IEC 61240:2012

IEC 61240 ®
Edition 2.0 2012-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Piezoelectric devices –
Preparation of outline drawings of surface-mounted devices (SMD) for frequency
control and selection – General rules

Dispositifs piézoélectriques –
Préparation des dessins d'encombrement des dispositifs à montage en surface
pour la commande et le choix de la fréquence – Règles générales
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IEC 61240 ®
Edition 2.0 2012-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Piezoelectric devices –
Preparation of outline drawings of surface-mounted devices (SMD) for frequency

control and selection – General rules

Dispositifs piézoélectriques –

Préparation des dessins d'encombrement des dispositifs à montage en surface

pour la commande et le choix de la fréquence – Règles générales

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.140 ISBN 978-2-83220-291-3

– 2 – 61240 © IEC:2012
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Classification of SMD . 6
4 Title of the outline drawing . 7
5 Composition of the outline drawing . 7
5.1 Elements of outline drawings . 7
5.2 Outline drawing . 7
5.3 Table of detailed dimensions . 7
5.4 Actual size sketch . 7
5.5 Drawing of terminal land areas . 7
5.6 Terminal lead details . 7
6 Requirements for terminal leads . 9
7 Requirements for the terminal land area . 9
8 Connections of terminal leads . 9
9 Descriptive notes . 10
10 References . 10
Annex A (informative) Miniaturized leadless ceramic enclosures of piezoelectric
devices (SMD) for frequency control and selection . 14
Annex B (informative) Example of terminal connections for surface-mounted
piezoelectric devices (SMD) for frequency control and selection . 18

Figure 1 – Illustration of terminal projection zone . 8
Figure 2 – Example of a terminal land area . 9
Figure A.1 – Upper part of the view from above . 14
Figure A.2 – Front view (without a board) . 15
Figure A.3 – Front view (with a board) . 15

Table A.1 – Scale of drawings . 14
Table A.2 – Guideline of dimension table . 15
Table A.3 – Guideline for column “Max.” of Table A.2 for A, B . 16
Table A.4 – Examples of correspondence between new and old enclosures . 17
Table B.1 – Examples of terminal connections for various types of piezoelectric
devices . 18

61240 © IEC:2012 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PIEZOELECTRIC DEVICES –
Preparation of outline drawings of surface-mounted
devices (SMD) for frequency control and selection –
General rules
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in
addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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6) All users should ensure that they have the latest edition of this publication.
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arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
lnternational Standard IEC 61240 has been prepared by lEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control,
selection and detection.
This second edition cancels and replaces the first edition published in 1994. It constitutes a
technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
– outline drawings have been changed from three views (top, front and bottom) to that based
on ISO layout in the third-angle projection, in which the view from the right has been added
to the top, front and bottom views;
– reference line and geometrical dimensions of the package for enclosures have been
changed for practical use;
– information on miniaturized leadless ceramic enclosures of piezoelectric devices (SMD) for
frequency control and selection has been included in an annex.

