Telecommunications bonding networks for buildings and other structures

This document specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to: a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance; b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI). The requirements of this European Standard are applicable to the buildings and other structures within premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but information given in this European Standard may be of assistance for other types of buildings and structures. NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253. This European Standard does not apply to power supply distribution of voltages over AC 1 000 V. Electromagnetic compatibility (EMC) requirements and safety requirements for power supply installation are outside the scope of this European Standard and are covered by other standards and regulations. However, information given in this European Standard may be of assistance in meeting the requirements of these standards and regulations.

Anwendung von Maßnahmen für Erdung und Potentialausgleich in Gebäuden mit Einrichtungen der Informationstechnik

Application de liaison équipotentielle et de la mise à la terre dans les locaux avec équipement de technologie de l'information

Izenačitev potencialov in ozemljevanje v stavbah z opremo informacijske tehnologije - Dopolnilo A2

General Information

Status
Not Published
Publication Date
31-Jan-2027
Current Stage
4020 - Enquiry circulated - Enquiry
Start Date
09-Jan-2026
Due Date
30-Nov-2025
Completion Date
09-Jan-2026

Relations

Effective Date
13-Aug-2024

Overview

EN 50310:2016/prA2:2026 is a European standard developed by CLC/TC 215, specifying requirements and providing recommendations for the design and installation of telecommunications bonding networks in buildings and other structures. This standard is key for professionals involved in constructing or refurbishing buildings where information or telecommunications technology equipment is to be installed. Its main aims are to minimize d.c. and a.c. potential differences, reducing the risk of equipment malfunction due to electromagnetic disturbances, and to ensure the telecommunications infrastructure has a reliable signal reference, thus enhancing immunity from electromagnetic interference (EMI). Importantly, this standard applies to diverse environments, including residential, office, industrial, and data center premises, as covered by EN 50174-2.

Key Topics

  • Bonding Network Types: Defines four primary types of bonding networks: star, ring, local mesh, and mesh, each offering different levels of suitability for controlling electromagnetic interference.
  • Design and Installation Requirements: Sets clear criteria for connections between conductive elements, including minimum contact resistance, installation practices, and suitable placement for bonding networks.
  • Operational Guidance: Recommends maintaining documentation-technical drawings, schematics, and electronic data-of all bonding connections, supporting traceability and compliance.
  • Risk and Performance Assessment: Advises assessments of business and technical needs when selecting the appropriate type of bonding network, considering operational availability and potential telecommunication disruption.
  • Impedance and Resistance Control: Specifies installation methods to ensure bonding conductors and connectors meet resistance and impedance targets, referencing best practices to reduce malfunction risks.
  • Integration with Building Structures: Allows structural metal fulfilling certain conditions to be utilized within the bonding network, provided that electrical continuity and compliance are verified.

Applications

The practical relevance of EN 50310:2016/prA2:2026 spans multiple sectors:

  • Building Construction and Refurbishment: Ensures that new and renovated buildings can support the safe and reliable operation of telecommunications infrastructure.
  • ICT Infrastructure Planning: Guides IT and facility managers in providing secure and interference-free environments for information technology equipment.
  • Data Centers: Critical for reducing electromagnetic risk and signal degradation in high-density installations.
  • Industrial Facilities: Enhances immunity of process control and communication systems in challenging electromagnetic environments.
  • Residential and Commercial Buildings: Supports compliance with best practices for network reliability and safety in apartments, offices, and mixed-use developments.

The standard also supports compliance with broader electromagnetic compatibility (EMC) and safety requirements by providing practical bonding and grounding methods, though it does not itself set EMC or high-voltage power safety standards.

Related Standards

Professionals working with EN 50310:2016/prA2:2026 should consider the following related standards for comprehensive coverage:

  • EN 50174-2: Cabling installation planning and practices inside buildings.
  • EN 50173 series: Generic cabling systems.
  • EN 50667: Requirements and applications for automated infrastructure management (AIM) systems.
  • EN IEC 62368-1: Safety requirements for audio/video, information and communication technology equipment.
  • ETSI/EN 300 253: Telecommunications centres and operator buildings.

These documents, together with EN 50310, establish a robust foundation for the design, installation, and management of telecommunications networks that are resistant to electromagnetic disturbance and suitable for a variety of modern premises.

Keywords: telecommunications bonding networks, EN 50310, electromagnetic interference, EMI, grounding, building cabling, ICT infrastructure, network reliability, CLC standard, IT equipment safety, impedance control, mesh bonding network.

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EN 50310:2016/oprA2:2026

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Frequently Asked Questions

EN 50310:2016/prA2:2026 is a draft published by CLC. Its full title is "Telecommunications bonding networks for buildings and other structures". This standard covers: This document specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to: a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance; b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI). The requirements of this European Standard are applicable to the buildings and other structures within premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but information given in this European Standard may be of assistance for other types of buildings and structures. NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253. This European Standard does not apply to power supply distribution of voltages over AC 1 000 V. Electromagnetic compatibility (EMC) requirements and safety requirements for power supply installation are outside the scope of this European Standard and are covered by other standards and regulations. However, information given in this European Standard may be of assistance in meeting the requirements of these standards and regulations.

This document specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to: a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance; b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI). The requirements of this European Standard are applicable to the buildings and other structures within premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but information given in this European Standard may be of assistance for other types of buildings and structures. NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253. This European Standard does not apply to power supply distribution of voltages over AC 1 000 V. Electromagnetic compatibility (EMC) requirements and safety requirements for power supply installation are outside the scope of this European Standard and are covered by other standards and regulations. However, information given in this European Standard may be of assistance in meeting the requirements of these standards and regulations.

