kSIST FprEN IEC 60115-4:2025

SLOVENSKI STANDARD
oSIST prEN IEC 60115-4:2024
01-december-2024
Stalni upori za elektronsko opremo - 4. del: Področna specifikacija: Močnostni
upori za montažo skozi prehodne luknje tiskanih vezij ali za pritrditev na šasijo
Fixed resistors for use in electronic equipment - Part 4: Sectional specification: Power
resistors for through hole assembly on circuit boards (THT) or for assembly on chassis
Résistances fixes utilisées dans les équipements électroniques - Partie 4: Spécification
intermédiaire: Résistances de puissance pour assemblage par trous traversants sur
cartes de circuit imprimé (carte THT) ou pour assemblage sur châssis
Ta slovenski standard je istoveten z: prEN IEC 60115-4:2024
ICS:
31.040.10 Fiksni upor Fixed resistors
oSIST prEN IEC 60115-4:2024 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

oSIST prEN IEC 60115-4:2024
oSIST prEN IEC 60115-4:2024
EUROPEAN STANDARD DRAFT
prEN IEC 60115-4
NORME EUROPÉENNE
EUROPÄISCHE NORM
October 2024
ICS 31.040.10 Will supersede EN 140200:1996; EN
140200:1996/A1:2001
English Version
Fixed resistors for use in electronic equipment - Part 4: Sectional
specification: Power resistors for through hole assembly on
circuit boards (THT) or for assembly on chassis
(IEC 60115-4:2022)
To be completed To be completed
(IEC 60115-4:2022) (IEC 60115-4:2022)
This draft European Standard is submitted to CENELEC members for enquiry.
Deadline for CENELEC: 2024-12-27.

The text of this draft consists of the text of IEC 60115-4:2022 (40/2920/CDV).

If this draft becomes a European Standard, CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

This draft European Standard was established by CENELEC in three official versions (English, French, German).
A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.

Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2024 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Project: 78798 Ref. No. prEN IEC 60115-4:2024 E

oSIST prEN IEC 60115-4:2024
prEN IEC 60115-4:2024 (E)
European foreword
This document (prEN IEC 60115-4:2024) consists of the text of document IEC 60115-4:2022, prepared
by IEC/TC 40 "Capacitors and resistors for electronic equipment".
This document is currently submitted to the Enquiry.
The following dates are proposed:
•
latest date by which the existence of this document (doa) dor + 6 months
has to be announced at national level
• latest date by which this document has to be (dop) dor + 12 months
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) dor + 36 months
conflicting with this document have to be withdrawn (to be confirmed or
modified when voting)
This document will supersede EN 140200:1996 and all of its amendments and corrigenda (if any).
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure of the generic specification EN 60115-1:2023, where
the tests of prior Clause 4 are given in Clauses 6 to 12 now;
b) the definitions of product technologies and product classification levels of the generic specification,
IEC 60115-1:2020, have been adopted;
c) a basis for the optional specification of the lead eccentricity of axial leaded resistors has been
amended in 4.2;
d) the ‘period-pulse high-voltage overload test’ of IEC 60115-1:2020, 8.3 has been adopted as default
test method in 5.3.9, thereby replacing the legacy test ‘periodic-pulse overload test if
IEC 60115-1:2020, 8.4;
e) the revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.22 and 5.3.23;
f) the combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in in 5.3.25;
g) the ‘endurance at room temperature test’ of IEC 60115-1:2020, 7.2 has been reworked and adopted
in 5.3.5;
h) the ‘single-pulse high-voltage overload test’ of IEC 601115-1:2020, 8.2, applied with the pulse
shape 10/700 in 5.3.8, is complemented with the optional alternative provided by the pulse shape
1,2/50;
i) climatic tests for ‘operation at low temperature’ of IEC 60115-1:2020, 10.2, and for ‘damp heat,
steady state, accelerated’ of IEC 60115-1:2020, 10.4, have been adopted as optional tests in 5.4.5.
and 5.4.6, respectively;
j) inclusion of an optional flammability test as 5.4.8;
k) new guidance is provided in 6.2 on the presentation of stability requirements with their permissible
absolute and relative deviations;
oSIST prEN IEC 60115-4:2024
prEN IEC 60115-4:2024 (E)
l) acceptance criteria for the visual inspection have been added in 6.5 and in Annex B;
m) visual inspection for the primary and proximity packaging has been added in 6.5.3 and in 7.2
n) the periodical evaluation of termination platings has been added as a new topic of quality
assessment in 9.8;
o) a new Annex C has been added to summarize workmanship requirements for the assembly of
leaded power resistors, e.g. as given in the prior IEC 61192 series of standards;
p) the informative Annex F on radial formed styles has been amended with details on a formed Z-bend
style for surface-mount assembly;
q) furthermore, this edition cancels and replaces the old CECC based EN edition published in 1996
and constitutes revisions related to tables and figures. (see Annex X)
Preceding documents on the subject covered by this specification have been:
— EN 140200:1996 + EN 140200:1996/A1:2001
— CECC 40 200:1981-00, 1973-00

