EN 60749-34:2010

SLOVENSKI STANDARD
01-februar-2011
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Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
(IEC 60749-34:2010)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 34:
Lastwechselprüfung (IEC 60749-34:2010)
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie
34: Cycles en puissance (CEI 60749-34:2010)
Ta slovenski standard je istoveten z: EN 60749-34:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60749-34
NORME EUROPÉENNE
December 2010
EUROPÄISCHE NORM
ICS 31.080.01 Supersedes EN 60749-34:2004

English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 34: Power cycling
(IEC 60749-34:2010)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d'essais mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 34: Cycles en puissance Teil 34: Lastwechselprüfung
(CEI 60749-34:2010) (IEC 60749-34:2010)

This European Standard was approved by CENELEC on 2010-12-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-34:2010 E
Foreword
The text of document 47/2068/FDIS, future edition 2 of IEC 60749-34, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-34 on 2010-12-01.
This European Standard supersedes EN 60749-34:2004.
The significant changes with respect from EN 60749-34:2004 include:
– the specification of tighter conditions for more accelerated power cycling in the wire bond fatigue
mode;
– information that under harsh power cycling conditions high current densities in a thin die metalization
might initiate electromigration effects close to wire bonds.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-09-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-12-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-34:2010 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60749-34:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60747-1 2006 Semiconductor devices - - -
Part 1: General
IEC 60747-2 2000 Semiconductor devices - Discrete devices and - -
integrated circuits -
Part 2: Rectifier diodes
IEC 60747-6 2000 Semi conductor devices - - -
Part 6: Thyristors
IEC 60749-3 - Semiconductor devices - Mechanical and EN 60749-3 -
climatic test methods -
Part 3: External visual examination

IEC 60749-23 - Semiconductor devices - Mechanical and EN 60749-23 -
climatic test methods -
Part 23: High temperature operating life

IEC 60749-34 ®
Edition 2.0 2010-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 34: Power cycling
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 34: Cycles en puissance

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
L
CODE PRIX
ICS 31.080.01 ISBN 978-2-88912-232-5
– 2 – 60749-34 © IEC:2010
CONTENTS
FOREWORD.3
1 Scope and object.5
2 Normative references .5
3 Terms and definitions .5
4 Test apparatus .6
5 Procedure .7
6 Test conditions .7
7 Precautions .8
8 Measurements.9
9 Failure criteria .9
10 Summary.9
Bibliography.10

Figure 1 – Typical load power P and temperature cycle test condition 2.8

Table 1 – Test conditions.8

60749-34 © IEC:2010 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 34: Power cycling
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-34 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2004 and constitutes a
technical revision. The significant changes with respect from the previous edition include:
– the specification of tighter conditions for more accelerated power cycling in the wire bond
fatigue mode;
– information that under harsh power cycling conditions high current densities in a thin die
metalization might initiate electromigration effects close to wire bonds.

– 4 – 60749-34 © IEC:2010
The text of this standard is based on the following documents:
FDIS Report on voting
47/2068/FDIS 47/2079/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, under the general title Semiconductor devices –
Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
60749-34 © IEC:2010 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 34: Power cycling
1 Scope and object
This part of IEC 60749 describes a test method used to determine the resistance of a
semiconductor device to thermal and mechanical stresses due to cycling the power
dissipation of the internal semiconductor die and internal connectors. This happens when low-
voltage operating biases for forward conduction (load currents) are periodically applied and
removed, causing rapid changes of temperature. The power cycling test is intended to
simulate typical applications in power electronics and is complementary to high temperature
operating life (see IEC 60749-23). Exposure to this test may not induce the same failure
mechanisms as exposure to air-to-air temperature cycling, or to rapid change of temperature
using the two-fluid-baths method. This test causes wear-out and is considered destructive.
NOTE It is not the intention of this specification to provide prediction models for lifetime evaluation.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60747-1:2006, Semiconductor devices – Part 1: General
IEC 60747-2:2000, Semiconductor devices – Discrete devices and integrated circu
...