EN 60603-12:1998

Overview

EN 60603-12:1998 (adopted nationally as SIST EN 60603-12:2002) is a CLC standard specifying requirements for connectors used on printed boards at frequencies below 3 MHz. It provides a detailed specification of dimensions, general requirements and tests for a range of sockets designed to accept integrated circuits in dual-in-line (DIP) format. The standard covers both standard-type and low-profile sockets and references the corresponding IEC document (IEC 60603-12:1992).

Key topics and requirements

The standard focuses on practical, testable criteria to ensure interchangeability and reliability of DIP sockets on PCBs. Main technical topics include:

• Dimensional specifications for socket body, pin layout and footprint to match dual-in-line integrated circuits
• Mechanical requirements such as contact retention, insertion/removal forces and durability under repeated mating cycles
• Electrical considerations relevant at frequencies below 3 MHz (e.g., contact resistance and continuity requirements)
• Environmental and reliability tests to verify performance under thermal, humidity and mechanical stress conditions
• Variants covered including standard-height and low-profile socket types for space-constrained assemblies
• Conformance and testing methods to support quality control and type approval by manufacturers and test laboratories

(Note: the standard text provides the authoritative test procedures and pass/fail criteria; consult the published document for specific test parameters and tolerances.)

Applications

EN 60603-12 is directly applicable where reliable, standardized sockets for dual-in-line integrated circuits are required, including:

• PCB design and layout for consumer electronics, industrial controls and instrumentation
• Manufacturing and procurement of DIP sockets for assembly lines
• Quality assurance and test laboratories performing conformity testing and incoming inspection
• Component selection for retrofit, repair and maintenance of legacy systems that use DIP packaged ICs

Using this standard helps ensure mechanical and electrical compatibility, simplifies sourcing and reduces field failures by enforcing common dimensional and test requirements.

Who uses this standard

• Connector and socket manufacturers
• PCB designers and electronic assemblers
• Test houses and certification bodies
• Procurement and quality engineers in electronics manufacturing
• Maintenance and repair teams working with DIP-based boards

Related standards

• IEC 60603-12:1992 (harmonized international reference cited in the document)
• Other parts of the EN/IEC 60603 series (for related connector types and applications)

Keywords: EN 60603-12:1998, IEC 60603-12, DIP sockets, dual-in-line connectors, PCB connectors, low-profile sockets, connector dimensions, socket tests, printed circuit board standards.