– 4 – 61240 © IEC:2012
The text of this standard is based on the following documents:
FDIS Report on voting
49/995/FDIS 49/1000/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
61240 © IEC:2012 – 5 –
INTRODUCTION
The enclosures of quartz crystal resonators and oscillators are unified in this second edition of
IEC 61240 “Preparation of outline drawings of surface-mounted devices (SMD) for frequency
control and selection – General rules”.
Regarding the current situation of many quartz crystal device suppliers, many suppliers use their
own enclosure layouts in their catalogues. For the convenience of consumers, general rules of
enclosure layout and definition of size need to be unified.
In the previous edition of IEC 61240, layout rules of outline drawings of SMD devices were
based on IEC 60191-6 and applied to semi-conductive devices. However, there are several
specific rules for quartz devices. In this edition, the general rules for outline drawings of SMD
enclosures for quartz crystal devices are included, taking account of the ISO layout rules (ISO
1101, ISO 5456-2, and ISO 128-30).
The newly proposed general rules of outline drawings for three types of surface-mounted
devices are shown in sheets included as examples. The difference from the previous version of
outline drawings is that one set of drawings consists of four views, which are the view from
above, the front view, the view from the right, and the view from below.
Furthermore, the definition of the drawings has been changed. Firstly, ceramic enclosure is
specifically defined. Secondly, the reference line of the package is defined as shown in the
sheets. Thirdly, geometrical dimensions of the package have been further simplified compared
to the previous edition. These corrections are shown in Annexes A and B of this standard.
Detailed information concerning the new outline drawings will be provided in a future
publication.
– 6 – 61240 © IEC:2012
PIEZOELECTRIC DEVICES –
Preparation of outline drawings of surface-mounted
devices (SMD) for frequency control and selection –
General rules
1 Scope
This International Standard sets out general rules for drawing all dimensional and geometrical
characteristics of a surface-mounted piezoelectric device package (referred to in this standard
as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs
for frequency control and selection.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
IEC 60191-6:2009 Mechanical standardization of semiconductor devices – Part 6: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages
ISO 1101:2004, Geometrical Product Specifications (GPS) – Geometrical tolerancing –
Tolerances of form, orientation, location and run-out
ISO 5456-2:1996, Technical drawings – Projection methods – Part 2: Orthographic
representations
ISO 128-30:2001, Technical drawings – General principles of presentation – Part 30: Basic
conventions for views
3 Classification of SMD
The SMD piezoelectric devices are classified into three types of packages depending on the
structure of the terminal leads.
a) Leaded type: the folded ends of the terminal leads are turned away from the body.
NOTE 1 The package of the pin lead type is compatible with the socket. This is defined in the description of the
leaded type.
b) Folded-leads type: the folded ends of the terminal lead are turned towards the body.
NOTE 2 The supporter with a board is defined in the description of this Folded lead type.
c) Leadless type: terminal pads only are present on the body instead of terminal leads.
A proper combination of these options should be selected.

61240 © IEC:2012 – 7 –
4 Title of the outline drawing
The title of the outline drawing shall imply the main package material (e.g. metal, plastic, glass,
ceramic), the sealing procedure, number of terminals and the type of SMD, as shown in
Examples 1, 2 and 3 .
5 Composition of the outline drawing
5.1 Elements of outline drawings
The outline drawing of an SMD shall be composed of five elements which are drawings from
four views in the third-angle projection, table of detailed dimensions, actual size sketch,
drawing of terminal land areas and terminal lead details. These sample formats are shown in
Examples 1, 2 and 3.
5.2 Outline drawing
The outline drawing with dimensional symbols shall be executed in the third-angle projection.
Basically, one set of outline drawings consists of the view from above, the front view, the view
from the right, and the view from below. In square type enclosure and cylindrical type enclosure,
the view from the right can be omitted.
5.3 Table of detailed dimensions
The dimensions shall be given in millimetres and are required only where the letter x is shown
in the table.
5.4 Actual size sketch
The actual size sketch means a drawing of the view from above with the real size outer
dimensions.
5.5 Drawing of terminal land areas
The drawing of terminal land areas which is defined in Clause 7 shall be adapted to the
connecting terminal leads on the printed circuit boards, alumina substrates, etc.
5.6 Terminal lead details
The terminal lead details shall be shown in accordance with IEC 60191-6 (see Figure 1).

___________
Examples 1, 2 and 3 refer to the sheets provided after Clause 10 of this standard.

– 8 – 61240 © IEC:2012
Key for Figure 1 and examples 1 to 3
IEC  1537/12
Figure 1 – Illustration of terminal projection zone

61240 © IEC:2012 – 9 –
6 Requirements for terminal leads
6.1 The dimensions of terminal lead spacing shall be shown by the centre position of the
terminal leads and its basic value e is 2,54 × n mm (n is an integer) and 1,27 × n mm for
package dimensions smaller than 6 mm.
6.2 In the view from above of SMD, the lower lead from the left end shall be designated as
terminal lead number 1. The subsequent lead numbers shall be designated as 2 to n, with the
terminals following counter-clockwise.
6.3 Terminal lead number 1 shall be indicated by a corner notch or by a dotted expression on
the top side. If there is a requirement to indicate terminal number 1 on bottom side, the land
area of terminal number 1 can be designed in different size from others.
y
S
6.4 means in this drawing that the distance from the seating plane to the
nearest point of each terminal shall not exceed y mm.
7 Requirements for the terminal land area
7.1 The positioning of land areas shall be adapted to the positions of the terminal leads.
The dimensions of the terminal land areas shall be specified with respect to the central line of
the contacts of the SMD device.
7.2 The dimensions of terminal land areas shall be indicated as the maximum area which shall
be added to the projection zone of the terminals for the parts to be connected to a printed
circuit board and to its positional tolerances.
IEC  1538/12
Figure 2 – Example of a terminal land area
8 Connections of terminal leads
The functions of the connections of terminal leads should not be defined on the outline drawing,
but if necessary they may be indicated as shown in Annex B.
___________
See Figure 2.
– 10 – 61240 © IEC:2012
9 Descriptive notes
Descriptive notes may be used at the bottom of, or adjacent to the outline drawing if necessary.
10 References
The references to IEC 60191-6, ISO 1101, ISO 5456-2, and ISO 128-30 shall be given.

