EN 50310:2016

SLOVENSKI STANDARD
01-julij-2016
1DGRPHãþD
SIST EN 50310:2011
,]HQDþLWHYSRWHQFLDORYLQR]HPOMHYDQMHYVWDYEDK]RSUHPRLQIRUPDFLMVNH
WHKQRORJLMH
Telecommunications bonding networks for buildings and other structures
Anwendung von Maßnahmen für Erdung und Potentialausgleich in Gebäuden mit
Einrichtungen der Informationstechnik
Application de liaison équipotentielle et de la mise à la terre dans les locaux avec
équipement de technologie de l'information
Ta slovenski standard je istoveten z: EN 50310:2016
ICS:
35.020 Informacijska tehnika in Information technology (IT) in
tehnologija na splošno general
91.140.50 Sistemi za oskrbo z elektriko Electricity supply systems
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 50310
NORME EUROPÉENNE
EUROPÄISCHE NORM
May 2016
ICS 29.120.50; 91.140.50 Supersedes EN 50310:2010
English Version
Telecommunications bonding networks for buildings and other
structures
Application de liaison équipotentielle et de la mise à la terre Anwendung von Maßnahmen für Erdung und
dans les locaux avec équipement de technologie de Potentialausgleich in Gebäuden mit Einrichtungen der
l'information Informationstechnik
This European Standard was approved by CENELEC on 2016-04-11. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 50310:2016 E
Contents
European foreword . 4
Introduction . 6
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviations .10
3.1 Terms and definitions .10
3.2 Abbreviations .12
4 Conformance .13
5 Overview of bonding networks .13
6 Selection of the telecommunications bonding network approach .15
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment .15
6.2 Telecommunications bonding networks .16
6.3 Telecommunications bonding network performance .17
7 Common features .19
7.1 General .19
7.2 Protective bonding networks .19
7.3 Telecommunications entrance facility (TEF) .19
7.4 Telecommunications bonding network components .20
7.5 Cabinets, frames and racks .21
7.6 Miscellaneous bonding connections .24
7.7 Documentation .25
8 Dedicated telecommunications bonding network .25
8.1 General .25
8.2 Components .26
8.3 Implementation .30
9 Local telecommunications bonding networks in conjunction with protective bonding
networks .33
9.1 Bonding for local distribution .33
9.2 Telecommunications bonding conductors .35
9.3 Bonding for areas of telecommunications equipment concentration .36
10 Local telecommunications bonding networks in conjunction with dedicated
telecommunications bonding networks .36
10.1 Bonding for areas of telecommunications equipment concentration .36
10.2 Telecommunications equipment bonding conductors (TEBC) .37
11 Mesh bonded networks .38
11.1 General .38
11.2 Mesh bonding alternatives.38
11.3 Bonding conductors of a mesh bonding network .41
11.4 Bonding conductors to the mesh bonding network .41
11.5 Supplementary bonding grid (SBG) .42
11.6 System reference potential plane (SRPP) .42
Annex A (normative) Maintenance of telecommunications bonding network performance .45
A.1 General .45
A.2 Periodic activity .45
A.2.1 Schedule .45
A.2.2 Implementation .45
A.3 Causes of performance deterioration .46
A.3.1 Galvanic corrosion .46
A.3.2 Requirements .46
Bibliography .47

European foreword
This document (EN 50310:2016) was prepared by the CLC/TC 215, “Electrotechnical aspects of
telecommunication equipment”.
The following dates are fixed:
• latest date by which this document has to be (dop) 2017–04–11
implemented at national level by publication of
an identical national standard or by
endorsement
• latest date by which the national standards (dow) 2019–04–11
conflicting with this document have to
be withdrawn
This document supersedes EN 50310:2010.
In 2012, EN 50310:2010 had been offered to ISO/IEC JTC 1/SC 25 “Interconnection of information
technology equipment” as input to the agreed project to seek global harmonization of the technical
requirements for telecommunications bonding networks. This project, ISO/IEC 30129, has been
finished successfully. Thus, TC 215 decided to transpose ISO/IEC 30129 into the fourth edition of
EN 50310 with minimal editorial changes to fit European needs. In this context, also the title of
EN 50310 has been changed to adopt the title of ISO/IEC 30129.
EN 50310 has been produced within the framework of the following considerations.
a) With the ongoing growth of the liberalised telecommunication market, the increasing advent of
private telecommunication network operators, and the flourishing use of networking computers,
the amount of Information Technology equipment installed in buildings and the complexity of
these Information Technology installations are permanently growing.
b) Information Technology equipment is generally installed either as stand-alone equipment (e.g.
personal or network computers, small PBXs), or held in racks, cabinets or other mechanical
structures (e.g. switching systems, transmission systems, mobile base stations).
c) CENELEC/SC 64B „Electrical installations and protection against electric shock – Protection
against thermal effects“ had decided during their meeting in November 1997 not to harmonize
IEC 60364-5-548:1996 “Electrical installations of buildings – Part 5: Selection and erection of
electrical equipment – Section 548: Earthing arrangements and equipotential bonding for
information technology installations”.
d) This European Standard shall give guidance to network operators, equipment providers and
building owners to agree on a standardized bonding configuration that facilitates:
– compliance of the Information Technology Equipment installation with functional requirements
including Electromagnetic Compatibility (EMC) aspects of emission and immunity,
– compatible building installation and equipment provisions,
– installation of new equipment in buildings as well as expansion or replacement of installations
in existing buildings with equipment coming from different suppliers,
– a structured installation practice,
– simple maintenance rules,
– contracting on a common basis,
– harmonization in development, manufacturing, installation and operation.
Introduction
This European Standard
1) specifies assessment criteria to determine the relevant bonding configurations that are
appropriate,
2) enables the implementation of any bonding configurations that may be necessary by means of
either
– the provision of a bonding network that utilizes the existing protective bonding network for
electrical safety, or
– the provision of a dedicated bonding network for the telecommunications infrastructure.
This standard is intended for
• building architects, owners and managers,
• designers and installers of electrical and telecommunications cabling installations.
Users of this standard should be familiar with all applicable cabling design and installation standards.
Figure 1 and Table 1 show the schematic and contextual relationships between the standards
produced by TC 215 for information technology cabling, namely:
• installation specification, quality assurance, planning and installation practices (EN 50174 series);
• generic cabling design (EN 50173 series);
• application dependent cabling design (e.g. EN 50098 series);
• testing of installed cabling (EN 50346);
• this European Standard (EN 50310).
EENN 50098 50098--1:1: C Cususttoommerer pr preemmiisseses EENN 50173 50173--2:2: I Innfforormmatatiion ton teecchnolhnologogyy --
ccablabliing fng foror i infnforormmatatiion ton tecechhnolnologogyy -- GGenereneriicc c cablabliing ng -- OOffffiicce pre preemmiisseses
IISSDDNN b baasisic ac acceccessss
EENN 50173 50173--3:3: I Innfforormmatatiion ton teecchnolhnologogyy --
EENN 50098 50098--2:2: C Cususttoommerer pr preemmiisseses GGenereneriicc c cablabliing ng -- IIndusndusttrriialal pr prememiisseess
EENN 50173 50173--1:1: I Innfforormmatatiion ton teecchnolhnologogyy --
ccablabliing fng foror i infnforormmatatiion ton tecech
...