prEN IEC 62680-1-2:2024
(Main)Universal serial bus interfaces for data and power - Part 1-2: Common components - USB power delivery specification
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB power delivery specification
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 1-2: Composants communs - Spécification de l'alimentation électrique par port USB
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2. del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-julij-2024
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB
Universal serial bus interfaces for data and power - Part 1-2: Common components -
USB power delivery specification
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie
1-2: Composants communs - Spécification de l'alimentation électrique par port USB
Ta slovenski standard je istoveten z: prEN IEC 62680-1-2:2024
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
100/4138/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62680-1-2 ED7
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2024-05-10 2024-08-02
SUPERSEDES DOCUMENTS:
100/4106/RR
IEC TA 18 : MULTIMEDIA HOME SYSTEMS AND APPLICATIONS FOR END-USER NETWORKS
SECRETARIAT: SECRETARY:
Japan Mr Keisuke Koide
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any, in this
CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which they are
aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some Countries” clauses to
be included should this proposal proceed. Recipients are reminded that the CDV stage is the final stage for submitting ISC clauses.
(SEE AC/22/2007 OR NEW GUIDANCE DOC).
TITLE:
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery
specification
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
Page 2 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
Universal Serial Bus
Power Delivery Specification
3.2
Revision:
1.0
Version:
2023-10
Release date:
LIMITED COPYRIGHT LICENSE
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER,
INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY
PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY,
INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS
SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org.
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org.
® ®
USB Type-C and USB4 are trademarks of the Universal Serial Bus Implementers Forum (USB-IF). Thunderbolt™ is
a trademark of Intel Corporation.
You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this specification
that complete proper certification and executing a Thunderbolt™ trademark license – see http://usb.org/compliance
for further information.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
Corporation, Renesas, STMicroelectronics, and Texas Instruments.
All rights reserved.
Page 4 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
Editors
Bob Dunstan
Richard Petrie
Contributors
Charles Wang ACON, Advanced-Connectek, Inc. Sameer Kelkar Apple
Conrad Choy ACON, Advanced-Connectek, Inc. Sasha Tietz Apple
Dennis Chuang ACON, Advanced-Connectek, Inc. Scott Jackson Apple
Steve Sedio ACON, Advanced-Connectek, Inc. Sree Raman Apple
Sunney Yang ACON, Advanced-Connectek, Inc. William Ferry Apple
Vicky Chuang ACON, Advanced-Connectek, Inc. Zaki Moussaoui Apple
Joseph Scanlon Advanced Micro Devices Jeff Liu ASMedia Technology Inc.
Sujan Thomas Advanced Micro Devices Kuo Lung Li ASMedia Technology Inc.
Caspar Lin Allion Labs, Inc. Ming-Wei Hsu ASMedia Technology Inc.
Casper Lee Allion Labs, Inc. PS Tseng ASMedia Technology Inc.
Danny Shih Allion Labs, Inc. Sam Tzeng ASMedia Technology Inc.
Thomas Hsu ASMedia Technology Inc.
Howard Chang Allion Labs, Inc.
Greg Stewart Analogix Semiconductor, Inc. Weikao Chang ASMedia Technology Inc.
Mehran Badii Analogix Semiconductor, Inc. Yang Cheng ASMedia Technology Inc.
Alexei Kosut Apple Aaron Hou Bizlink Technology Inc.
Bill Cornelius Apple Shawn Meng Bizlink Technology Inc.
Carlos Colderon Apple Bernard Shyu Bizlink Technology, Inc.
Chris Uiterwijk Apple Eric Wu Bizlink Technology, Inc.
Colin Whitby-Strevens Apple Morphy Hsieh Bizlink Technology, Inc.
Corey Axelowitz Apple Sean O'Neal Bizlink Technology, Inc.
Corey Lange Apple Tiffany Hsiao Bizlink Technology, Inc.
Dave Conroy Apple Weichung Ooi Bizlink Technology, Inc.
David Sekowski Apple Rahul Bhushan Broadcom Corp.
Girault Jones Apple Asila nahas Cadence Design Systems, Inc.
James Orr Apple Claire Ying Cadence Design Systems, Inc.
Jason Chung Apple Jie min Cadence Design Systems, Inc.
Mark Summers Cadence Design Systems, Inc.
Jay Kim Apple
Jeff Wilcox Apple Michal Staworko Cadence Design Systems, Inc.
Jennifer Tsai Apple Sathish Kumar Ganesan Cadence Design Systems, Inc.
