IEC TS 62564-1:2009

IEC/TS 62564-1
®
Edition 1.0 2009-05
TECHNICAL
SPECIFICATION

Aerospace qualified electronic component (AQEC) –
Part 1: Microcircuits


IEC/TS 62564-1:2009(E)

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IEC/TS 62564-1
®
Edition 1.0 2009-05
TECHNICAL
SPECIFICATION

Aerospace qualified electronic component (AQEC) –
Part 1: Microcircuits


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-88910-765-0
® Registered trademark of the International Electrotechnical Commission

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– 2 – TS 62564-1 © IEC:2009(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references .6
3 Terms, definitions and abbreviations .7
3.1 Terms and definitions .7
3.2 Abbreviations .8
4 Technical requirements .9
4.1 AQEC plan .9
4.2 AQEC documentation .10
4.2.1 General .10
4.2.2 AQEC data sheet.10
4.2.3 Material content.10
4.2.4 AQEC visibility.10
4.2.5 AQEC life expectancy .10
4.2.6 Device technology .11
4.2.7 SEE data .11
4.2.8 Termination finish .11
4.2.9 Third party part numbers .11
4.3 AQEC performance .11
4.3.1 Performance.11
4.3.2 Functional parameters .12
4.3.3 Known limitations .12
4.4 Quality system certification.12
4.5 Component qualification and re-qualification .13
4.6 AQEC quality assurance and reliability monitoring.13
4.7 Product Change Notification (PCN) .13
4.8 Last Time Buy (LTB) notification.13
4.9 Obsolescence management .14
4.10 Counterfeit prevention .14
4.11 User or customer guide .14
Annex A (informative) AQEC material content and construction table.15
Annex B (informative) Additional desired data.17
Bibliography.19

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TS 62564-1 © IEC:2009(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) –

Part 1: Microcircuits


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• The required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• The subject is still under technical development or where, for any other reason, there is
the future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62564-1, which is a technical specification, has been prepared by IEC Technical
Committee 107: Process management for avionics.

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– 4 – TS 62564-1 © IEC:2009(E)
The GEIA-STD-0002-001 (June 2006), Aerospace Qualified Electronic Component (AQEC)
Requirements, Volume 1 – Integrated Circuits and Semiconductors, has served as a basis for
the elaboration of this technical specification.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/91/DTS 107/100A/RVC

Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 62564 series can be found, under the general title Aerospace
Qualified Electronic Component (AQEC), on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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TS 62564-1 © IEC:2009(E) – 5 –
INTRODUCTION
Aerospace Qualified Electronic Component (AQEC) plans are developed by manufacturers in
order to document compliance with AQEC requirements. For AQEC designated components,
the intention is to:
a) provide AQEC users access to information from the AQEC manufacturers that is
necessary for using commercial-off-the-shelf (COTS) products;
b) better enable AQEC users to assess whether these parts are capable of operating reliably
in their applications;
c) minimize deviations from the AQEC manufacturers’ COTS products;
d) have minimal impact on the AQEC manufacturers’ standard operating or business
procedures;
e) promote communication between the AQEC manufacturers and users.

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– 6 – TS 62564-1 © IEC:2009(E)
AEROSPACE QUALIFIED ELECTRONIC COMPONENT (AQEC) –

Part 1: Microcircuits



1 Scope
This Technical Specification defines the minimum requirements for integrated circuits and
semiconductors which are to be designated an “Aerospace Qualified Electronic Component
(AQEC)”. It applies to integrated circuits and semiconductors exhibiting the following
attributes:
a) a minimum set of requirements, or information provided by the part manufacturer, which
will allow a standard COTS component to be designated AQEC by the manufacturer;
b) as a minimum, each COTS component (designated AQEC) will have been designed,
fabricated, assembled, and tested in accordance with the component manufacturer’s
requirements for standard data book components;
c) qualification of, and quality systems for, the COTS components to be designated as AQEC
shall include the manufacturer’s standards, operating procedures, and technical
specifications. This information shall be available when requested;
d) components manufactured before the manufacturer has addressed AQEC requirements,
but utilizing the same processes, are also considered AQEC compliant;
e) additional desired attributes of a device designated AQEC (that will support AQEC users)
are found in Annex B of this standard.
NOTE 1 Parts qualified to military specifications (except those identified as being for “logistic support” purposes
only) are considered AQEC; the remainder of this standard only addresses non-military specification parts.
NOTE 2 Parts qualified to AEC-Q100-Revision G, grade 0 through to grade 3 are considered AQEC. For those
applications where a 0 °C to +70 °C temperature range is appropriate, grade 4 is also considered to be AQEC. The
user shall document that the grade category used is compatible with the application in accordance with their
IEC/TS 62239 ECMP.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC/TS 62239, Process management for avionics – Preparation of an electronic components
management plan
IEC/TS 62396-1, Process management for avionics – Atmospheric radiation effects – Part 1:
Accommodation of atmospheric radiation effects via single event effects within avionics
electronic equipment
ISO/TS 16949, Quality management systems – Particular requirements for the application of
ISO 9001:2000 for automotive production and relevant service part organizations
ISO 9001:2008, Quality management systems – Requirements
AEC-Q100, Revision G, Failure Mechanism based stress test qualification for integrated
circuits
AS9100, Quality management systems – Aerospace – Requirements