oSIST prEN IEC 60115-4:2024
oSIST prEN IEC 60115-4:2024
IEC 60115-4 ®
Edition 3.0 2022-11
INTERNATIONAL
STANDARD
colour
inside
Fixed resistors for use in electronic equipment –

Part 4: Sectional specification: Power resistors for through hole assembly on

circuit boards (THT) or for assembly on chassis

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.040.10 ISBN 978-2-8322-6088-3

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CONTENTS
FOREWORD . 8
1 Scope . 11
2 Normative references . 11
3 Terms, definitions, product types, product technologies and product classification. 12
3.1 Terms and definitions . 12
3.2 Product types . 13
3.2.1 General . 13
3.2.2 Axial type . 13
3.2.3 Radial type . 13
3.2.4 Vertical type . 14
3.2.5 Tubular types . 14
3.2.6 Metal housed wire-wound resistors . 15
3.2.7 Any other type . 15
3.3 Resistor encapsulation and material of termination . 15
3.3.1 Conformal lacquer coat . 15
3.3.2 Silicone cement coating . 15
3.3.3 Enamel coating . 16
3.3.4 Ceramic housed resistor . 16
3.3.5 Wire termination . 16
3.4 Product technologies . 16
3.4.1 General . 16
3.4.2 Metal film technology . 17
3.4.3 Metal glaze technology . 17
3.4.4 Metal oxide technology . 17
3.4.5 Wire-wound technology . 17
3.4.6 Metal strip technology . 17
3.4.7 Any other technology . 18
3.5 Product classification . 18
4 Preferred characteristics . 18
4.1 General . 18
4.2 Preferred types, styles and dimensions . 18
4.2.1 Axial type . 18
4.2.2 Ceramic housed type with axial lead wires . 22
4.2.3 Ceramic housed type with radial lead wires . 23
4.2.4 Radial or vertical ceramic housed type and dimensions . 25
4.2.5 Tubular type of power resistors . 26
4.2.6 Other types . 27
4.3 Preferred climatic categories . 27
4.4 Resistance . 28
4.5 Tolerances on resistance . 28
4.6 Rated dissipation P . 28
r
4.7 Limiting element voltage U . 30
max
4.8 Insulation voltage U . 30
ins
4.9 Insulation resistance R . 30
ins
5 Tests and test severities . 30
5.1 General provisions for tests invoked by this specification . 30

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5.2 Preparation of specimen . 31
5.2.1 Drying . 31
5.2.2 Mounting of power resistors on test boards . 31
5.2.3 Mounting of power resistors on test racks . 32
5.2.4 Specification of test boards/ racks for any other type of high-power

