SIST EN 60115-1:2023
(Main)Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2020 (MOD)
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115-1:2020 (MOD)
This part of EN 60115 is a generic specification and is applicable to fixed resistors for use in electronic equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 1: Fachgrundspezifikation (IEC 60115-1:2020 (MOD)
Résistances fixes utilisées dans les équipements électroniques - Partie 1: Spécification générique (IEC 60115-1:2020 (MOD)
L'IEC 60115-1:2020 est une spécification générique et s'applique aux résistances fixes utilisées dans les équipements électroniques. Elle définit les termes normalisés, les procédures d'examen et les méthodes d'essai utilisés dans les spécifications intermédiaires et particulières des composants électroniques dans le cadre de l'assurance qualité, ainsi qu'à d'autres fins.
Cette édition contient les modifications techniques majeures suivantes par rapport à l'édition précédente:
- cette 5e édition s'appuie sur une nouvelle structure de document, dans laquelle les essais du précédent Article 4 sont désormais présentés de l'Article 6 à l'Article 12, avec une Annexe X informative donnant des références croisées vers la version précédente de la présente norme;
- les termes et définitions ont été révisés et amendés, complétés par une nouvelle section relative aux technologies en matière de résistance et une nouvelle section relative aux niveaux de classification des produits;
- un nouveau Paragraphe 4.7 relatif aux recommandations en matière de remplacements admis a été ajouté;
- les dispositions en matière d'emballage, de stockage et de transport de 4.8, 4.9 et 4.10 ont été intégralement révisées;
- un nouveau Paragraphe 5.3 relatif aux tolérances par défaut pour la plupart des paramètres d'essai habituels a été ajouté;
- la méthode générique de résistance de mesure (5.6 désormais) a été séparée de l'essai pour des raisons de conformité avec une valeur de résistance spécifiée en 6.1, en révision du précédent 4.5;
- l'essai de coefficient de température de résistance de 6.2 est une révision du précédent essai de 4.8 (Variation de la résistance avec la température), des concessions particulières sur les résistances inférieures à 10 Ω ayant été consenties;
- les méthodes d'essai d'endurance de 7.1 à 7.3 (précédemment 4.25.1 à 4.25.3) ont été intégralement révisées;
- l'essai de surcharge haute tension à une seule impulsion de 8.2 (précédemment 4.27) a été intégralement révisé. Il propose désormais des sévérités pour la forme d'onde des impulsions 1,2/50 et la forme d'onde des impulsions 10/700 au profit de spécifications particulières avec signification améliorée;
- l'essai de surcharge haute tension à impulsions périodiques de 8.3 (précédemment 4.28) a été révisé et un tableau corrigé des sévérités est fourni;
- l'essai de surcharge à impulsions périodiques de 8.4 (précédemment 4.39) a été déconseillé et simplifié pour ne présenter que la sévérité historiquement appliquée dans les spécifications subordonnées;
- le Paragraphe 9.1 relatif à l'examen visuel, le Paragraphe 9.2 relatif au calibrage des dimensions et le Paragraphe 9.3 relatif à l'évaluation des dimensions détaillées (toutes les parties de l'ancien 4.4) ont été intégralement révisés;
- les essais de robustesse des sorties (précédemment 4.16) ont été révisés et divisés en essais de robustesse des bornes soudables (9.5) et essais de robustesse des bornes à tiges filetées ou à vis (9.6);
- l'essai de secousses de 9.9 (précédemment 4.20) et l'essai de choc de 9.10 (précédemment 4.21) ont été révisés pour refléter la norme d'essai pertinente fusionnée IEC 60068-2-29;
- l'essai de chaleur sèche et à froid de la séquence climatiqu
Fiksni upori za elektronsko opremo - 1. del: Splošna specifikacija (IEC 60115-1:2020, spremenjen)
Ta del standarda EN 60115 je splošna specifikacija in se uporablja za stalne upore za uporabo v elektronski opremi.
Določa splošne pogoje, inšpekcijske postopke in preskusne metode za uporabo v sekcijskih in podrobnih specifikacijah elektronskih komponent za oceno kakovosti ali kateri koli drug namen.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 60115-1:2023
01-maj-2023
Fiksni upori za elektronsko opremo - 1. del: Splošna specifikacija (IEC 60115-
1:2020, spremenjen)
Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 60115
-1:2020 (MOD)
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 1:
Fachgrundspezifikation (IEC 60115-1:2020 (MOD)
Résistances fixes utilisées dans les équipements électroniques - Partie 1: Spécification
générique (IEC 60115-1:2020 (MOD)
Ta slovenski standard je istoveten z: EN 60115-1:2023
ICS:
31.040.10 Fiksni upor Fixed resistors
SIST EN 60115-1:2023 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 60115-1:2023
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SIST EN 60115-1:2023
EUROPEAN STANDARD EN 60115-1
NORME EUROPÉENNE
EUROPÄISCHE NORM March 2023
ICS 31.040.10 Supersedes EN 60115-1:2011;
EN 60115-1:2011/A11:2015
English Version
Fixed resistors for use in electronic equipment - Part 1: Generic
specification
(IEC 60115-1:2020, modified)
Résistances fixes utilisées dans les équipements Festwiderstände zur Verwendung in elektronischen Geräten
électroniques - Partie 1: Spécification générique - Teil 1: Fachgrundspezifikation
(IEC 60115-1:2020, modifiée) (IEC 60115-1:2020, modifiziert)
This European Standard was approved by CENELEC on 2023-02-13. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 60115-1:2023 E
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
Contents Page
1 Modification to the Introduction . 5
2 Modification to Clause 1 . 5
3 Modification to Clause 2 . 5
4 Modification to Clause 5 . 5
5 Modification to Clause 9 . 5
6 Modification to Annex B . 5
7 Modification to Annex C . 7
8 Modification to Annex Q . 9
9 Modification to Annex R . 9
10 Modification to Annex X . 10
11 Addition of Annex ZA . 11
12 Addition of a new Annex ZX. 14
13 Modification of the Bibliography . 18
2
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
European foreword
This document (EN 60115-1:2023) consists of the text of IEC 60115-1:2020 prepared by IEC/TC 40,
“Capacitors and resistors for electronic equipment”, together with the common modifications prepared by the
CLC TC/40XB, “Resistors”.
The following dates are fixed:
• latest date by which this document has to be (dop) 2024-02-13
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) 2026-02-13
conflicting with this document have to be withdrawn
This document supersedes EN 60115-1:2011 + EN 60115-1:2011/A11:2015.
