EN 62610-4:2013

SLOVENSKI STANDARD
01-april-2014
Mehanske strukture elektronske opreme - Obravnava toplotnih lastnosti omaric v
skladu s serijama IEC 60297 in IEC 60917 - 4. del: Preskušanje hladilnih
zmogljivosti vodnih toplotnih izmenjevalnikov v elektronskih omaricah
Mechanical structures for electronic equipment - Thermal management for cabinets in
accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for
water supplied heat exchangers in electronic cabinets
Mechanische Bauweisen für elektronische Einrichtungen - Wärmemanagement - Teil 4:
Kühlleistungsprüfungen für Wasser-Wärmetauscher in Elektronikschränken
Structures mécaniques pour équipements électroniques gestion thermique pour les
armoires conformes aux séries CEI 60297 et CEI 60917 - Partie 4: Essais de
performances de refroidissement pour les échangeurs de chaleur alimentés par de l'eau
dans des baies
Ta slovenski standard je istoveten z: EN 62610-4:2013
ICS:
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 62610-4
NORME EUROPÉENNE
November 2013
EUROPÄISCHE NORM
ICS 31.240
English version
Mechanical structures for electronic equipment -
Thermal management for cabinets in accordance with IEC 60297 and IEC
60917 series -
Part 4: Cooling performance tests for water supplied heat exchangers in
electronic cabinets
(IEC 62610-4:2013)
Structures mécaniques pour équipements Mechanische Bauweisen für elektronische
électroniques – Gestion thermique pour Einrichtungen -
les armoires conformes aux séries CEI Wärmemanagement für Schränke nach
60297 et CEI 60917 – Partie 4: Essais de den Reihen IEC 60297 und IEC 60917 -
performances de refroidissement pour les Teil 4: Kühlleistungsprüfungen für
échangeurs de chaleur alimentés par de Wasser-Wärmetauscher in
l'eau dans des baies électroniques Elektronikschränken
(CEI 62610-4:2013) (IEC 62610-4:2013)

This European Standard was approved by CENELEC on 2013-09-19. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62610-4:2013 E
Foreword
The text of document 48D/542/FDIS, future edition 1 of IEC 62610-4, prepared by SC 48D, "Mechanical
structures for electronic equipment", of IEC TC 48, "Electromechanical components and mechanical
structures for electronic equipment" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 62610-4:2013.
The following dates are fixed:
(dop) 2014-06-19
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2016-09-19
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 62610-4:2013 was approved by CENELEC as a European
Standard without any modification.

- 3 - EN 62610-4:2013
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 60297 Series Mechanical structures for electronic EN 60297 Series
equipment - Dimensions of mechanical
structures of the 482,6 mm (19 in) series

IEC 60917 Series Modular order for the development of EN 60917 Series
mechanical structures for electronic
equipment practices
IEC 62610-4 ®
Edition 1.0 2013-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical structures for electronic equipment – Thermal management for

cabinets in accordance with IEC 60297 and IEC 60917 series –

Part 4: Cooling performance tests for water supplied heat exchangers in

electronic cabinets
Structures mécaniques pour équipements électroniques – Gestion thermique

pour les armoires conformes aux séries CEI 60297 et CEI 60917 –

Partie 4: Essais de performances de refroidissement pour les échangeurs de

chaleur alimentés par de l'eau dans des baies électroniques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.240 ISBN 978-2-8322-1037-6

– 2 – 62610-4 © IEC:2013
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope and object . 6
2 Normative references . 6
3 Terms and definitions, symbols and units . 6
3.1 Terms and definitions . 6
3.2 Symbols and units . 7
4 Performance test for the heat exchanger . 8
4.1 General . 8
4.2 Test setup . 9
4.2.1 Test room . 9
4.2.2 Simulating the equipment heat load in the test sample. 9
4.2.3 Chilled-water flow rate and temperatures . 10
4.2.4 Measurement of the air temperature . 10
4.2.5 Temperature difference between chilled water supply and equipment
air inlet temperature . 11
4.3 Assessment of the heat exchanger performance . 11
4.3.1 Determination of the cooling capacity by means of simplified tests . 11
4.3.2 Determination of the cooling capacity by way of an extended test . 12
4.3.3 Complete identification of the cooling capacity. 14
4.4 Electrical power consumption . 16
4.5 Water circuit pressure resistance . 16
Annex A (normative) Test conditions . 17
Annex B (normative) Test results . 18

Figure 1 – Principle of the heat exchanger performance test . 9
Figure 2 – Test setup of simplified tests . 12
Figure 3 – Test setup of extended tests . 14
Figure 4 – Test setup, test for complete identification of the cooling capacity . 15
Figure 5 – Diagram of electrical power consumption versus cooling capacity . 16
Figure 6 – Diagram of water pressure resistance versus water flow rate . 16
Figure B.1 – System cooling capacity and water flow rate . 19

Table B.1 – Test result recording template . 18
Table B.2 – Test for closed air loop air to water heat exchanger for high density
cooling systems for IT equipment and server cooling . 19

62610-4 © IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_____________
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 4: Cooling performance tests for water supplied
heat exchangers in electronic cabinets

