Copper and copper alloys - Strip for lead frames

This European Standard specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with width up to and including 100 mm. Thickness from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknesses from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices.

Kupfer und Kupferlegierungen - Bänder für Systemträger

Diese Europäische Norm legt die Zusammensetzung, die Anforderungen an die Eigenschaften, Grenzabmaße und Formtoleranzen von Bändern aus Kupfer und Kupferlegierungen für Systemträger mit einer Breite bis 100 mm fest. Dicken von 0,1 mm bis 1,0 mm werden im allgemeinen für gestanzte Systemträger für integrierte Schaltkreise und Bauelemente mit niedriger Leistung verwendet, und Dicken von 1,0 mm bis 2,0 mm werden im allgemeinen für gestanzte Systemträger für Bauelemente mit hoher Leistung verwendet.

Cuivre et alliages de cuivre - Bandes pour grilles de composants (lead frames)

La présente norme européenne spécifie la composition, les caractéristiques et les tolérances de dimensions et de formes des bandes en cuivre et alliages de cuivre destinées à la fabrication des grilles de composants d'une largeur jusqu'à et y compris 100 mm. Les épaisseurs comprises entre 0,1 mm et 1,0 mm inclus sont généralement utilisées pour les grilles embouties de circuits intégrés et dispositifs à faible puissance, et les épaisseurs comprises entre 1,0 mm et 2,0 mm inclus pour les grilles embouties de dispositifs à forte puiss.

Baker in bakrove zlitine - Trak za nosilce s priključki za polprevodniške komponente

General Information

Status
Published
Publication Date
16-Dec-1997
Withdrawal Date
29-Jun-1998
ICS
77.150.30 - Copper products
Technical Committee
CEN/TC 133 - Copper and copper alloys
Drafting Committee
CEN/TC 133/WG 2 - Rolled flat products
Current Stage
9093 - Decision to confirm - Review Enquiry
Start Date
16-Nov-2023
Completion Date
14-Apr-2025
Ref Project
SIST EN 1758:2000 - Copper and copper alloys - Strip for lead frames

Overview

EN 1758:1997 - Copper and copper alloys - Strip for lead frames (CEN) defines requirements for copper and copper‑alloy strip used as lead frame material in electronic packaging. The standard covers composition, property requirements and tolerances on dimensions and form for strip with widths up to 100 mm and thickness ranges typically used for stamped lead frames. It applies across common thickness bands: 0.10 mm–1.00 mm (generally for integrated circuits and low‑power devices) and 1.00 mm–2.00 mm (generally for high‑power devices).

Key topics and requirements

  • Material scope: Copper and copper alloy strip specified for lead‑frame manufacture.
  • Dimensional limits: Width up to and including 100 mm; defined thickness bands for low‑ and high‑power applications.
  • Tolerances and form: Requirements on thickness, width, flatness and edge condition to ensure consistent stamping, forming and assembly.
  • Property requirements: Mechanical and physical properties necessary for stamping, plating and bonding during lead‑frame production (as specified by the standard).
  • Intended use: Strip supplied for manufacture of stamped lead frames for integrated circuits and power devices.

Note: EN 1758 sets the framework and acceptance criteria; specific production controls, plating processes and device‑level assembly requirements are addressed by complementary manufacturing and electronic‑packaging practices.

Applications

  • Production of stamped lead frames for integrated circuits (ICs), semiconductor packages and low‑power devices.
  • Manufacture of thicker lead frames for high‑power devices where mechanical strength and current capacity are greater concerns.
  • Use by strip suppliers to certify material conformity and by electronics manufacturers to specify supplied strip suitable for their stamping and plating process steps.

Keywords: EN 1758:1997, copper and copper alloys, strip for lead frames, lead frame material, integrated circuits, high power devices, dimensional tolerances.

Who should use this standard

  • Material and strip suppliers validating product conformity.
  • Lead‑frame stampers and semiconductor packagers specifying incoming material.
  • Quality engineers and procurement teams sourcing copper alloy strip for electronic assembly.
  • Designers and process engineers concerned with stamping, plating and assembly compatibility.

Related standards

Refer to other CEN, IEC or national standards covering copper alloys, electronic packaging and plating/attachment processes for complementary requirements and device‑level specifications.

Frequently Asked Questions

EN 1758:1997 is a standard published by the European Committee for Standardization (CEN). Its full title is "Copper and copper alloys - Strip for lead frames". This standard covers: This European Standard specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with width up to and including 100 mm. Thickness from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknesses from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices.

This European Standard specifies the composition, property requirements and tolerances on dimensions and form for copper and copper alloy strip for lead frame material, with width up to and including 100 mm. Thickness from 0,1 mm up to and including 1,0 mm, generally used for stamped lead frames for integrated circuits and low power devices and thicknesses from 1,0 mm up to and including 2,0 mm are generally used for stamped lead frames for high power devices.

EN 1758:1997 is classified under the following ICS (International Classification for Standards) categories: 77.150.30 - Copper products. The ICS classification helps identify the subject area and facilitates finding related standards.

EN 1758:1997 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.

Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.YRGQLãNHNRPSRQHQWHKupfer und Kupferlegierungen - Bänder für SystemträgerCuivre et alliages de cuivre - Bandes pour grilles de composants (lead frames)Copper and copper alloys - Strip for lead frames77.150.30Bakreni izdelkiCopper productsICS:Ta slovenski standard je istoveten z:EN 1758:1997SIST EN 1758:2000en01-november-2000SIST EN 1758:2000SLOVENSKI
STANDARD
SIS
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