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure, where the tests of prior Clause 4 are given in
Clauses 6 to 12 now, with an informative Annex ZX providing cross-references for references to the
prior revision of this standard;
b) the terms and definitions have been revised and amended, supplemented by a new section on resistor
technologies and a new section on product classification levels;
c) a new Subclause 4.7 on recommendations for permissible substitutions has been added;
d) the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10 have been
completely revised;
e) a new Subclause 5.3 on default tolerances for the most common test parameters has been added;
f) the generic method of measuring resistance, now Sublause 5.6, has been separated from the test for
compliance with a prescribed resistance value in 6.1, as a revision of the prior 4.5;
g) the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the prior test 4.8,
variation of resistance with temperature, where the special concessions for resistors below 10 Ω have
been waived;
h) the single-pulse high-voltage overload test of Subclause 8.2 (prior 4.27) has been completely revised;
i) the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been revised and a
corrected table of severities provided;
j) the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and streamlined to
only offer the severity historically applied in subordinate specifications;
k) the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the assessment
of detail dimensions (all parts of prior 4.4) have been completely revised;
l) the tests for robustness of terminations (prior 4.16) have been revised and separated into tests for the
robustness of solderable terminations, Subclause 9.5, and tests for the robustness of threaded stud or
screw terminations, Subclause 9.6;
3
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
m) the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior 4.21) have been
revised to reflect the merged relevant test standard EN 60068-2-29;
n) the accelerated damp heat, steady-state test of Subclause 10.5 (prior 4.37) has been amended with an
option for a reduced number of bias voltages;
o) the corrosion test of Subclause 10.6 has been completely revised in order to employ the better suitable
test method of EN 60068-2-52 instead of the prior used EN 60068-2-11;
p) the whisker growth test of 10.7 has been revised to reflect the changes of the new revision of the test
methods of EN IEC 60068-2-82;
q) the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to soldering heat of
Subclause 11.2 (prior 4.18) have been completely revised to incorporate the necessary option for the
variety of lead-bearing and lead-free solder alloys and respective process conditions;
r) the solvent resistance test of 11.3 combines the prior tests 4.29, component solvent resistance, and
4.30, solvent resistance of marking, in one test;
s) the accidental overload test of Subclause 12.3 (prior 4.26) has been completely revised.
Preceding documents on the subject covered by this specification have been:
— EN 60115-1:2001 + EN 60115-1:2001/A1:2001 + EN 60115-1:2001/A11:2007
— EN 140000:1993-12
— CECC 40 000:1973-00, 1979-00.
Clauses, subclauses, annexes, notes, tables and figures which are additional to those in IEC 60115-1:2020 are
prefixed “Z”.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent
rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A complete
listing of these bodies can be found on the CENELEC website.
4
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
1 Modification to the Introduction
Add the following new paragraph after the existing first paragraph:
“The explanation given in this introduction uses IEC documents as examples. Anyhow, the same principles
apply in unison to respective documents with EN or EN IEC prefix.”
2 Modification to Clause 1
Replace the first paragraph with the following:
“This part of EN 60115 is a generic specification and is applicable to fixed resistors for use in electronic
equipment.”
3 Modification to Clause 2
3.1 Modify the normative reference to IECQ 03-1:2018 as follows:
IECQ 03-1:2020, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
procedure — Part 1: General Requirements for all IECQ Schemes
3.2 Add the following two entries:
IECQ 03-3:2018, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
Procedure – Part 3: IECQ Approved Component Products, Related Materials and Assemblies Scheme
IECQ 03-3-1:2018, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
Procedure – Part 3-1: IECQ Approved Component Products, Related Materials and Assemblies Scheme, IECQ
Approved Component – Technology Certification (IECQ AC-TC)
4 Modification to Clause 5
In 5.1, replace the 4th paragraph with the following:
“The performance requirements prescribed by any relevant specification are absolute limits. The policy on
uncertainty of measurements and inset limits, as given in IECQ 03-1:2020, Annex C, shall be applied.”
5 Modification to Clause 9
Replace the 1st paragraph in 9.2.2.1, as well as the 1st paragraph in 9.3.2.1, with the following:
“The limiting dimensions are generally prescribed as absolute limits. The policy on inset limits in accordance
with IECQ 03-1:2020, Annex C, shall be applied to the preparation of gauges or other representations of the
required acceptance windows.”
6 Modification to Annex B
Replace Annex B with the following:
“
5
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
Annex B
(normative)
Rules for the preparation of detail specifications for resistors and
capacitors for electronic equipment for use within the IECQ system
B.1 The drafting of a complete detail specification, in line with the CEN/CENELEC Internal Regulations, shall
begin only when all the following conditions have been met:
a) the generic specification has been approved;
b) the sectional specification, if appropriate, has been circulated for approval according to the relevant system
rules (e.g. FDIS, or unanimously approved CDV, at IEC);
c) the associated blank detail specification has been circulated for approval according to the relevant system
rules (e.g. FDIS, or unanimously approved CDV, at IEC);
B.2 Detail specifications shall use the standard or preferred values, ratings and characteristics, and severities
for environmental tests, etc. which are given in the appropriate generic or sectional specifications.
An exception to this rule may only be granted for a specified detail specification, if agreed by the technical
committee.
B.3 The detail specification should not be circulated for approval according to the relevant system rules (e.g.
FDIS, or unanimously approved CDV, at IEC) until the sectional and blank detail specifications have been
approved for publication.”
6
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
7 Modification to Annex C
Replace Annex C with the following:
“
Annex C
(informative)
Example of a certified test record
Component manufacturer Veriohm Ltd.
Place of manufacture Amper Lane 8, Voltville
Detail specification and issue EN 140401-808:2021
Fixed low power film surface mount (SMD) resistors,
Description of component
Rectangular
Current three months period 2021-01-01 – 2021-03-31
This Certified Test Record is a completed and accurate record of the tests carried out in accordance with the
specified procedures.
Manufacturer
Designated Management Representative (T. Rustworthy)
IECQ Certification Body
Supervising Inspector (S. Crutiny)
7
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
“
8
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
8 Modification to Annex Q
8.1 Modify the indication of Annex Q from informative to normative, as follows:
“Annex Q
(normative)
Quality assessment procedures”
8.2 In Q.1.4, replace the 1st paragraph as follows:
“Rework is the rectification of a processing error, prior to the release of the component, by means not differing
from those used in the current process, or by an explicitly permitted rework process.”