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62610-4 has been prepared by subcommittee 48D: Mechanical
structures for electronic equipment, of IEC technical committee 48: Electromechanical
components and mechanical structures for electronic equipment.
The text of this standard is based on the following documents:
FDIS Report on voting
48D/542/FDIS 48D/545/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62610-4 © IEC:2013
A list of all parts of IEC 62610 series, under the general title Mechanical structures for
electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and
IEC 60917 series, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62610-4 © IEC:2013 – 5 –
INTRODUCTION
Electronic cabinets of the IEC 60297 and IEC 60917 series are used for the housing of
electronic devices in many different fields of application. A wide field of application is
represented by installations of communication networks with electronic devices in information
technology (IT) environments. The classic way is to install rows of cabinets into defined foot
print patterns and interconnect them via cables managed from overhead cable trays or raised
floor cable management. So far, cooling has been facilitated by equipping the entire IT room
with air conditioning in order to provide for air flow and air temperatures required for the safe
operation of the electronic devices. With the growing heat load in data centers, this form of
cooling has become more and more inefficient. Thermal problems with respect to high-
performance electronic devices have become more difficult to solve. The environmental
aspect is gaining crucial importance forcing us to cut down on wasting resources and to
reduce CO emissions.
Alternatives to the air conditioning of rooms need to be looked at more closely. Under the
aspect of increasing cooling efficiency, there are some major concepts, two cases serve as
examples here:
Case 1. The equipped group of cabinets, with dedicated temperature control.
This method is the cold aisles / hot aisles arrangement of a smaller number of cabinets,
typically four to twelve. Its advantage over the air conditioning of rooms is the smaller air
volume which allows a focused heat management with optimised dimensioning of power
consumption for the cooling devices and increased temperatures in the warm zones of the
room. In such cases, efficiency can be increased by adopting exhaust heat recovery for room
heating in cold periods. Due to the improved energy efficiency contained aisles are becoming
more and more popular.
Case 2. Single cabinets with water-air heat exchangers.
This method is used for cabinets accommodating high-performance/heat dissipating electronic
equipment, typically servers and mainframe computers. Its advantage over the room air
conditioning or cold aisles consists in the high degree of constant air inlet temperature for
sensitive electronic devices. Closed air circulation within a cabinet allows a very precise
temperature control. The power consumption aspect may be similar to that of the cold aisle,
but the temperature control aspect is more important and favourable to a longer life-cycle of
costly equipment.
This standard has been created for case 2: Cooling performance tests for water-supplied heat
exchangers in single electronic cabinet configurations. The parameters with reference to the
described test sample are shown in diagrams which may be useful to provide for a
standardized calculation method for specific cabinet dimensions and heat exchanger cooling
requirements. The typical required cooling capacity for such cabinets is normally higher than
12 kW. The described test methods of this standard address a cooling capacity of more than
12 kW. However, since IT equipment varies the heat load to a cabinet the test also considers
values below 12 kW for partial heat load.

– 6 – 62610-4 © IEC:2013
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 4: Cooling performance tests for water supplied
heat exchangers in electronic cabinets

1 Scope and object
This part of IEC 62610 specifies the test setup and test parameters for water supplied heat
exchangers within single electronic cabinet configurations. The tests are focused on cabinets
for the installation of high power dissipation electronic equipment. The cabinets concerned
are from the IEC 60297 (19 in) and IEC 60917 (25 mm) series. The purpose of this standard
is to provide comparable data for the cooling performance of cabinets according to defined
test setups and cooling parameters.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60297 (all parts), Dimensions of mechanical structures of the 482,6 mm (19 in) series
IEC 60917 (all parts), Modular order for the development of mechanical structures for
electronic equipment practices
3 Terms and definitions, symbols and units
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1.1
cooling capacity

Q
removed heat load given by the electronic equipment mounted inside the electronic cabinet
[kW]
3.1.2
absolute humidity
mass content of water (gram of water) per defined mass of dry air (kilogram of air) [g/kg] g of
water per kg dry air
3.1.3
dummy
device to generate heat load similar to most common electronic devices in information
technology: horizontal air flow with air intake at the front and air outlet at the rear side of the
equipment.
62610-4 © IEC:2013 – 7 –
Note 1 to entry: The air flow orientation is defined in IEC 60297 (19 in) and IEC 60917 (25 mm) standard series
cabinet design.
3.1.4
sensible cooling
cooling capacity to provide air temperature change only. The absolute humidity of air in
sensible cooling process is unchanged.
3.1.5
simplified test
this test method does not consider the influence of the heat transfer through the walls of the
electronic cabinet nor the heat transfer by leaking air in and out of the housing of the
electronic equipment
3.1.6
extended test
this test method does not consider the heat transfer by leaking air in and out of the housing of
the electronic equipment
3.2 Symbols and units
P electrical power consumption [kW]
el
T Temperature [°C]

Q heat flow of the cooling air [kW]
air
v air velocity (test result) [m/s]
air
A air cross-section [m ]
air
ρ air density (related to 101,325 kPa air pressure) [kg/m ]
air
c specific heat capacity of air [kJ/kgK]
p,air
δT temperature difference [K]
δT temperature difference of the chilled water between supply and return [K]
CW
δT temperature difference of the cooling air between equipment air inlet and air outlet
air
[K]
f
factor based on specific heat capacity of water [l/s, l/min, m /h]

Q heat flow in chilled water [kW]
CW
 3
V chilled-water flow [l/s, l/min, m /h]
CW

Q
cooling capacity [kW]

Q
cooling capacity of the IT equipment [kW]
S
– 8 – 62610-4 © IEC:2013
4 Performance test for the heat exchanger
4.1 General
For testing the heat exchanger performance, the following parameters shall be applied:
The heat load of the dummy equipment shall be unchanged during the test. The heat
dissipation of the heat load dummies shall be measured during the test and be recorded in the
test report as the main result of the test according to Table B.1. The determination of the heat
dissipation of the heat load shall be measured in accordance to the electrical power
consumption.
During all measurements all control function and algorithm of the tested unit shall be disabled.
The air temperature in front of the electronic equipment (between its front panel and door)
shall be in the range defined in Annex A, with a max. tolerance of ± 1 K at the different
temperature sensors. The
...