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TS 62564-1 © IEC:2009(E) – 7 –
JESD47, Stress test driven qualification of integrated circuits
JESD48, Product discontinuance
JESD97, Marking, symbols and labels for identification of lead (Pb) free assemblies,
components and devices
IPC-1066, Marking symbols and labels for identification of lead-free and other reportable
materials in lead-free assemblies, components and devices
JEDEC JIG101, Materials composition declaration for electronic products
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
3.1 Terms and definitions
3.1.1
AQEC specification
document prepared by or for the manufacturer to describe an AQEC product
NOTE It includes a data sheet and may include other documents, such as material descriptions, environmental
test procedures, quality monitoring processes, etc. It may be a stand-alone document or a clearly denoted item
within a larger documentation system. There may be additional data associated with specific applications which
must be requested separately.
3.1.2
AQEC plan
instrument prepared by the plan owner (see 3.1.8) that clearly, concisely, and unambiguously
documents the processes used by the plan owner to satisfy the requirements of this technical
specification
NOTE The plan contains auditable content.
3.1.3
assessment
evaluation of a plan owner’s AQEC plan to determine if it is compliant with this technical
specification
NOTE It may be conducted by IECQ, the customer, the customer’s designee, or by a third party designated by the
customer community.
3.1.4
component
microcircuit
part
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design use
3.1.5
customer
user
original equipment manufacturer (OEM) who procures integrated circuits and/or
semiconductor devices compliant to this technical specification and uses them to design,
produce, and maintain systems

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– 8 – TS 62564-1 © IEC:2009(E)
3.1.6
customer community
body of customers that may act together to address issues related to this technical
specification
3.1.7
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.8
manufacturer
plan owner
producer of integrated circuits, microcircuits, or other semiconductor devices that may be
designated AQEC
NOTE A manufacturer may produce the components directly or may oversee subcontracted manufacturing
according to their own processes. The manufacturer is also the plan owner.
3.1.9
supplier
distributor of components
NOTE A plan for controlling AQEC inventory shall be in place in order to supply AQECs. A manufacturer can be a
supplier in the case that no distributor is involved.
3.1.10
third party
party designated to act on the behalf of the customer community
3.1.11
termination
element of a component that connects it electrically and mechanically to the next level of
assembly
NOTE A termination includes base materials and coatings (including underplates).
3.1.12
form
shape, arrangement of parts, visible aspect, mode in which a part exists or manifests itself,
the material an item is constructed from
3.1.13
fit
qualified and competent; correct size and shale
3.1.14
function
work to a specification that an item is designed to without degrading reliability
3.2 Abbreviations
AQEC  Aerospace qualified electronic component
BPSG  Borophosphosilicate glass
COTS  Commercial off the shelf
CMOS  Complementary metal oxide semiconductor

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TS 62564-1 © IEC:2009(E) – 9 –
DSCC  Defence supply centre Columbus (see http://www.dscc.dla.mil/)
ECMP  Electronic component management plan
FFF  Form, fit and function
FIT  Failures in time
GIDEP Government industry data exchange program
HAST  Highly accelerated stress test
HCI  Hot carrier injection
HTOL  High temperature operating life
LTB  Last time buy
NBTI  Negative bias temperature Instability
PCN  Product change notice
SEE  Single event effect
SEU  Single event upset
SER  Soft error rate
SEL  Single event latch
SEFI  Single event functional int
...