8.3 In Q.1.9, replace the 1st paragraph as follows:
“Repair is the making good of an approved component which has been damaged or has become defective after
its release, and is not permitted under the Rules of Procedure.”
8.4 In Q.1.11, replace the paragraph as follows:
“An organisation may be covered by one certification for more than one location (site) (see IECQ 03-1:2020,
Clause 5 and Annex D, and IECQ 03-3:2018, Clause 5).”
8.5 In Q.2.1, replace the 1st paragraph as follows:
“An IECQ Approved Component certification may be granted to a manufacturer meeting the requirements given
in IECQ 03-1:2020, 9.2 and in IECQ 03-3:2018, Clause 8.”
8.6 In Q.3.5, replace the paragraph as follows:
“QA shall be granted by the Certification Body (CB) when all requirements have been met (see IECQ 03-1:2020,
9.7).”
8.7 In Q.4.2, replace the 1st paragraph as follows:
“An IECQ Approved Component – Capability Certification may be granted to a manufacturer
meeting the requirements given in IECQ 03-1:2020, 9.2 and in IECQ 03-3:2018, D.8.”
8.8 In Q.4.9, replace the 1st paragraph as follows:
“Quality conformance inspections shall be executed according to the provisions of IECQ 03-3:2018, 8.13.3 and
to the respective descriptions of the CM.”
8.9 In Q.5.2, replace the 1st paragraph as follows:
“An IECQ AC-TC may be granted to a manufacturer meeting the requirements given in IECQ 03-1:2018, 9.2
and in IECQ 03-3:2018, Clause 8.”
9 Modification to Annex R
Modify the indication of Annex R from informative to normative, as follows:
“Annex R
(normative)
Failure rate level evaluation, determination and qualification”
In R.1.2, replace the 2nd dash item with the following:
“
9
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
— IECQ Qualification Approval (QA), according to IECQ 03-3:2018, Annex C”;
10 Modification to Annex X
Replace the contents of Annex X with the following:
“This annex, providing cross references for references to IEC 60115-1:2008, has been deleted from this
document. In lieu thereof, see Annex ZX, which is providing cross references for references to EN 60115-1:2011
and EN 60115-1:2011/A11:2015.”
10
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
11 Addition of Annex ZA
Add the following new Annex ZA:
“
Annex ZA
(normative)
Normative references to international publications with their
corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content constitutes
requirements of this document. For dated references, only the edition cited applies. For undated references, the
latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60027 series Letters symbols to be used in electrical - -
technology
IEC 60050 series International electrotechnical vocabulary - -
IEC 60062 - Marking codes for resistors and capacitors EN 60062 -
IEC 60063 - Preferred number series for resistors and EN 60063 -
capacitors
IEC 60068-1 2013 Environmental testing - Part 1: General and EN 60068-1 2014
guidance
IEC 60068-2-1 - Environmental testing - Part 2–1: Tests - Test EN 60068-2-1 -
A: Cold
IEC 60068-2-2 - Environmental testing - Part 2–2: Tests - Test EN 60068-2-2 -
B: Dry heat
IEC 60068-2-6 - Environmental testing - Part 2–6: Tests - Test EN 60068-2-6 -
Fc: Vibration (sinusoidal)
IEC 60068-2-13 - Environmental testing - Part 2–13: Tests - Test EN 60068-2-13 -
M: Low air pressure
IEC 60068-2-14 - Environmental testing - Part 2–14: Tests - Test EN 60068-2-14 -
N: Change of temperature
IEC 60068-2-20 2008 Environmental testing - Part 2–20: Tests - Test EN 60068-2-20 2008
T: Test methods for solderability and resistance
to soldering heat of devices with leads
IEC 60068-2-21 2006 Environmental testing - Part 2–21: Tests - Test EN 60068-2-21 2006
U: Robustness of terminations and integral
mounting devices
IEC 60068-2-27 2008 Environmental testing - Part 2–27: Tests - Test EN 60068-2-27 2009
Ea and guidance: Shock
IEC 60068-2-30 - Environmental testing - Part 2–30: Tests - Test EN 60068-2-30 -
Db: Damp heat, cyclic (12 h + 12 h cycle)
11
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
Publication Year Title EN/HD Year
IEC 60068-2-45 1980 Basic environmental testing procedures - Part EN 60068-2-45 1992
+ AMD 1 1993 2–45: Tests - Test XA and guidance: Immersion + A1 1993
in cleaning solvents
IEC 60068-2-47 - Environmental testing - Part 2–47: Test - EN 60068-2-47 -
Mounting of specimens for vibration, impact and
similar dynamic tests
IEC 60068-2-52 - Environmental testing - Part 2–52: Test – Test EN IEC 60068-2-52 -
Kb: Salt mist, cyclic (sodium chloride solution)
IEC 60068-2-58 - Environmental testing - Part 2–58: Tests - Test EN 60068-2-58 -
Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering
heat of surface mounting devices (SMD)
IEC 60068-2-67 - Environmental testing - Part 2–67: Tests - Test EN 60068-2-67 -
Cy: Damp heat, steady-state, accelerated test
primarily intended for components
IEC 60068-2-78 - Environmental testing - Part 2–78: Tests - Test EN 60068-2-78 -
Cab: Damp heat, steady-state
IEC 60068-2-82 2019 Environmental testing - Part 2–82: Tests - Test EN IEC 60068-2-82 2019
Xw1: Whisker test methods for components and
parts used in electronic assemblies
IEC 60195 2016 Method of measurement of current noise EN 60195 2016
generated in fixed resistors
IEC 60286 series Packaging of components for automatic EN 60286 series
handling
IEC 60294 - Measurement of the dimensions of a cylindrical EN 60294 -
component with axial terminations
IEC 60440 2012 Method of measurement of nonlinearity in EN 60440 2012
resistors
IEC 60617-DB - Graphical symbols for diagrams - -
IEC 60695-11-5 - Fire hazard testing - Part 11–5: Test flames - EN 60695-11-5 -
Needle-flame test method - Apparatus,
confirmatory test arrangement and guidance
IEC 61191 series Printed board assemblies EN IEC 61191 series
IEC 61193-2 - Quality assessment systems - Part 2: Selection EN 61193-2 -
and use of sampling plans for inspection of
electronic components and packages
IEC 61340-3-1 - Electrostatics - Part 3–1: Methods for simulation EN 61340-3-1 -
of electrostatic effects - Human body model
(HBM) electrostatic discharge test waveforms
IEC 61760-1 - Surface mounting technology - Part 1: Standard EN IEC 61760-1 -
method for the specification of surface
mounting components (SMDs)
IEC 61760-2 - Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of
surface mounting devices (SMD) - Application
guide
12
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
Publication Year Title EN/HD Year
IEC 62090 - Product package labels for electronic - -
components using bar code and two-
dimensional symbologies
IEC 62812 2019 Low resistance measurements - Methods and EN IEC 62812 2019
guidance
IEC 80000 series Quantities and units EN 80000 series
IECQ 03-1 2020 IEC Quality Assessment System for Electronic - -
Components (IECQ System) – Rules of
procedure – Part 1: General Requirements for
all IECQ Schemes
ISO 80000 series Quantities and units EN ISO 80000 series
IECQ 03-3 2018 IEC Quality Assessment System for Electronic - -
Components (IECQ System) – Rules of
Procedure – Part 3: IECQ Approved
Component Products, Related Materials and
Assemblies Scheme
IECQ 03-3-1 2018 IEC Quality Assessment System for Electronic - -
Components (IECQ System) – Rules of
Procedure – Part 3–1: IECQ Approved
Component Products, Related Materials and
Assemblies Scheme, IECQ Approved
Component – Technology Certification (IECQ
AC-TC)
“
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
12 Addition of a new Annex ZX
Add the following new Annex ZX:
“
Annex ZX
(informative)
Cross-references for references to the prior revision of this document
The revision of this generic specification has resulted in changes of the clause and annex numbering, the figure
numbering and the table numbering. The following Table ZX.1 provides cross-references for all references to
specific clauses or annexes of the prior revision of this generic specification.