resistors . 34
5.3 Details of applicable tests . 34
5.3.1 Resistance . 34
5.3.2 Temperature coefficient of resistance . 34
5.3.3 Temperature rise . 35
5.3.4 Endurance at the rated temperature 70 °C . 35
5.3.5 Endurance at room temperature . 36
5.3.6 Endurance at a maximum temperature: UCT with category dissipation . 37
5.3.7 Short-term overload . 37
5.3.8 Single-pulse high-voltage overload test . 38
5.3.9 Periodic-pulse high-voltage overload test . 38
5.3.10 Visual examination . 40
5.3.11 Gauging of dimensions . 40
5.3.12 Detail dimensions . 41
5.3.13 Robustness of the resistor body . 41
5.3.14 Robustness of terminations . 41
5.3.15 Bump . 42
5.3.16 Shock . 42
5.3.17 Vibration . 42
5.3.18 Rapid change of temperature . 43
5.3.19 Rapid change of temperature, ≥ 100 cycles . 43
5.3.20 Climatic sequence . 43
5.3.21 Damp heat, steady state . 44
5.3.22 Solderability, with lead-free solder . 45
5.3.23 Solderability, with SnPb solder . 46
5.3.24 Resistance to soldering heat . 46
5.3.25 Solvent resistance . 47
5.3.26 Insulation resistance . 47
5.3.27 Voltage proof . 47
5.4 Optional and/or additional tests . 48
5.4.1 Single-pulse high-voltage overload test . 48
5.4.2 Periodic-pulse overload test . 48
5.4.3 Electrostatic discharge (ESD) . 49
5.4.4 Robustness of threaded stud or screw terminations . 49
5.4.5 Operation at low temperature. 50
5.4.6 Damp heat, steady state, accelerated . 50
5.4.7 Accidental overload test. 51
5.4.8 Flammability . 51
6 Performance requirements. 52
6.1 General . 52
6.2 Limits for change of resistance at test . 52
6.3 Temperature coefficient of resistance . 54
6.4 Temperature rise . 54
6.5 Visual inspection . 55

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6.5.1 General visual criteria . 55
6.5.2 Visual criteria after tests . 55
6.5.3 Visual criteria for the packaging . 55
6.6 Solderability . 55
6.7 Insulation resistance . 56
6.8 Flammability . 56
6.9 Accidental overload test . 56
7 Marking, packaging and ordering information . 56
7.1 Marking of the component . 56
7.2 Packaging . 56
7.3 Marking of the packaging . 57
7.4 Ordering information . 57
8 Detail specifications . 57
8.1 General . 57
8.2 Information to be specified in a detail specification . 58
8.2.1 Outline drawing or illustration . 58
8.2.2 Type, style, and dimensions . 58
8.2.3 Climatic category . 58
8.2.4 Resistance range . 58
8.2.5 Tolerances on rated resistance . 58
8.2.6 Rated dissipation P . 58
8.2.7 Limiting element voltage U . 59
max
8.2.8 Insulation voltage U . 59
ins
8.2.9 Insulation resistance R . 59
ins
8.2.10 Tests and test severities . 59
8.2.11 Limits of resistance change after testing . 59
8.2.12 Temperature coefficient of resistance . 59
8.2.13 Marking . 59
8.2.14 Ordering information . 59
8.2.15 Mounting . 59
8.2.16 Storage. 60
8.2.17 Transportation . 60
8.2.18 Additional information . 60
8.2.19 Quality assessment procedures . 60
9 Quality assessment procedures . 60
9.1 General . 60
9.2 Definitions. 60
9.2.1 Primary stage of manufacture . 60
9.2.2 Structurally similar components . 60
9.2.3 Assessment level EZ . 61
9.3 Formation of inspection lots . 61
9.4 Approved component (IECQ AC) procedures . 62
9.5 Qualification approval (QA) procedures . 62
9.5.1 General . 62
9.5.2 Qualification approval . 62
9.5.3 Quality conformance inspection . 62
9.6 Capability certification (IECQ AC-C) procedures . 63
9.7 Technology certification (IECQ-AC-TC) procedures . 63

