IEC
WG 36 - TC 40/WG 36
TC 40/WG 36
General Information
Status
Active
Work Field
Information technology
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IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.
- Technical report24 pagesEnglish and French languagesale 15% off
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