Table ZX.1 — Cross-references for references to clauses
EN 60115-1:2011
EN 60115-1:2021
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
1 — The former Clause 1 is split into Clauses 1 and 2:
1.1 1 — Scope
1.2 2 — Normative references
2 — The former Clause 2 is split into Clauses 3 and 4.
2.1 4.1
2.2 3.1
2.3 4.2
4.4
2.4
4.5
2.5 4.3
2.6 4.8
2.7 4.9
2.8 4.10
13
3
Annex Q
4 — The former Clause 4 is split into Clauses 5 to 12.
4.1 5.1
4.2 5.2
4.3 5.4
4.4 — The former Clause 4.4 is split into 9.1 to 9.3:
4.4.1 9.1 — Visual examination;
4.4.2 9.2 — Dimensions (Gauging);
4.4.3 9.3 — Dimensions (Detail)
4.5 — The former Clause 4.5 is split into 5.6 and 6.1:
4.5.1 5.6 — general method of resistance measurement;
4.5.2 6.1 — test for resistance and tolerance.
4.6 12.1
4.7 12.2
14
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
EN 60115-1:2011
EN 60115-1:2021
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
The title is changed to: Temperature coefficient of
4.8 6.2
resistance
4.9 6.3 The title is changed to: Inductance
4.10 6.5
4.11 6.4
4.12 6.6
4.13 8.1 The title is changed to: Short-term overload
4.14 6.7
4.15 9.4
4.16 — The former Clause 4.16 is split into 9.5 and 9.6 for:
4.16.2 9.5.4.2 — tensile test, e.g. for wire terminations;
4.16.3 9.5.4.3 — bending test, e.g. for wire terminations;
4.16.4 9.5.4.4 — torsion test, e.g. for wire terminations;
4.16.5 9.6.4 — resistors with threaded stud or screw terminations.
4.17 11.1 Solderability test for:
4.17.2 a) 11.1.4.4 — resistors for through-hole assembly;
4.17.2 b) 11.1.4.5 — resistors not for assembly on circuit boards;
4.17.2 c) 11.1.4.3 — SMD resistors.
4.18 11.2 Resistance to soldering heat test for:
4.18.2 a) 11.2.4.4 — resistors for through-hole assembly;
4.18.2 b) 11.2.4.5 — resistors not for assembly on circuit boards;
4.18.2 c) 11.2.4.3 — SMD resistors.
4.19 10.1
4.20 9.9
4.21 9.10
4.22 9.11
4.23 10.3
4.24 10.4
4.25 — Endurance tests are given in Clause 7:
4.25.1 7.1 — Endurance at the rated temperature 70 °C;
4.25.2 7.2 — Endurance at room temperature;
4.25.3 7.3 — Endurance at a maximum temperature (e.g. UCT).
4.26 12.3
4.27 8.2
4.28 8.3
4.29
11.3 The solvent resistance tests are merged into 11.3.
4.30
4.31 5.5.2
4.32 9.7
4.33 9.8
15
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
EN 60115-1:2011
EN 60115-1:2021
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
4.34 10.6 The corrosion test employs a different test method.
4.35 12.4
4.36 10.2
4.37 10.5
4.38 8.5
This legacy test is presented only with a traditionally
4.39 8.4
applied severity.
4.40 10.7
4.41 10.8
— — EN 60115-1:2011 does not contain Annexes A, D, E
Annex B Annex B
Annex C — The content of this Annex is merged into 8.3.
Annex F Annex A
Annex G — The overview on tests is given in the table of contents.
Annex Q Annex Q
Annex ZA Annex C
Annex ZR Annex R
Annex ZX Annex ZX
Table ZX.2 provides cross-references for all references to specific figures of the prior revision of this generic
specification.
Table ZX.2 — Cross-references for references to figures
EN 60115-1:2011
EN 60115-1:2020
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
Figure 1 Figure 25 The designation is changed to: Parallel clamp fixture
Figure 2 Figure 26 The designation is changed to: V-clamp fixture
Figure 3 Figure 9
Figure 4 Figure 10
Figure 5 Figure 19
Figure 6 Figure 12
Figure 7 Figure 13
Figure 8 Figure 14
Figure 9 Figure 15
Figure 10 Figure 27
Figure 11 Figure 17
Figure 12 Figure 18
Figure C.1
— The subject is covered in 8.3.4.1.
Figure C.2
16
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EN 60115-1:2023 (E)
Table ZX.3 provides cross-references for all references to specific tables of the prior revision of this generic
specification.
Table ZX.3 — Cross reference for references to tables
EN 60115-1:2011
EN 60115-1:2020
+ EN 60115-1:2011/A11:2015
Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
Table 1 Table 2
Table 2 Table 9
Table 3
— The subject is covered in 6.2.5.