K2
61240 © IEC:2012 – 11 –
Outline drawing
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A – – x
B – – x
G – – x
G1 – – x
K1 x – x
K2 x – x
F x – x
LB x – x
e – x –
e1 – x –
b2 – – x
l2 – – x
y – – x
A3 – x (*) –
bp x – x
Lp x – x
ө x – x Deg.
b2
1 2
e
Terminal land areas
P A3
Lp
v M P S
w
M P S
Example 1a
CEI-IEC 418/94
IEC  1539/12
Glass or ceramic, solder-glass sealed four-leaded SMD Scale

outline, type- (example 1) 3: 1
Sheet - number
bp
l2
e1
– 12 – 61240 © IEC:2012
Outline drawing
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A – – x
B – – x
G – – x
G1 – – x
K1 x – x
K2 x – x
F x – x
L x – x
B
e – x –
e1 – x –
b2 – – x
l2 – – x
y – – x
A3 – x (*) –
bp x – x
Lp x – x
b2
4 3
e
K2
A3
Lp
S
w S
Example 2a
CEI-IEC 419/94
IEC  1540/12
Glass or ceramic, solder-glass sealed four-folded Scale

lead SMD outline, type- (example 2) 3: 1
Sheet - number
bp
l2
e1
61240 © IEC:2012 – 13 –
Outline drawing
Dimensions (mm)
Ref. Notes
Min. Nom. Max.
A – – x
B – – x
– – x
G1 – – x
K1 x – x
L x – x
B
e – x –
e1 – x –
e2 – x –
b2 – – x
l2 – – x
y – – x
IEC  1541/12
Glass or ceramic, solder-glass sealed 10 leadless SMD Scale

outline, type- (example 3) 3: 1
Sheet - number
– 14 – 61240 © IEC:2012
Annex A
(informative)
Miniaturized leadless ceramic enclosures of piezoelectric
devices (SMD) for frequency control and selection

A.1 Precise drawing
For miniaturized packages, a precise drawing is virtually meaningless. For this reason, the
following measures are taken.
a) Basically, a detailed structure is decided by mutual agreement between the maker and user.
This standard shows a simplified general drawing. Examples of standard drawing of outer
dimensions are shown in Figures A.1 and A.2 below.
b) As for the drawing of outer dimensions, basically, the view from above, the front view, the
view from the right, and the view from below should be described in the order of the upper,
middle1, middle2 and bottom part in the same scale. Alphabetical characters should be used
for the symbols of dimensions in the drawing.
c) Drawings of the same size should be described in the same scale. Basically, the scale
should be decided based on the following criteria. (Table A.1)
Table A.1 – Scale of drawings
Nominal value of A Scale
10 mm = < Nominal 3:1
5 mm = < Nominal < 10 mm 5:1
Nominal < 5 mm 10:1
d) Basically, the drawing should be in the horizontal orientation. As for square products, the
sides having greater number of terminals should be described in the horizontal orientation.
e) As for the upper part of the view from above, the corner of the cap should be at the right
angle, and there should be a notch on the corner of the main body. The distance between the
cap and the main body or the notch should be 1,5 mm on the actual drawing, regardless of
the scale. (Figure A.1)
1,5 mm
1,5 mm
IEC  1542/12
Figure A.1 – Upper part of the view from above

