EN 61163-1:2006

SLOVENSKI STANDARD
01-februar-2008
Presejalno preskušanje glede zanesljivosti - 1. del: Popravljivi sestavi, izdelani v
lotih (IEC 61163-1:2006)
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots (IEC
61163-1:2006)
Zuverlässigkeitsvorbehandlung durch Beanspruchung - Teil 1: Instandsetzbare
Baugruppen, losweise gefertigt (IEC 61163-1:2006)
Déverminage sous contraintes - Partie 1: Assemblages réparables fabriqués en lots (IEC
61163-1:2006)
Ta slovenski standard je istoveten z: EN 61163-1:2006
ICS:
03.120.01
21.020
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 61163-1
NORME EUROPÉENNE
December 2006
EUROPÄISCHE NORM
ICS 03.120.01; 03.120.30; 21.020

English version
Reliability stress screening
Part 1: Repairable assemblies manufactured in lots
(IEC 61163-1:2006)
Déverminage sous contraintes Zuverlässigkeitsvorbehandlung
Partie 1: Assemblages réparables durch Beanspruchung
fabriqués en lots Teil 1: Instandsetzbare Baugruppen,
(CEI 61163-1:2006) losweise gefertigt
(IEC 61163-1:2006)
This European Standard was approved by CENELEC on 2006-11-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61163-1:2006 E
Foreword
The text of document 56/1102/FDIS, future edition 2 of IEC 61163-1, prepared by IEC TC 56,
Dependability, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as
EN 61163-1 on 2006-11-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2007-08-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2009-11-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61163-1:2006 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068 NOTE  Harmonized as EN 60068 (series) (not modified).
IEC 61014 NOTE  Harmonized as EN 61014:2003 (not modified).
__________
- 3 - EN 61163-1:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1)
IEC 60050-191 - International Electrotechnical Vocabulary - -
(IEV)
Chapter 191: Dependability and quality of
service
1) 2)
IEC 60068-2-2 - Environmental testing EN 60068-2-2 1993
Part 2: Tests - Tests B: Dry heat

1) 2)
IEC 60068-2-6 - Environmental testing EN 60068-2-6 1995
Part 2: Tests - Test Fc: Vibration (sinusoidal)

1) 2)
IEC 60068-2-14 - Environmental testing EN 60068-2-14 1999
Part 2: Tests - Test N: Change of temperature

1) 2)
IEC 60068-2-29 - Environmental testing EN 60068-2-29 1993
Part 2: Tests - Test Eb and guidance: Bump

1) 2)
IEC 60068-2-30 - Environmental testing EN 60068-2-30 2005
Part 2-30: Tests - Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
1) 2)
IEC 60068-2-64 - Environmental testing EN 60068-2-64 1994
Part 2: Test methods - Test Fh: Vibration,
broad-band random (digital control) and
guidance
1) 2)
IEC 60068-2-78 - Environmental testing EN 60068-2-78 2001
Part 2-78: Tests - Test Cab: Damp heat,
steady state
1) 2)
IEC 60300-2 - Dependability management EN 60300-2 2004
Part 2: Guidelines for dependability
management
1) 2)
IEC 61165 - Application of Markov techniques EN 61165 2006

1)
IEC 61649 - Goodness-of-fit tests, confidence intervals - -
and lower confidence limits for Weibull
distributed data
1)
ISO 2041 - Vibration and shock - Vocabulary - -

1)
Undated reference.
2)
Valid edition at date of issue.

NORME CEI
INTERNATIONALE
IEC
61163-1
INTERNATIONAL
Deuxième édition
STANDARD
Second edition
2006-06
Déverminage sous contraintes –
Partie 1:
Assemblages réparables fabriqués en lots

Reliability stress screening –
Part 1:
Repairable assemblies manufactured in lots

 IEC 2006 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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61163-1  IEC:2006 – 3 –
CONTENTS
FOREWORD.9
INTRODUCTION.13
1 Scope.19
2 Normative references .19
3 Terms and definitions .23
4 Symbols .27
5 General description .27
5.1 The reliability stress screening principle .27
5.2 Failure categories.31
5.3 Time of occurrence of failures .33
6 Planning .33
6.1 Stress conditioning.33
6.2 Evaluation of the failure-free period T .37
M
6.3 Time graphs for determination of the failure-free period .41
7 Pilot-production screening .51
7.1 General .51
7.2 Collection of information.51
7.3 Evaluation of information.51
7.4 Re-evaluating the failure-free period T .53
M
8 Mature production screening .55
8.1 General .55
8.2 Collection of information.55
8.3 Evaluation of information.55
8.4 Dealing with discrepancies .55
8.5 Eliminating reliability stress screening .59
Annex A (informative) Stress conditions – General information .61
Annex B (informative) Stress conditions – Temperature .67
Annex C (informative) Stress conditions – Vibration and bump .75
Annex D (informative) Stress conditions – Humidity .87
Annex E (informative) Stress conditions – Operational stress .93
Annex F (informative) Voltage stress .97
Annex G (informative) Highly accelerated stress screening.99
Annex H (informative) Bimodal distributions – Weibull plotting and analysis.101
Annex I (informative) Evaluation of the failure-free period and the average screening
duration.113
Annex J (informative) Worked example .133
Bibliography.161

61163-1  IEC:2006 – 5 –
Figure 1 – Conceptual difference between reliability screening and growth .15
Figure 2 – Typical flow for the design and modifications of reliability stress screening
processes for repairable assemblies .17
Figure 3 – Typical flow of hardware assemblies from the component manufacturer to
the end user .21
Figure 4 – Reliability stress screening of repairable assemblies.29
Figure 5 – Dependency of categories of failures .33
Figure 6 – Elements of stress conditioning.33
Figure 7 – Assembly showing screening duration.37
Figure 8 – Time graphs for the determination of the failure free period .43
Figure 9 – Example of an experimentally determined Weibull curve that is levelling off
at p % failures.53
1,5
t
 
-
 
 
Figure H.1 – The S-curve for a bimodal Weibull distribution mixed by F (t) = 1− e
1,5
 t 
 
-
 
60 000
 
and F (t) = 1− e in the proportions 15 % and 85 %, respectively .103
Figure H.2 – Estimation of p, β and η for the purpose of reliability screening
1 1
optimization .105
Figure H.3 – The c.d.f. curves for bimodal exponential distribution.109
Figure H.4 – The hazard rate function for bimodal exponential distribution.111
Figure I.1 – The basic system .113
Figure I.2 – An assembly surviving the screening period T with n remaining
RE
M
weak components .117
Figure I.3 – Possible states when a component fails during the stress screening .117
Figure I.4 – Assembly states after failure and repair .117
Figure I.5 – Time graph for evaluation of the failure-free screening period .121
Figures I.6a and I.6b – Average screening duration versus the normalized failure-free
T
M
period – p = 0,000 5 and p = 0,001 .125
c c
m
F1
Figures I.6c and I.6d – Average screening duration versus the normalized failure-free
T
M
period  – p = 0,002 and p = 0,005 .
...