Table 4
Table 5 Table 13
Table 6 Table 14
Table 7 Table 20
Table 8 Table 11
Table 9 Table 12
Table 10 — The subject is covered in 8.4.4.
Table ZR.1 Table R.1
Table ZR.2 Table R.2
Table ZR.3 Table R.3
Table ZR.4 Table R.4
“
17
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SIST EN 60115-1:2023
EN 60115-1:2023 (E)
13 Modification of the Bibliography
Replace the Bibliography as follows:
EN 60060-1, High-voltage test techniques - Part 1: General definitions and test requirements
EN 60068-2-11, Environmental testing - Part 2: Tests - Test Ka: Salt mist
1)
EN 60068-2-29 , Environmental testing. Part 2: Tests. Test Eb and guidance: Bump (IEC 60068-2-29)
EN 60068-2-69, Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic
components and printed boards by the wetting balance (force measurement) method
EN IEC 60068-3-5, Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation
of the performance of temperature chambers
EN 60068-3-13, Environmental testing - Part 3-13: Supporting documentation and guidance on Test T -
Soldering
EN IEC 60721-3-1, Classification of environmental conditions - Part 3-1: Classification of groups of
environmental parameters and their severities - Storage
EN IEC 60721-3-2, Classification of environmental conditions - Part 3-2: Classification of groups of
environmental parameters and their severities - Transportation and Handling
EN IEC 60749-26, Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic
discharge (ESD) sensitivity testing - Human body model (HBM)
EN 61000-4-5:2014, Electromagnetic compatibility (EMC) - Part 4-5: Testing and measurement techniques -
Surge immunity test
EN IEC 61190-1-3, Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
EN 61249-2-22, Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base
materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of
defined flammability (vertical burning test), copper-clad
EN 61249-2-35, Materials for printed boards and other interconnecting structures - Part
...
SLOVENSKI STANDARD
oSIST prEN 60115-1:2021
01-januar-2021
Fiksni upori za elektronsko opremo - 1. del: Splošna specifikacija
Fixed resistors for use in electronic equipment - Part 1: Generic specification
Festwiderstände zur Verwendung in Geräten der Elektronik - Teil 1:
Fachgrundspezifikation
Résistances fixes utilisées dans les équipements électroniques - Partie 1: Spécification
générique
Ta slovenski standard je istoveten z: prEN 60115-1
ICS:
31.040.10 Fiksni upor Fixed resistors
oSIST prEN 60115-1:2021 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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oSIST prEN 60115-1:2021
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oSIST prEN 60115-1:2021
EUROPEAN STANDARD DRAFT
prEN 60115-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2020
ICS 31.040.10 Will supersede EN 60115-1:2011 and all of its
amendments and corrigenda (if any)
English Version
Fixed resistors for use in electronic equipment - Part 1: Generic
specification
(IEC 60115-1:2020 , modified)
Résistances fixes utilisées dans les équipements Festwiderstände zur Verwendung in Geräten der Elektronik
électroniques - Partie 1: Spécification générique - Teil 1: Fachgrundspezifikation
(IEC 60115-1:2020 , modifiée) (IEC 60115-1:2020 , modifiziert)
This draft European Standard is submitted to CENELEC members for enquiry.
Deadline for CENELEC: 2021-02-12.
The text of this draft consists of the text of IEC 60115-1:2020 (40/2662(F)/CDV).
If this draft becomes a European Standard, CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
This draft European Standard was established by CENELEC in three official versions (English, French, German).
A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
the CEN-CENELEC Management Centre has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.
Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Project: 69910 Ref. No. prEN 60115-1 E
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oSIST prEN 60115-1:2021
prEN 60115-1:2020 (E)
Contents
European foreword . 3
1 Modification to the Introduction . 5
2 Modification to Clause 1 . 5
3 Modification to Clause 2 . 5
4 Modification to Annex B . 5
5 Modification of Annex C . 7
6 Modification of Annex Q .10
7 Modification of Annex R .10
8 Modification of Annex X .10
9 Addition of a new Annex ZA .11
10 Addition of a new Annex ZX .14
11 Modification of the Bibliography .19
Bibliography .20
2
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prEN 60115-1:2020 (E)
European foreword
This document (prEN 60115-1:2020) consists of the text of IEC 60115-1:2020 prepared by IEC/TC 40,
“Capacitors and resistors for electronic equipment”, together with the common modifications prepared
by the CLC TC/40XB, “Resistors”.
This document is currently submitted to the enquiry.
The following dates are proposed:
• latest date by which the existence of this document (doa) dor + 6 months
has to be announced at national level
• latest date by which this document has to be (dop) dor + 12 months
implemented at national level by publication of an
identical national standard or by endorsement
• latest date by which the national standards (dow) dor + 36 months
conflicting with this document have to be withdrawn (to be confirmed or
modified when voting)
This document will supersede EN 60115-1:2011 + A11:2015.
Clauses, subclauses, annexes, notes, tables and figures which are additional to those in
IEC 60115-1:2020 are prefixed “Z”.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Preceding documents on the subject covered by this specification have been:
— EN 60115-1:2001 + A1:2001 + A11:2007
— EN 140000:1993-12
— CECC 40 000:1973-00, 1979-00.