61240 © IEC:2012 – 15 –
f) The thickness of the cap in the front view on the actual drawing should be 1,0 mm regardless
of the scale. The height of the shaded part of the side electrode should be 1/3 G. (Figure A.2)
1,0 mm
G
1/3 G
IEC  1543/12
Figure A.2 – Front view (without a board)

g) As for enclosures with a board, the dimension of the board on the actual drawing should be
2,0 mm, regardless of the scale. (Figure A.3)
2,0 mm
IEC  1544/12
Figure A.3 – Front view (with a board)

h) In the dimension table, only the column with “X” should be filled in, while the columns with
“-“ should not be filled in. Dimension values corresponding to the symbols should be in
millimetres. (Table A.2)
Table A.2 – Guideline of dimension table
Dimension (mm)
Ref. Notes
Min. Nom. Max.
A － (X) X
B － (X) X
G － － X
K X － X
L X － X
B
e X
－ －
e X
－ －
e － X －
y － － X
i) Suffix should be consecutive numbers starting from 1. Suffix should not be attached to the
symbols consisting of only one character except “e”.
j) Values in the “nominal” column of A, B should be the nominal dimension of the enclosure.
Values should be rounded off to the first decimal place, and put in ( ). The maximum column
of A and B should be filled in as follows. (Table A.3)

– 16 – 61240 © IEC:2012
Table A.3 – Guideline for column “Max.” of Table A.2 for A, B
Nominal value of A Maximum value of A, B
4 mm < Nominal Nominal Value + 0,10
4 mm = < Nominal < 7 mm Nominal Value + 0,20
Nominal = < 7 mm Nominal Value + 0,30

k) As for the dimension of G, only the standard minimum dimension should be filled in. A
change of the maximum value may be necessary for oscillators etc. due to structural
reasons.
l) As for the definition of the symbols of K and L , K represents the width, and L represents
B B
the depth. (As for the electrode on the corner, K < L . The dimension of the electrode should
B
be measured from the side.)
As for the allowance of K and L , the maximum and minimum dimensions are calculated by
B
doubling the positive allowance of A and B specified in Table A.3.
NOTE The sum of centre values of K and L having the same vector as the distance between terminals (e, e , e ,
B 1 2
・・) is equal to the nominal value of A and B.
m) The distance between terminals (e, e , e ,・・) should be the distance from the centre of one
1 2
terminal to another.
n) The actual size sketch should be shown in a small box at the upper left corner of the sheet
as in Examples 1-3.
o) In square type enclosure, the view from the right can be omitted.
p) In cylindrical type enclosure, the view from the right can be omitted.
A.2 Requirements for enclosures with 3 terminals
As for the arrangement of terminals, it is preferable to meet the following conditions.
a) The dimension between two adjacent terminals should be the distance from the centre of
one terminal to another. The standard value “e” should be multiples of 2,54 mm. If the length
of one side is less than 6 mm, it should be multiples of 1,27 mm.
b) As for the terminal number, when the SMD is looked down on from above, the terminal at the
bottom left should be numbered as No.1. The other terminals are numbered in order counter
clockwise.
c) The terminal No.1 should be identified by the dot mark on the surface, or the notch on the
terminals. In some cases, the length of other terminals is changed for identification.
d) y S means that the distance from the board to each terminal is not longer than y millimetres.
A.3 Naming rule for new type of enclosures
The designation of SMD defined in miniaturized leadless ceramic enclosures is as follows.
a) The dimension of the longer side should be indicated first, followed by the dimension of the
shorter side.
b) When the dimension of the longer side and the shorter side has two digits and one digit
respectively: the dimension of the longer side is rounded off to the first integral place to
obtain a two digits integer. The dimension of the shorter side is rounded off to the first
integral place to obtain a single digit integer, and secondly, 0 is put before the number.
c) When the dimension of both the longer side and the shorter side has one digit: The
dimension of both the longer side and the shorter side is rounded off to the first decimal
place, and expressed with one integral number and one decimal number.

61240 © IEC:2012 – 17 –
Table A.4 shows the correspondence between the new and old enclosures.
Table A.4 – Examples of correspondence between new and old enclosures
Old enclosure New enclosure
DCC-6/01 DCC-6/3838
DCC-4/01 DCC-4/1206
QCC-18/01 QCC-18/1809
If an explanation or a descriptive note is necessary for the details of the drawing, it should be
stated as “(Note)”, at the bottom part of the standard drawing of outer dimensions, where
possible.
– 18 – 61240 © IEC:2012
Annex B
(informative)
...