Karl Bowers Apple Alessandro Ingrassia Canova Tech
Keith Porthouse Apple Andrea Colognese Canova Tech
Antonio Orzelli Canova Tech
Kevin Hsiue Apple
Matt Mora Apple Davide Ghedin Canova Tech
Paul Baker Apple Matteo Casalin Canova Tech
Reese Schreiber Apple Michael Marioli Canova Tech
Ricardo Janezic Pregitzer Apple Nicola Scantamburlo Canova Tech
Ruchi Chaturvedi Apple Paolo Pilla Canova Tech
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 5
Ray Huang Canyon Semiconductor KE Hong Dialog Semiconductor (UK) Ltd
Yi-Feng Lin Canyon Semiconductor Kevin Mori Dialog Semiconductor (UK) Ltd
YuHung Lin Canyon Semiconductor Larry Ping Dialog Semiconductor (UK) Ltd
David Tsai Chrontel, Inc. Mengfei Liu Dialog Semiconductor (UK) Ltd
Anshul Gulati Cypress Semiconductor Scott Brown Dialog Semiconductor (UK) Ltd
Anup Nayak Cypress Semiconductor Yimin Chen Dialog Semiconductor (UK) Ltd
Benjamin Kropf Cypress Semiconductor Yong Li Dialog Semiconductor (UK) Ltd
Dhanraj Rajput Cypress Semiconductor Justin Lee Diodes Incorporated
Ganesh Subramaniam Cypress Semiconductor Dan Ellis DisplayLink (UK) Ltd.
Jagadeesan Raj Cypress Semiconductor Jason Young DisplayLink (UK) Ltd.
Junjie cui Cypress Semiconductor Kevin Jacobs DisplayLink (UK) Ltd.
Manu Kumar Cypress Semiconductor Paulo Alcobia DisplayLink (UK) Ltd.
Muthu M Cypress Semiconductor Peter Burgers DisplayLink (UK) Ltd.
Richard Petrie DisplayLink (UK) Ltd.
Nicholas Bodnaruk Cypress Semiconductor
Pradeep Bajpai Cypress Semiconductor Chien-Cheng Kuo eEver Technology, Inc.
Rajaram R Cypress Semiconductor Shyanjia Chen eEver Technology, Inc.
Rama Vakkantula Cypress Semiconductor Abel Astley Ellisys
Rushil Kadakia Cypress Semiconductor Chuck Trefts Ellisys
Emmanuel Durin Ellisys
Simon Nguyen Cypress Semiconductor
Steven Wong Cypress Semiconductor Mario Pasquali Ellisys
Subu Sankaran Cypress Semiconductor Tim Wei Ellisys
Sumeet Gupta Cypress Semiconductor Chien-Cheng Kuo Etron Technology, Inc.
Tejender Sheoran Cypress Semiconductor Jack Yang Etron Technology, Inc.
Venkat Mandagulathar Cypress Semiconductor Richard Crisp Etron Technology, Inc.
Xiaofeng Shen Cypress Semiconductor Shyanjia Chen Etron Technology, Inc.
Zeng Wei Cypress Semiconductor TsungTa Lu Etron Technology, Inc.
Adie Tan Dell Inc. Christian Klein Fairchild Semiconductor
Adolfo Montero Dell Inc. Oscar Freitas Fairchild Semiconductor
Souhib Harb Fairchild Semiconductor
Bruce Montag Dell Inc.
Gary Verdun Dell Inc. Amanda Ying Feature Integration Technology Inc.
Ken Nicholas Dell Inc. Jacky Chan Feature Integration Technology Inc.
Marcin Nowak Dell Inc. Kenny Hsieh Feature Integration Technology Inc.
Merle Wood Dell Inc. KungAn Lin Feature Integration Technology Inc.
Paul Yang Feature Integration Technology Inc.
Mohammed Hijazi Dell Inc.
Siddhartha Reddy Dell Inc. Su Jaden Feature Integration Technology Inc.
Terry Matula Dell Inc. Yu-Lin Chu Feature Integration Technology Inc.
Jay Hu Derun Semiconductor Yulin Lan Feature Integration Technology Inc.