This edition contains the following significant technical changes with respect to the previous edition:
a) this edition employs a new document structure, where the tests of prior Clause 4 are given in
Clauses 6 to 12 now, with an informative Annex ZX providing cross-references for references
to the prior revision of this standard;
b) the terms and definitions have been revised and amended, supplemented by a new section on
resistor technologies and a new section on product classification levels;
c) a new Subclause 4.7 on recommendations for permissible substitutions has been added;
d) the provisions for packaging, storage and transportation in Subclauses 4.8, 4.9 and 4.10 have
been completely revised;
e) a new Subclause 5.3 on default tolerances for the most common test parameters has been
added;
f) the generic method of measuring resistance, now Sublause 5.6, has been separated from the
test for compliance with a prescribed resistance value in 6.1, as a revision of the prior 4.5;
3
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prEN 60115-1:2020 (E)
g) the test for the temperature coefficient of resistance of Subclause 6.2 is a revision of the prior
test 4.8, variation of resistance with temperature, where the special concessions for resistors
below 10 Ω have been waived;
h) the single-pulse high-voltage overload test of Subclause 8.2 (prior 4.27) has been completely
revised;
i) the periodic-pulse high-voltage overload test of Subclause 8.3 (prior 4.28) has been revised and
a corrected table of severities provided;
j) the period-pulse overload test of Subclause 8.4 (prior 4.39) has been deprecated and
streamlined to only offer the severity historically applied in subordinate specifications;
k) the Subclauses 9.1 on visual inspection, 9.2 on the gauging of dimensions, and 9.3 on the
assessment of detail dimensions (all parts of prior 4.4) have been completely revised;
l) the tests for robustness of terminations (prior 4.16) have been revised and separated into tests
for the robustness of solderable terminations, Subclause 9.5, and tests for the robustness of
threaded stud or screw terminations, Subclause 9.6;
m) the bump test of Subclause 9.9 (prior 4.20) and the shock test of Subclause 9.10 (prior 4.21)
have been revised to reflect the merged relevant test standard EN 60068-2-29;
n) the accelerated damp heat, steady-state test of Subclause 10.5 (prior 4.37) has been amended
with an option for a reduced number of bias voltages;
o) the corrosion test of Subclause 10.6 has been completely revised in order to employ the better
suitable test method of EN 60068-2-52 instead of the prior used EN 60068-2-11;
p) the whisker growth test of 10.7 has been revised to reflect the changes of the new revision of
the test methods of EN IEC 60068-2-82;
q) the test methods for solderability of Subclause 11.1 (prior 4.17) and for resistance to soldering
heat of Subclause 11.2 (prior 4.18) have been completely revised to incorporate the necessary
option for the variety of lead-bearing and lead-free solder alloys and respective process
conditions;
r) the solvent resistance test of 11.3 combines the prior tests 4.29, component solvent resistance,
and 4.30, solvent resistance of marking, in one test;
s) the accidental overload test of Subclause 12.3 (prior 4.26) has been completely revised.
4
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prEN 60115-1:2020 (E)
1 Modification to the Introduction
The introduction shall be amended with the insertion of a new paragraph after the existing first
paragraph:
The explanation given in this introduction uses IEC documents as examples. Anyhow, the same
principles apply in unison to respective documents with EN or EN IEC prefix.
2 Modification to Clause 1
The first paragraph of the scope shall be modified to read:
This part of EN 60115 is a generic specification and is applicable to fixed resistors for use in electronic
equipment.
3 Modification to Clause 2
In the clause on normative references, insert the following new paragraph after the existing first
paragraph:
The readers of this European Standard are advised of the corresponding European documents listed in
the normative Annex ZA, which take precedence over the International Standards listed in this Clause.
This precedence also applies to all informative and normative references made within this document.
4 Modification to Annex B
The rules for the preparation of detail specifications for resistors and capacitors for electronic equipment
for use within the IECQ system, provided in Annex B, shall be modified as presented on the next page:
5
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prEN 60115-1:2020 (E)
Annex B
(normative)
Rules for the preparation of detail specifications for resistors
and capacitors for electronic equipment for use within the IECQ system
B.1 The drafting of a complete detail specification, in line with the ruling of the CEN/CENELEC Internal
Regulations, shall begin only when all the following conditions have been met:
a) the generic specification has been approved;
b) the sectional specification, if appropriate, has been circulated for approval according to the relevant
system rules (e.g. FDIS, or unanimously approved CDV, at IEC);
c) the associated blank detail specification has been circulated for approval according to the relevant
system rules (e.g. FDIS, or unanimously approved CDV, at IEC);
B.2 Detail specifications shall use the standard or preferred values, ratings and characteristics, and
severities for environmental tests, etc. which are given in the appropriate generic or sectional
specifications.
An exception to this rule may only be granted for a specified detail specification, if agreed by the
technical committee.
B.3 The detail specification should not be circulated for approval according to the relevant system
rules (e.g. FDIS, or unanimously approved CDV, at IEC) until the sectional and blank detail
specifications have been approved for publication.
6
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5 Modification of Annex C
The example of a test record provided in Annex C shall be modified as presented on the following pages:
7
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oSIST prEN 60115-1:2021
prEN 60115-1:2020 (E)
Annex C
(informative)
Example of a certified test record
Component manufacturer Veriohm Ltd.
Place of manufacture Amper Lane 8, Voltville
Detail specification and issue EN 140401-808:2021
Description of component Fixed low power film surface mount (SMD) resistors,
Rectangular
Current three months period 2021–01–01 – 2021–03–31
This Certified Test Record is a completed and accurate record of the tests carried out in accordance
with the specified procedures.
Manufacturer
Designated Management Representative (T. Rustworthy)
IECQ Certification Body
Supervising Inspector (S. Crutiny)
8
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9
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prEN 60115-1:2020 (E)
6 Modification of Annex Q
The header of this annex shall be changed from informative to normative:
Annex Q
(normative)
Quality assessment procedures
7 Modification of Annex R
The header of this annex shall be changed from informative to normative:
Annex R
(normative)
Failure rate level evaluation, determination and qualification
8 Modification of Annex X
The contents of this annex shall be replaced by the following information:
This annex, providing cross references for references to IEC 60115-1:2008, has been deleted from this
document. In lieu thereof, see Annex ZX, which is providing cross references for references to
EN 60115-1:2011 and A11:2015.
