TR 61340-5-2:2007, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guide
___________
1
There exists a consolidated edition 1.1 published in 2007, including the base publication (2001) and its
Amendment 1 (2007).

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– 6 – 60747-16-4  IEC:2004+A1:2009
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
Terms related to electrical characteristics
3.1
insertion loss
L
ins
ratio of the out input power to the output power at the switched on port, to the input power in
the linear region of the power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, ∆P (dBm) = ∆P (dBm).
o i
NOTE 2 Usually the insertion loss is expressed in decibels.
3.2
isolation
L
iso
ratio of the out input power to the output power at the switched off port, to the input power in
the linear region of the power transfer curve P (dBm) = f(P )
o i
NOTE 1 In this region, ∆P (dBm) = ∆P (dBm).
o i
NOTE 2 Usually the isolation is expressed in decibels.
3.3
return loss
L
ret
ratio of the incident power P at the specified port to the reflected power P at the same
inc ref
port in the linear region of the power transfer curve P (dBm) = f(P )
ref inc
NOTE 1 In this region, ∆P (dBm) = ∆P (dBm).
ref inc
NOTE 2 Usually the return loss is expressed in decibels.
3.4
input power at 1 dB compression
P
i(1 dB)
input power where the insertion loss increases by 1 dB compared with insertion loss in linear
region
3.5
output power at 1 dB compression
P
o(1dB)
output power where the insertion loss increases by 1 dB compared with insertion loss in linear
region
3.6
turn on time
t
on
interval between the lower reference point on the leading edge of the control voltage and the
upper reference point on the leading edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, ∆P (dBm) = ∆P (dBm).
o i
3.7
turn off time
t
off
interval between the upper reference point on the trailing edge of the control voltage and the
lower reference point on the trailing edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, ∆P (dBm) = ∆P (dBm).
o i

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60747-16-4  IEC:2004+A1:2009 – 7 –
3.8
rise time
t
r(out)
interval between the lower reference point on the leading edge of the output voltage and the
upper reference point on the leading edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, ∆P (dBm) = ∆P (dBm).
o i
3.9
fall time
t
f(out)
interval between the upper reference point on the trailing edge of the output voltage and the
lower reference point on the trailing edge of the envelope of the output voltage in the linear
region of the power transfer curve P (dBm) = f(P )
o i
NOTE In this region, ∆P (dBm) = ∆P (dBm).
o i
3.10
adjacent channel power ratio
P /P
o(mod) adj
ratio of the total power in the specified carrier signal frequency band to total output power in
the specified frequency band away from the specified carrier signal frequency, at the specified
output power when the modulation signal is supplied
3.11
n-th order harmonic distortion ratio
P /P
nth 1
See 3.14 of IEC 60747-16-1(2001).
nth order harmonic distortion ratio
P /P
1 nth
See 3.14 of Amendment 1 of IEC 60747-16-1:2007.
4 Essential ratings and characteristics
This clause gives ratings and characteristics required for specifying integrated circuit micro-
wave switches.
4.1 Circuit identification and types
4.1.1 Designation and types
Identification of type (device name), category of circuit and technology applied should be
given. Microwave switches comprise one category.
4.1.2 General function description
A general description of the function performed by the integrated circuit microwave switches
and the features for the application should be made.
4.1.3 Manufacturing technology
The manufacturing technology, e.g. semiconductor monolithic integrated circuit, thin film
integrated circuit, micro-assembly, etc. should be stated. This statement should include
details of the semiconductor technologies such as Schottky-barrier diode, PIN diode, MESFET,
Si bipolar transistor, etc.
IEC 60747-4 should be referred to for terminology and letter symbols, essential ratings and
characteristics and measuring methods of such microwave devices.

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– 8 – 60747-16-4  IEC:2004+A1:2009
4.1.4 Package identification
The following statements should be made:
a) chip or packaged form;
b) IEC and/or national reference number of the outline drawing, of or drawing of non-
standard package including terminal numbering;
c) principal package material, for example, metal, ceramic, plastic.
4.1.5 Main application
The main application should be stated. If the device has restrictive applications, these should
be stated here.
4.2 Application description
Information on application of the integrated circuit and its relation to the associated devices
should be given.
4.2.1 Conformance to system and/or interface information
It should be stated whether the integrated circuit conforms to an application system and/or an
interface standard or a recommendation.
Detailed information concerning application systems, equipment and circuits such as VSAT
systems, DBS receivers, microwave landing systems, etc. should also be given.
4.2.2 Overall block diagram
A block diagram of the applied systems should be given if necessary.
4.2.3 Reference data
The most important properties that permit comparison between derivative types should be
given.
4.2.4 Electrical compatibility
It should be stated whether the integrated circuit is electrically compatible with other particular
integrated circuits, or families of integrated circuits, or whether special interfaces are required.
Details should be given concerning the type of input and output circuits, e.g. input/output
impedances, d.c. block, open-drain, etc. Interchangeability with other devices, if any, should
also be given.
4.2.5 Associated devices
If applicable, the following should be stated:
– devices necessary for correct operation (list with type number, name and function);
– peripheral devices with direct interfacing (list with type number, name and function).
4.3 Specification of the function
4.3.1 Detailed block diagram – Functional blocks
A detail block diagram or equivalent circuit information of the integrated circuit microwave
switches should be given. The block diagram should be composed of the following:

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60747-16-4  IEC:2004+A1:2009 – 9 –
a) functional blocks;
b) mutual interconnections among the functional blocks;
c) individual functional units within the functional blocks;
d) mutual interconnections among the individual functional blocks;
e) function of each external connection;
f) inter-dependence between the separate functional blocks.
The block diagram should identify the function of each external connection and, where no
ambiguity can arise, also show the terminal symbols and/or numbers. If the encapsulation has
metallic parts, any connection to them from external terminals should be indicated. The
connections with any associated external electrical elements should be stated, where
necessary.
As additional information, the complete electrical circuit diagram can be reproduced, but not
necessarily with indications of the values of the circuit components. The graphical symbol for
the function shall be given. Rules governing such diagrams may be obtained from IEC 60617-12
or IEC 60617-13.
4.3.2 Identification and function of terminals
All terminals should be identified on the block diagram (supply terminals, input or output
terminals, input/output terminals).
The terminal functions 1) to 4) should be indicated in a table as follows:
Function of terminal
Terminal Terminal 1) Terminal
2) Function
3) Input/output 4) Type of input/
number symbol designation
identification output circuits


1) Terminal designation
A terminal designation to indicate the function of the terminal should be given. Supply
terminals, ground terminals, blank terminals (with abbreviation NC), non-usable terminals
(with abbreviation NU) should be distinguished.
2) Function
A brief indication of the terminal function should be given:
– each function of multi-role terminals, i.e. terminals having multiple functions;
– each function of integrated circuit selected by mutual pin connections, programming
and/or application of function selection data to the function selection pin, such as
mode selection pin.
3) Input/output identification
Input, output, input/output and multiplex input/output terminals should be distinguished.
4) Type of input/output circuits
The type of input and output circuit, e.g. input/output impedances, with or without d.c.
block, etc., should be distinguished.
5) Type of ground
If the baseplate of the package is used as ground, this should be stated.

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– 10 – 60747-16-4  IEC:2004+A1:2009
Example:
Bias supply voltage(s) Control supply voltage(s)

Input(s) Integrated NC
circuit
microwave
NU Output(s)
switch
Ground

4.3.3 Function description
The function performed by the circuit should be specified, including the following information:
– basic function;
– relation to external terminals;
– operation mode (e.g., set-up method, preference, etc.);
– interrupt handling.
4.3.4 Family related characteristics
In this part, all the family specific functional descriptions shall be stated (referred to
IEC 60748-2, IEC 60748-3 and IEC 60748-4).
If ratings and characteristics, as well as function characteristics exist for the family, the
relevant part of IEC 60748 should be used (e.g. for microprocessors, see IEC 60748-2,
Chapter III, Section Three).
NOTE For each new device family, specific items should be added the relevant part of IEC 60748.
4.4 Limiting values (absolute maximum rating system)
The table for these values should contain the following:
– Any interdependence of limiting conditions shall be specified.
– If externally connected and/or attached elements, for example heatsinks, have an
influence on the values of the ratings, the ratings shall be prescribed for the integrated
circuit with the elements connected and/or attached.
– If limiting values are exceeded for transient overload, the permissible excess and their
durations shall be specified.
– Where minimum and maximum values differ during programming of the device, this should
be stated.
– All voltages are referenced to a specified reference terminal (V , ground, etc.).
ss
– In satisfying the following clauses, if maximum and/or minimum values are quoted, the
manufacturer shall indicate whether he refers to the absolute magnitude or to the
algebraic value of the quantity.
– The ratings given shall cover the operation of the multi-function integrated circuit over the
specified range of operating temperatures. Where such ratings are temperature-dependent,
these dependence should be indicated.

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60747-16-4  IEC:2004+A1:2009 – 11 –
4.4.1 Electrical limiting values
Limiting values should be specified as follows:
Subclause Parameters Min. Max.
4.4.1.1 Bias supply voltage(s) (where appropriate) +
4.4.1.2 Bias supply current(s) (where appropriate) +
4.4.1.3 Control supply voltage(s) (where appropriate) +
4.4.1.4 Control supply current(s) (where appropriate) +
4.4.1.5 Terminal voltage(s) (where appropriate) + +
4.4.1.6 Terminal current(s) (where appropriate) +
4.4.1.7 Input power +
4.4.1.8 Power dissipation +
NOTE It is necessary to select either 4.4.1.1 or 4.4.1.2, either 4.4.1.3 or 4.4.1.4, and either
4.4.1.5 or 4.4.1.6.

The detail specification may indicate those values within the table including notes 1 and 2.
Parameters (Note 1, Note 2) Symbols Min. Max. Unit

NOTE 1 Where appropriate, in accordance with the type of circuit considered.
NOTE 2 For power supply voltage range:
– limiting value(s) of the continuous voltage(s) at the supply terminal(s) with respect to a special electrical
reference point;
– where appropriate, limiting value between specified supply terminals;
– when more than one voltage supply is required, a statement should be made as to whether the sequence in
which these supplies are applied is significant: if so, the sequence should be stated;
– when more than one supply is needed, it may be necessary to state the combinations of ratings for these supply
voltages and currents.

4.4.2 Temperatures
a) Operating temperature (ambient or reference-point temperature)
b) Ambient or case temperature
c b) Storage temperature
d c) Channel temperature
e d) Lead temperature (for soldering).
The detail specification may indicate those values within the table including the note.
Parameters (Note) Symbols Min. Max. Unit

NOTE Where appropriate, in accordance with the type of circuit considered.

4.5 Operating conditions (within the specified operating temperature range)
They are not to be inspected, but may be used for quality assessment purposes.

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