Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelemente (SMD)

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la chaleur de soudage des composants pour montage en surface (CMS)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

General Information

Status
Withdrawn
Publication Date
31-Mar-1999
Withdrawal Date
31-Dec-2001
ICS
19.040 - Environmental testing
 
31.190 - Electronic component assemblies
Technical Committee
CLC/SR 91 - Electronics assembly technology
Drafting Committee
IEC/TC 91 - IEC_TC_91
Parallel Committee
IEC/TC 91 - IEC_TC_91
Current Stage
9960 - Withdrawal effective - Withdrawal
Start Date
01-Sep-2007
Completion Date
01-Sep-2007
Ref Project
SIST EN 60068-2-58:2001 - Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Relations

Replaced By
EN 60068-2-58:2004 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Effective Date
28-Jan-2023

Frequently Asked Questions

EN 60068-2-58:1999 is a standard published by CLC. Its full title is "Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)". This standard covers: Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

EN 60068-2-58:1999 is classified under the following ICS (International Classification for Standards) categories: 19.040 - Environmental testing; 31.190 - Electronic component assemblies. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 60068-2-58:1999 has the following relationships with other standards: It is inter standard links to EN 60068-2-58:2004. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

EN 60068-2-58:1999 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


SLOVENSKI STANDARD
01-marec-2001
1DGRPHãþD
SIST EN 60068-2-58:2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
Umweltprüfungen -- Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit,
Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit
bei oberflächenmontierbaren Bauelemente (SMD)
Essais d'environnement -- Partie 2-58: Essais - Essai Td: Méthodes d'essai de la
soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la
chaleur de soudage des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: EN 60068-2-58:1999
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovolje
...

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