10
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prEN 60115-1:2020 (E)
9 Addition of a new Annex ZA
A new Annex ZA shall be inserted to provide normative information on European publications
corresponding to IEC publications referenced in the text of this specification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60027 series Letters symbols to be used in electrical - series
technology - Part 1: General
IEC 60050 series International electrotechnical vocabulary – - series
Chapter 00: General index
IEC 60062 - Marking codes for resistors and capacitors EN 60062 -
IEC 60063 - Preferred number series for resistors and EN 60063 -
capacitors
IEC 60068-1 2013 Environmental testing - Part 1: General and EN 60068-1 2014
guidance
IEC 60068-2-1 - Environmental testing - Part 2–1: Tests - EN 60068-2-1 -
Test A: Cold
IEC 60068-2-2 - Environmental testing - Part 2–2: Tests - EN 60068-2-2 -
Test B: Dry heat
IEC 60068-2-6 - Environmental testing - Part 2–6: Tests - EN 60068-2-6 -
Test Fc: Vibration (sinusoidal)
IEC 60068-2-13 - Environmental testing - Part 2–13: Tests - EN 60068-2-13 -
Test M: Low air pressure
IEC 60068-2-14 - Environmental testing - Part 2–14: Tests - EN 60068-2-14 -
Test N: Change of temperature
IEC 60068-2-20 2008 Environmental testing - Part 2–20: Tests - EN 60068-2-20 2008
Test T: Test methods for solderability and
resistance to soldering heat of devices with
leads
IEC 60068-2-21 2006 Environmental testing - Part 2–21: Tests - EN 60068-2-21 2006
Test U: Robustness of terminations and
integral mounting devices
IEC 60068-2-27 2008 Environmental testing - Part 2–27: Tests - EN 60068-2-27 2009
Test Ea and guidance: Shock
IEC 60068-2-30 - Environmental testing - Part 2–30: Tests - EN 60068-2-30 -
Test Db: Damp heat, cyclic (12 h + 12 h
cycle)
IEC 60068-2-45 1980 Basic environmental testing procedures - EN 60068-2-45 1992
AMD 1 1993 Part 2–45: Tests - Test XA and guidance: A1 1993
Immersion in cleaning solvents
11
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IEC 60068-2-47 - Environmental testing - Part 2–47: Test - EN 60068-2-47 -
Mounting of specimens for vibration, impact
and similar dynamic tests
IEC 60068-2-52 - Environmental testing - Part 2–52: Test – EN -
Test Kb: Salt mist, cyclic (sodium chloride IEC 60068-2-52
solution)
IEC 60068-2-58 - Environmental testing - Part 2–58: Tests - EN 60068-2-58 -
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
IEC 60068-2-67 - Environmental testing - Part 2–67: Tests - EN 60068-2-67 -
Test Cy: Damp heat, steady-state,
accelerated test primarily intended for
components
IEC 60068-2-78 - Environmental testing - Part 2–78: Tests - EN 60068-2-78 -
Test Cab: Damp heat, steady-state
IEC 60068-2-82 2019 Environmental testing - Part 2–82: Tests - EN 2019
Test Xw1: Whisker test methods for IEC 60068-2-82
components and parts used in electronic
assemblies
IEC 60195 2016 Method of measurement of current noise EN 60195 2016
generated in fixed resistors
IEC 60286 series Packaging of components for automatic EN 60286 series
handling - Part 1: Tape packaging of
components with axial leads on continuous
tapes
IEC 60294 - Measurement of the dimensions of a EN 60294 -
cylindrical component with axial
terminations
IEC 60440 2012 Method of measurement of nonlinearity in EN 60440 2012
resistors
IEC 60617-DB - Graphical symbols for diagrams - -
IEC 60695-11-5 - Fire hazard testing - Part 11–5: Test flames EN 60695-11-5 -
- Needle-flame test method - Apparatus,
confirmatory test arrangement and
guidance
IEC 61191 series Printed board assemblies - Part 1: Generic EN IEC 61191 series
specification - Requirements for soldered
electrical and electronic assemblies using
surface mount and related assembly
technologies
IEC 61193-2 - Quality assessment systems - Part 2: EN 61193-2 -
Selection and use of sampling plans for
inspection of electronic components and
packages
IEC 61340-3-1 - Electrostatics - Part 3–1: Methods for EN 61340-3-1 -
simulation of electrostatic effects - Human
body model (HBM) electrostatic discharge
test waveforms
IEC 61760-1 - Surface mounting technology - Part 1: EN IEC 61760-1 -
Standard method for the specification of
surface mounting components (SMDs)
IEC 61760-2 - Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of
surface mounting devices (SMD) -
Application guide
12
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prEN 60115-1:2020 (E)
IEC 62090 - Product package labels for electronic - -
components using bar code and two-
dimensional symbologies
IEC 62812 2019 Low resistance measurements - Methods EN IEC 62812 2019
and guidance
IEC 80000 series Quantities and units - Part 13: Information EN 80000 series
science and technology
ISO 80000 series Quantities and units – Part 1: General EN ISO 80000 series
IECQ 03-1 2018 IEC Quality Assessment System for - -
Electronic Components (IECQ System) –
Rules of procedure – Part 1: General
Requirements for all IECQ Schemes
13
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10 Addition of a new Annex ZX
A new Annex ZX shall be inserted to provide informative cross references for references to clauses,
figures or tables of the prior revision of this specification, EN 60115-1:2011 and A11:2015, as presented
on the following pages.
14
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prEN 60115-1:2020 (E)
Annex ZX
(informative)
Cross-references for references to the prior revision of this document
The revision of this generic specification has resulted in changes of the clause and annex numbering,
the figure numbering and the table numbering. The following Table ZX.1 provides cross-references for
all references to specific clauses or annexes of the prior revision of this generic specification.
Table ZX.1 – Cross-references for references to clauses
EN 60115-1:2011 EN 60115-1:2021
+A11:2015 Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
1 — The former Clause 1 is split into Clauses 1 and 2:
1.1 1 — Scope
1.2 2 — Normative references
2 — The former Clause 2 is split into Clauses 3 and 4.
2.1 4.1
2.2 3.1
2.3 4.2
4.4
2.4
4.5
2.5 4.3
2.6 4.8
2.7 4.9
2.8 4.10
13
3
Annex Q
4 — The former Clause 4 is split into Clauses 5 to 12.
4.1 5.1
4.2 5.2
4.3 5.4
4.4 — The former Clause 4.4 is split into 9.1 to 9.3:
4.4.1 9.1 — Visual examination;
4.4.2 9.2 — Dimensions (Gauging);
4.4.3 9.3 — Dimensions (Detail)
4.5 — The former Clause 4.5 is split into 5.6 and 6.1:
4.5.1 5.6 — general method of resistance measurement;
4.5.2 6.1 — test for resistance and tolerance.
4.6 12.1
4.7 12.2
The title is changed to: Temperature coefficient of
4.8 6.2
resistance
4.9 6.3 The title is changed to: Inductance
4.10 6.5
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4.11 6.4
4.12 6.6
4.13 8.1 The title is changed to: Short-term overload
4.14 6.7
4.15 9.4
4.16 — The former Clause 4.16 is split into 9.5 and 9.6 for:
4.16.2 9.5.4.2 — tensile test, e.g. for wire terminations;
4.16.3 9.5.4.3 — bending test, e.g. for wire terminations;
4.16.4 9.5.4.4 — torsion test, e.g. for wire terminations;
4.16.5 9.6.4 — resistors with threaded stud or screw terminations.
4.17 11.1 Solderability test for:
4.17.2 a) 11.1.4.4 — resistors for through-hole assembly;
4.17.2 b) 11.1.4.5 — resistors not for assembly on circuit boards;
4.17.2 c) 11.1.4.3 — SMD resistors.