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9.8 Periodical evaluation of termination platings . 63
9.9 Delayed delivery . 63
9.10 Certified test records. 63
9.11 Certificate of conformity (CoC) . 63
Annex A (normative) Symbols and abbreviated terms . 74
A.1 Symbols . 74
A.2 Abbreviated terms . 77
Annex B (normative) Visual inspection acceptance criteria. 79
B.1 General . 79
B.2 Acceptance criteria for a general visual inspection of body of specimens . 79
B.3 Acceptance criteria for a general visual inspection of the terminals . 79
B.4 Acceptance criteria for a general visual inspection of specimen after test . 79
Annex C (normative) Workmanship requirements for the assembly of power resistors. 80
C.1 General . 80
C.2 Lead forming . 80
C.2.1 General . 80
C.2.2 Means for support of mounting height . 81
C.3 Mounting . 82
C.3.1 General . 82
C.3.2 Lateral mounting . 83
C.3.3 Upright mounting . 84
C.4 Lead trimming . 85
Annex D (informative) Zero ohm resistors (jumpers) . 87
Annex E (informative) Guide on the application of optional and/or additional tests . 88
E.1 General . 88
E.2 Endurance at room temperature . 88
E.3 Single-pulse high-voltage overload test . 89
E.4 Periodic-pulse overload test . 90
E.5 Operation at low temperature . 91
E.6 Damp heat, steady state, accelerated . 92
E.7 Accidental overload test . 93
E.8 Flammability test . 94
E.9 Electrostatic discharge test (ESD) . 95
E.10 Robustness of threaded stud or screw terminations . 96
Annex F (informative) Radial formed types from axial styles . 98
F.1 General . 98
F.1.1 Applicability of this annex . 98
F.1.2 Denomination of radial formed styles . 98
F.1.3 Coated lead wires . 100
F.1.4 Means for support of mounting height . 100
F.1.5 Means for retention . 101
F.2 Radial formed types for through hole assembly . 101
F.2.1 Radial formed style with lateral body position . 101
F.2.2 Radial formed style with upright body position . 103
F.3 Radial formed types for surface-mount assembly . 105
F.4 Packaging . 106
F.4.1 Packaging of resistors formed for through-hole assembly . 106
F.4.2 Packaging of resistors formed for surface-mount assembly . 107

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F.5 Quality assessment . 107
F.5.1 General . 107
F.5.2 Quality assessment of formed resistors . 107
F.5.3 Forming of finished resistors of assessed quality . 108
F.5.4 Special inspection requirements . 108
Annex X (informative) Cross references for the prior revision of this specification . 109
Bibliography . 112

Figure 1 – Illustrations of typical axial leaded power resistors . 13
Figure 2 – Illustrations of typical radial leaded power resistors . 13
Figure 3 – Illustrations of typical vertical leaded power resistors with punched
terminals . 14
Figure 4 – Illustrations of typical tubular type power resistors . 14
Figure 5 – Illustrations of typical metal housed power resistors . 15
Figure 6 – Shape and dimensions of cylindrical axial leaded resistors . 19
Figure 7 – Alternative methods for specification of the length of excessive protective
coating or welding beads on axial leaded resistors . 20
Figure 8 – Lead-wire spacing of axial leaded resistors with bent leads . 21
Figure 9 – Specification of the lead eccentricity of axial leaded resistors . 22
Figure 10 – Shape and dimensions of axial leaded ceramic housed resistors . 22
Figure 11 – Shape and dimensions of radial type ceramic resistors . 24
Figure 12 – Shape and dimensions of radial leaded ceramic resistors . 25
Figure 13 – Shape and dimensions of tubular resistors . 26
Figure 14 – Typical derating curve for MET > UCT . 29
Figure 15 – Typical derating curve for power wire-wound resistors . 29
Figure 16 – Assembly of specimen to the test board . 32
Figure 17 – Mounting of axial leaded specimens on a rack, top view . 33
Figure 18 – Examples of specimen lead fixation devices . 34
Figure C.1 – Lead forming dimensions . 80
Figure C.2 – Examples of mounting height support . 82
Figure C.3 – Clearance between coating and solder . 83
Figure C.4 – Lateral mounting . 83
Figure C.5 – Upright mounting . 84
Figure C.6 – Lead protrusion . 85
Figure C.7 – Lead end distortion . 86
Figure F.1 – Production flow and different scopes of quality assurance . 99
Figure F.2 – Shape and dimensions of radial formed resistor for lateral body position . 101
Figure F.3 – Shape and dimensions of radial formed resistor for lateral body position
with kinked lead wires . 101
Figure F.4 – Shape and dimensions of radial formed resistor for upright body position. 103
Figure F.5 – Shape and dimensions of radial formed resistor for upright body position
and wide spacing . 103
Figure F.6 – Shape and dimensions of radial formed resistor for upright body position
and wide spacing, with kinked lead wire . 104
Figure F.7 – Shape and dimensions of radial formed resistor for surface-mount

assembly (Z-bend) . 105

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Figure F.8 – Land pattern dimensions for surface-mount assembly . 106

