Field Device Integration (FDI) - Part 4: FDI Packages

This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1. [Figure 1 - FDI architecture diagram]

Feldgeräteintegration (FDI) - Teil 4: FDI-Packages

Intégration des appareils de terrain (FDI) - Partie 4: Paquetages FDI

IEC 62769-4:2021 est disponible sous forme de IEC 62769-4:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente . L'IEC 62769-4:2021 spécifie les Paquetages FDI. L'architecture FDI complète est représentée à la Figure 1. Les composants architecturaux qui relèvent du domaine d'application du présent document ont été mis en évidence dans la Figure 1.

Integracija procesne naprave (FDI) - 4. del: Paketi FDI (IEC 62769-4:2021)

General Information

Status
Published
Publication Date
25-Mar-2021
Current Stage
6060 - Document made available - Publishing
Start Date
26-Mar-2021
Completion Date
26-Mar-2021

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SLOVENSKI STANDARD
01-julij-2021
Nadomešča:
SIST EN 62769-4:2015
Integracija procesne naprave (FDI) - 4. del: Paketi FDI (IEC 62769-4:2021)
Field Device Integration (FDI) - Part 4: FDI Packages (IEC 62769-4:2021)
Feldgeräteintegration (FDI) - Teil 4: FDI-Packages (IEC 62769-4:2021)
Intégration des appareils de terrain (FDI) - Partie 4: Paquetages FDI (IEC 62769-4:2021)
Ta slovenski standard je istoveten z: EN IEC 62769-4:2021
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.240.50 Uporabniške rešitve IT v IT applications in industry
industriji
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62769-4

NORME EUROPÉENNE
EUROPÄISCHE NORM
March 2021
ICS 25.040.40; 35.100.05 Supersedes EN 62769-4:2015 and all of its amendments
and corrigenda (if any)
English Version
Field Device Integration (FDI) - Part 4: FDI Packages
(IEC 62769-4:2021)
Intégration des appareils de terrain (FDI) - Partie 4: Feldgeräteintegration (FDI) - Teil 4: FDI-Packages
Paquetages FDI (IEC 62769-4:2021)
(IEC 62769-4:2021)
This European Standard was approved by CENELEC on 2021-03-12. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62769-4:2021 E

European foreword
The text of document 65E/761/FDIS, future edition 2 of IEC 62769-4, prepared by SC 65E "Devices
and integration in enterprise systems" of IEC/TC 65 "Industrial-process measurement, control and
automation" was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-12-12
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-03-12
document have to be withdrawn
This document supersedes EN 62769-4:2015 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62769-4:2021 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61784-1 NOTE Harmonized as EN IEC 61784-1
IEC 61784-2 NOTE Harmonized as EN IEC 61784-2
IEC 62591 NOTE Harmonized as EN 62591
IEC 62769-2 NOTE Harmonized as EN 62769-2
IEC 62769-3 NOTE Harmonized as EN 62769-3
IEC 62769-5 NOTE Harmonized as EN 62769-5
IEC 62769-7 NOTE Harmonized as EN 62769-7
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61804 series Function blocks (FB) for process control and EN IEC 61804 series
electronic device description language (EDDL)
IEC 61804-5 2015 Function blocks (FB) for process control and EN 61804-5 2015
electronic device description language (EDDL)
- Part 5: EDDL Builtin library
IEC 62769-1 - Field Device Integration (FDI) - Part 1: EN 62769-1 -
Overview
IEC 62769-6 - Field Device Integration (FDI) - Part 6: EN 62769-6 -
Technology Mapping
ISO/IEC 29500-2 2016 Information technology - Document - -
description and processing languages - Office
Open XML File Formats - Part 2: Open
Packaging Conventions
ISO 639-1 - Codes for the representation of names of - -
languages - Part 1: Alpha-2 code
ISO 32000-1 - Document management_- Portable document - -
format – Part 1: PDF 1.7
Extensible Markup - W3C Recommendation, available at - -
Language (XML) 1.0
XML Schema - W3C Recommendation, available at - -
Definition Language
(XSD) 1.1
ETSI EN 319 132-1 - Electronic Signatures and Infrastructures - -
(ESI); XAdES digital signatures; Part 1:
Building blocks and XAdES baseline
signatures
ETSI TS 101 733 - Electronic Signatures and Infrastructures - -
(ESI); CMS Advanced Electronic Signatures
(CAdES)
FIPS 140-2 - Security Requirements for Cryptographic - -
Modules
IEC 62769-4 ®
Edition 2.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –

Part 4: FDI Packages
Intégration des appareils de terrain (FDI) –

Partie 4: Paquetages FDI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-9311-9

– 2 – IEC 62769-4:2021 © IEC 2021
CONTENTS
FOREWORD . 7
INTRODUCTION . 9
1 Scope . 10
2 Normative references . 10
3 Terms, definitions, abbreviated terms and conventions . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms . 12
3.3 Conventions . 12
4 FDI Package Model . 12
4.1 Overview. 12
4.2 FDI Package Elements . 14
4.2.1 Package Catalog . 14
4.2.2 Electronic Device Description . 14
4.2.3 User Interface Plug-in . 14
4.2.4 Attachment . 16
4.3 FDI Package Types . 16
4.3.1 FDI Device Package . 16
4.3.2 FDI Communication Package . 17
4.3.3 FDI UIP Package . 18
4.3.4 FDI Profile Package . 18
5 FDI Package implementation . 20
5.1 Packaging technology . 20
5.2 Use of Open Packaging Conventions . 20
5.2.1 Unknown parts . 20
5.2.2 Invalid parts . 20
5.2.3 Unknown relationships . 20
5.2.4 Interleaving. 20
5.2.5 Core properties . 20
5.2.6 Thumbnails . 20
5.2.7 Digital signatures . 20
5.3 FDI Package Parts . 21
5.3.1 Package Catalog . 21
5.3.2 Electronic Device Description . 22
5.3.3 User Interface Plug-in . 22
5.3.4 Attachments . 25
6 FDI Package Versioning . 27
6.1 Version scheme . 27
6.2 Versioned elements . 28
6.3 Version Hierarchy . 28
6.4 UIP Compatibility . 30
7 Digital Signatures and Registration Certificates . 31
7.1 Signed Elements and Certification documents . 31
7.2 Signing mechanism . 32
7.3 FDI Package Originator, FDI Registration Authority. 33
7.4 FDI Host behavior . 33

IEC 62769-4:2021 © IEC 2021 – 3 –
Annex A (normative) File name conventions . 34
A.1 Identification . 34
A.2 FDI Package filename convention . 34
Annex B (informative) FDI Package Creation . 35
B.1 General . 35
B.2 Tools and Components . 35
B.3 Development . 35
Annex C (informative) FDI Package deployment . 38
C.1 General . 38
C.2 Scenarios . 38
Annex D (informative) Example . 41
D.1 General . 41
D.2 Open Packagin
...

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