4.18 11.2 Resistance to soldering heat test for:
4.18.2 a) 11.2.4.4 — resistors for through-hole assembly;
4.18.2 b) 11.2.4.5 — resistors not for assembly on circuit boards;
4.18.2 c) 11.2.4.3 — SMD resistors.
4.19 10.1
4.20 9.9
4.21 9.10
4.22 9.11
4.23 10.3
4.24 10.4
4.25 — Endurance tests are given in Clause 7:
4.25.1 7.1 — Endurance at the rated temperature 70 °C;
4.25.2 7.2 — Endurance at room temperature;
4.25.3 7.3 — Endurance at a maximum temperature (e.g. UCT).
4.26 12.3
4.27 8.2
4.28 8.3
4.29
11.3 The solvent resistance tests are merged into 11.3.
4.30
4.31 5.5.2
4.32 9.7
4.33 9.8
4.34 10.6 The corrosion test employs a different test method.
4.35 12.4
4.36 10.2
4.37 10.5
4.38 8.5
This legacy test is presented only with a traditionally
4.39 8.4
applied severity.
4.40 10.7
4.41 10.8
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oSIST prEN 60115-1:2021
prEN 60115-1:2020 (E)
— — EN 60115-1:2011 does not contain Annexes A, D, E
Annex B Annex B
Annex C — The content of this Annex is merged into 8.3.
Annex F Annex A
Annex G — The overview on tests is given in the table of contents.
Annex Q Annex Q
Annex ZA Annex C
Annex ZR Annex R
Annex ZX Annex ZX
Table ZX.2 provides cross-references for all references to specific figures of the prior revision of this
generic specification.
Table ZX.2 – Cross-references for references to figures
EN 60115-1:2011 EN 60115-1:2020
+A11:2015 Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
Figure 1 Figure 25 The designation is changed to: Parallel clamp fixture
Figure 2 Figure 26 The designation is changed to: V-clamp fixture
Figure 3 Figure 9
Figure 4 Figure 10
Figure 5 Figure 19
Figure 6 Figure 12
Figure 7 Figure 13
Figure 8 Figure 14
Figure 9 Figure 15
Figure 10 Figure 27
Figure 11 Figure 17
Figure 12 Figure 18
Figure C.1
— The subject is covered in 8.3.4.1.
Figure C.2
17
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oSIST prEN 60115-1:2021
prEN 60115-1:2020 (E)
Table ZX.3 provides cross-references for all references to specific tables of the prior revision of this
generic specification.
Table ZX.3 – Cross reference for references to tables
EN 60115-1:2011 EN 60115-1:2020
+A11:2015 Notes
(IEC 60115-1:2008, mod.) (IEC 60115-1:2020, mod.)
Table 1 Table 2
Table 2 Table 9
Table 3
— The subject is covered in 6.2.5.
Table 4
Table 5 Table 13
Table 6 Table 14
Table 7 Table 20
Table 8 Table 11
Table 9 Table 12
Table 10 — The subject is covered in 8.4.4.
Table ZR.1 Table R.1
Table ZR.2 Table R.2
Table ZR.3 Table R.3
Table ZR.4 Table R.4
18
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oSIST prEN 60115-1:2021
prEN 60115-1:2020 (E)
11 Modification of the Bibliography
The Bibliography shall be modified for presentation of European Standards, where applicable, as
presented on the following pages.
19
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oSIST prEN 60115-1:2021
prEN 60115-1:2020 (E)
Bibliography
EN 60060-1, High-voltage test techniques - Part 1: General definitions and test requirements
EN 60068-2-11, Environmental testing - Part 2: Tests - Test Ka: Salt mist
EN 60068-2-29, Environmental testing. Part 2: Tests. Test Eb and guidance: Bump
1)
(IEC 60068-2-29)
EN 60068-2-69, Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of
electronic components and printed boards by the wetting balance (force measurement) method
EN IEC 60068-3-5, Environmental testing - Part 3-5: Supporting documentation and guidance -
Confirmation of the performance of temperature chambers
EN 60068-3-13, Environmental testing - Part 3-13: Supporting documentation and guidance on Test T
- Soldering
EN IEC 60721-3-1, Classification of environmental conditions - Part 3-1: Classification of groups of
environmental parameters and their severities - Storage
EN IEC 60721-3-2, Classification of environmental conditions - Part 3-2: Classification of groups of
environmental parameters and their severities - Transportation and Handling
EN IEC 60749-26, Semiconductor devices - Mechanical and climatic test methods - Part 26:
Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
EN 61000-4-5:2014, Electromagnetic compatibility (EMC) - Part 4-5: Testing and measurement
techniques - Surge immunity test
EN IEC 61190-1-3, Attachment materials for electronic assembly - Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering
applications
EN 61249-2-22, Materials for printed boards and other interconnecting structures - Part 2-22:
Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass
laminated sheets of defined flammability (vertical burning test), copper-clad
EN 61249-2-35, Materials for printed boards and other interconnecting structures - Part 2-35:
Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of
defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC/TR 60068-3-12, Environmental testing - Part 3-12: Supporting documentation and guidance -
Method to evaluate a possible lead-free solder reflow temperature profile
2)
IEC 60410, Sampling plans and procedures for inspection by attributes
IEC CA 01, IEC Conformity Assessment Systems – Basic Rules
1)
EN 60068-2-29:1993 has been withdrawn as its contents has been merged into EN 60068-2-27:2009
2)
IEC 60410:1973 has been withdrawn in 2015.
20
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oSIST prEN 60115-1:2021
prEN 60115-1:2020 (E)
IEC QC 001002-3, IEC Quality Assessment System for Electronic Components (IECQ) - Rules of
3)
Procedure - Part 3: Approval procedures
, 4)
IECQ 01 IEC Quality Assessment System for Electronic Components (IECQ System) – Basic Rules
IECQ 01-S, IEC Quality Assessment System for Electronic Components (IECQ System) – IECQ
Supplement to Harmonized Basic Rules IEC CA 01
IECQ 03-3, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
Procedure – Part 3: IECQ Approved Component Products, Related Materials & Assemblies Scheme
IECQ 03-3-1, IEC Quality Assessment System for Electronic Components (IECQ System) – Rules of
Procedure – Part 3-1: IECQ Approved Component Products, Related Materials & Assemblies
Scheme, IECQ Approved Component – Technology Certification (IECQ AC-TC)
EN ISO 9001, Quality management systems - Requirements (ISO 9001:2015)
ISO 3, Preferred numbers — Series of preferred numbers
ISO 17, Guide to the use of preferred numbers and of series of preferred numbers
ISO 497,
...
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