Table 1 – Examples of preferred styles of cylindrical axial leaded power resistors . 19
Table 2 – Examples of preferred styles of axial leaded ceramic housed resistors . 23
Table 3 – Examples of preferred styles of radial type ceramic resistors. 24
Table 4 – Preferred styles of radial or vertical mount ceramic resistors . 26
Table 5 – Example of preferred styles of tubular types of power resistors . 27
Table 6 – Preferred alternative overload conditions . 40
Table 7 – Limits for resistance variations at tests . 53
Table 8 – Permitted change of resistance due to the temperature coefficient of
resistance . 54
Table 9 – Test schedule for the qualification approval of power resistors . 64
Table 10 – Test schedule for quality conformance inspection of power resistors . 69
Table C.1 – Lead bend radius . 81
Table C.2 – Recommended circuit board bore diameters . 82
Table C.3 – Clearance of lateral mounted resistors . 84
Table E.1 – Implementation of the test endurance at room temperature . 89
Table E.2 – Implementation of the single-pulse high-voltage overload test . 90
Table E.3 – Implementation of the periodic-pulse overload test . 91
Table E.4 – Implementation of the operation at low temperature test . 92
Table E.5 – Implementation of the test damp heat, steady state, accelerated . 93
Table E.6 – Implementation of the test accidental overload test . 94
Table E.7 – Implementation of the test flammability . 95
Table E.8 – Implementation of the test Electrostatic discharge (ESD) . 96
Table E.9 – Implementation of the test Robustness of threaded stud or screw

terminations . 97
Table F.1 – Feasible lead-wire spacing of radial formed resistor for
lateral body position . 102
Table F.2 – Feasible lead-wire spacing of radial formed resistor for
upright body position . 105
Table X.1 – Cross reference for references to clauses . 110
Table X.2 – Cross reference for references to figures . 111
Table X.3 – Cross reference for references to tables . 111

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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT –

Part 4: Sectional specification: Power resistors for through hole
assembly on circuit boards (THT) or for assembly on chassis

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 60115-4 has been prepared by IEC technical committee 40: Capacitors and resistors for
electronic equipment. It is an International Standard.
This third edition cancels and replaces the second edition published in 1982 and
Amendment 1:1993. This edition constitutes a technical revision and includes test conditions
and requirements for lead-free soldering and assessment procedures meeting the requirements
of a "zero defect" approach.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the definitions of product technologies and product classification levels of the generic
specification, IEC 60115-1:2020, have been adopted;
b) a basis for the optional specification of the lead eccentricity of axial leaded resistors has
been amended in 4.2;
oSIST prEN IEC 60115-4:2024
IEC 60115-4:2022 © IEC 2022 – 9 –
c) the 'period-pulse high-voltage overload test' of IEC 60115-1:2020, 8.3 has been adopted as
default test method in 5.3.9, thereby replacing the legacy test 'periodic-pulse overload test
of IEC 60115-1:2020, 8.4;
d) the revised solderability test of IEC 60115-1:2020, 11.1 has been adopted in 5.3.22 and
5.3.23;
e) the combined solvent resistance test of IEC 60115-1:2020, 11.3 has been adopted in 5.3.25;
f) the 'endurance at room temperature test' of IEC 60115-1:2020, 7.2 has been reworked and
adopted in 5.3.5;
g) the 'single-pulse high-voltage overload test' of IEC 60115-1:2020, 8.2, applied with the pulse
shape 10/700 in 5.3.8, is complemented with the optional alternative provided by the pulse
shape 1,2/50 in 5.4.1.
h) climatic te
...