Shelly Liu Derun Semiconductor AJ Yang Foxconn / Hon Hai
Bindhu Vasu Dialog Semiconductor (UK) Ltd Bob Hall Foxconn / Hon Hai
Chanchal Gupta Dialog Semiconductor (UK) Ltd Chihyin Kan Foxconn / Hon Hai
Dipti Baheti Dialog Semiconductor (UK) Ltd Fred Fons Foxconn / Hon Hai
Duc Doan Dialog Semiconductor (UK) Ltd Jie Zheng Foxconn / Hon Hai
Holger Petersen Dialog Semiconductor (UK) Ltd Patrick Casher Foxconn / Hon Hai
Jianming Yao Dialog Semiconductor (UK) Ltd Shruti Deore Foxconn / Hon Hai
John Shi Dialog Semiconductor (UK) Ltd Steve Sedio Foxconn / Hon Hai
Page 6 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
Terry Little Foxconn / Hon Hai Vishal Kakade Granite River Labs
Bob McVay Fresco Logic Inc. Yogeshwaran Venkatesan Granite River Labs
Christopher Meyers Fresco Logic Inc. Jerry Qin GuangDong OPPO Mobile
Dian Kurniawan Fresco Logic Inc. Alan Berkema Hewlett Packard
Tom Burton Fresco Logic Inc. Lee Atkinson Hewlett Packard
Abraham Levkoy Google Inc. Rahul Lakdawala Hewlett Packard
Adam Rodriguez Google Inc. Robin Castell Hewlett Packard
Alec Berg Google Inc. Ron Schooley Hewlett Packard
Benson Leung Google Inc. Steve Chen Hewlett Packard
Chao Fei Google Inc. Suketa Partiwala Hewlett Packard
Dave Bernard Google Inc. Vaibhav Malik Hewlett Packard
David Schneider Google Inc. Walter Fry Hewlett Packard
Diana Zigterman Google Inc. Hideyuki HAYAFUJI Hosiden Corporation
Eric Herrmann Google Inc. Keiji Mine Hosiden Corporation
Jameson Thies Google Inc. Masaki Yamaoka Hosiden Corporation
Jim Guerin Google Inc. Takashi Muto Hosiden Corporation
Juan Fantin Google Inc. Yasunori Nishikawa Hosiden Corporation
Ken Wu Google Inc. Alan Berkema HP Inc.
Kyle Tso Google Inc. Kenneth Chan HP Inc.
Mark Hayter Google Inc. Lee Atkinson HP Inc.
Nathan Kolluru Google Inc. Lee Leppo HP Inc.
Nithya Jagannathan Google Inc. Rahul Lakdawala HP Inc.
Srikanth Lakshmikanthan Google Inc. Robin Castell HP Inc.
Todd Broch Google Inc. Roger Benson HP Inc.
Toshak Singhal Google Inc. Steve Chen HP Inc.
Vincent Palatin Google Inc. Bai Sean Huawei Technologies Co., Ltd.
Xuelin Wu Google Inc. Chunjiang Zhao Huawei Technologies Co., Ltd.
Zhenxue Xu Google Inc. JianQuan Wu Huawei Technologies Co., Ltd.
Alan Kinningham Granite River Labs Li Zongjian Huawei Technologies Co., Ltd.
Anand Murugan Granite River Labs Liansheng Zheng Huawei Technologies Co., Ltd.
Balamurugan Manialagan Granite River Labs Lihua Duan Huawei Technologies Co., Ltd.
Medipalli Sowmya Granite River Labs Min Chen Huawei Technologies Co., Ltd.
Mike Engbretson Granite River Labs Wang Feng Huawei Technologies Co., Ltd.
Mike Wu Granite River Labs Wei Haihong Huawei Technologies Co., Ltd.
Mukesh Tatiya Granite River Labs Zhenning Shi Huawei Technologies Co., Ltd.
Naresh Botsa Granite River Labs James Xie Hynetek Semiconductor Co., Ltd
PoornaKumar M. Granite River Labs Yingyang Ou Hynetek Semiconductor Co., Ltd
Prajwal Rathod Granite River Labs Robert Heaton Indie Semiconductor
Rajaraman V Granite River Labs Vincent Wang Indie Semiconductor
Saai Ghoutham Revathi Granite River Labs Benjamin Kropf In�ineon Technologies
Sivan Perumal Granite River Labs Sie Boo Chiang In�ineon Technologies
Sivaram Murugesan Granite River Labs Tue Fatt David Wee In�ineon Technologies
Tim Lin Granite River Labs Wee Tar Richard Ng In�ineon Technologies
Wolfgang Furtner In�ineon Technologies
Vijay S. Granite River Labs
Vijayakumar P Granite River Labs Aruni Nelson Intel Corporation
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 7
Bob Dunstan Intel Corporation Babu Mailachalam Lattice Semiconductor Corp
Brad Saunders Intel Corporation Gianluca Mariani Lattice Semiconductor Corp
Chee Lim Nge Intel Corporation Joel Coplen Lattice Semiconductor Corp
Christine Krause Intel Corporation Thomas Watza Lattice Semiconductor Corp
Chuen Ming Tan Intel Corporation Vesa Lauri Lattice Semiconductor Corp
Dan Froelich Intel Corporation Bruce Chuang Leadtrend
David Harriman Intel Corporation Eilian Liu Leadtrend
David Hines Intel Corporation Chetan Kopalle LeCroy Corporation
David Thompson Intel Corporation Daniel H Jacobs LeCroy Corporation
Guobin Liu Intel Corporation Jake Jacobs LeCroy Corporation
Harry Skinner Intel Corporation Kimberley McKay LeCroy Corporation
Henrik Leegaard Intel Corporation Mike Engbretson LeCroy Corporation
Jenn Chuan Cheng Intel Corporation Mike Micheletti LeCroy Corporation
Jervis Lin Intel Corporation Roy Chestnut LeCroy Corporation
John Howard Intel Corporation Tyler Joe LeCroy Corpora
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.