EN 50310:2016/prA2:2026 is classified under the following ICS (International Classification for Standards) categories: 29.120.50 - Fuses and other overcurrent protection devices; 91.140.50 - Electricity supply systems. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 50310:2016/prA2:2026 has the following relationships with other standards: It is inter standard links to EN 50310:2016. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.

EN 50310:2016/prA2:2026 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


SLOVENSKI STANDARD
01-marec-2026
Izenačitev potencialov in ozemljevanje v stavbah z opremo informacijske
tehnologije - Dopolnilo A2
Telecommunications bonding networks for buildings and other structures
Anwendung von Maßnahmen für Erdung und Potentialausgleich in Gebäuden mit
Einrichtungen der Informationstechnik
Application de liaison équipotentielle et de la mise à la terre dans les locaux avec
équipement de technologie de l'information
Ta slovenski standard je istoveten z: EN 50310:2016/prA2:2026
ICS:
35.020 Informacijska tehnika in Information technology (IT) in
tehnologija na splošno general
91.140.50 Sistemi za oskrbo z elektriko Electricity supply systems
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD DRAFT
EN 50310:2016
NORME EUROPÉENNE
EUROPÄISCHE NORM
prA2
January 2026
ICS 29.120.50; 91.140.50 -
English Version
Telecommunications bonding networks for buildings and other
structures
Application de liaison équipotentielle et de la mise à la terre Anwendung von Maßnahmen für Erdung und
dans les locaux avec équipement de technologie de Potentialausgleich in Gebäuden mit Einrichtungen der
l'information Informationstechnik
This draft amendment prA2, if approved, will modify the European Standard EN 50310:2016; it is submitted to CENELEC members for
enquiry.
Deadline for CENELEC: 2026-04-10.

It has been drawn up by CLC/TC 215.

If this draft becomes an amendment, CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.

This draft amendment was established by CENELEC in three official versions (English, French, German).
A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.

Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Project: 80515 Ref. No. EN 50310:2016/prA2:2026 E

1Cont ents Page
2 European foreword . 3
3 1 Modifications to the Introduction . 4
4 2 Modifications to Clause 1, Scope . 4
5 3 Modifications to Clause 2, Normative references . 5
6 4 Modifications to Clause 3, Terms, definitions and abbreviations . 5
7 5 Modifications to Clause 5, Overview of bonding networks . 5
8 6 Modifications to 6.1, Assessment of the impact of the telecommunications bonding
9 network on the interconnection of telecommunications equipment . 6
10 7 Modifications to 7.4.1.2, Installation . 6
11 8 Modification to 7.4.2, Telecommunications bonding network connections . 7
12 9 Modifications to 7.5.2.2, Rack bonding conductors (RBC) for impedance control . 7
13 10 Modification to 7.5.3, Internal connections . 7
14 11 Modifications to 7.6.3 — Bonding conductors for impedance control . 7
15 12 Modification to 7.7 — Documentation . 7
16 13 Modifications to 8.2.4.1 — Telecommunications bonding backbone (TBB) . 7
17 14 Modifications to 8.3.1 — Primary bonding busbar (PBB) . 8
18 15 Modifications to 8.3.4 — Telecommunications bonding backbone (TBB) . 8
19 16 Modification to 8.3.7 — Bonds to structural metal . 8
20 17 Modifications to 9.2.2 — Bonding conductors for impedance control . 8
21 18 Modifications to 10.2.2 — TEBC for impedance control . 8
22 19 Modification to 11.2.1.1 — Requirements . 8
23 20 Modifications to 11.3 — Bonding conductors of a mesh bonding network . 8
24 21 Modification to A.3.2 — Requirements . 9
25 22 Modifications to the Bibliography . 9
27 European foreword
28 This document (EN 50310:2016/prA2:2026) has been prepared by CLC/TC 215 “Electrotechnical
29 aspects of telecommunication equipment”.
30 This document is currently submitted to the Enquiry.
31 The following dates are proposed:
• latest date by which the existence of this (doa) dav + 6 months
document has to be announced at national
level
• latest date by which this document has to be (dop) dav + 12 months
implemented at national level by publication of
an identical national standard or by
endorsement
• latest date by which the national standards (dow) dav + 36 months
conflicting with this document have to be (to be confirmed or
withdrawn modified when voting)
33 1 Modifications to the Introduction
34 Replace Figure 1 with the following figure:
36 Replace Table 1 with the following table:
Building design Generic cabling Specification Installation Operation phase
phase design phase phase phase
EN 50173-2 EN 50174-1
EN 50173-3
Planning phase
EN 50173-4
EN 50173-5
EN 50174-2
EN 50173-6
EN 50174-3
EN 50310 EN 50174-1
EN 50174-4
EN 50173-10 EN 50174-2
EN 50310
EN 50174-3
EN 50173-20
EN 50310
(these ENs
reference general
requirements of
EN 50173-1)
37 2 Modifications to Clause 1, Scope
38 Replace the first paragraph and the list item a) with:
39 This document specifies requirements and provides recommendations for the design and installation of
40 connections (bonds) between various electrically conductive elements in buildings and other structures,
41 during their construction or refurbishment, in which information or telecommunications technology
42 equipment is intended to be installed in order to:
43 a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that
44 equipment and interconnecting cabling due to electromagnetic disturbance;
45 3 Modifications to Clause 2, Normative references
46 Replace the references “EN 50174-2:2009” and “EN 50174-2:2009/A1:2011” with the following:
47 “EN 50174-2:2018, Information technology - Cabling installation - Part 2: Installation planning and
48 practices inside buildings”
49 4 Modifications to Clause 3, Terms, definitions and abbreviations
50 In 3.1, modify the following terms and definitions and add at the end of the list:
51 Replace definition 3.1.1 with:
52 “3.1.1
53 access provider
54 operator or another entity providing the means to enable external telecom
...

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